ASP-DAC 2000 Highlights



Keynote Addresses


Wednesday, January 26,Time : 9:30 - 10:30,Room : 503
The Impact of Communications Convergence on Silicon Integrated Circuits
Shojiro Asai
Corporate Officer and President, Research & Development Group, Hitachi Ltd., Japan

Thursday, January 27,Time : 9:00 - 10:00,Room : 503
Research, Design, and Fabrication - Brain Power, Tool Power, and Electric Power
C. L. Liu
President, National Tsing Hua Univ., Hsin-Chu, Taiwan

Friday, January 28,Time : 9:00 - 10:00,Room : 503
Design Challenges in Multi-GHz Microprocessors
Bill Herrick
Director, Alpha Microprocessor Development, Compaq Computer Corp., USA

Special Sessions


Wednesday, January 26,Time : 10:45 - 12:15,Room : 503
EDA Vendor Executive Panel :
Can We Rely on EDA Vendors for the Next Generation Design Technologies?
Organizer : Kenji Yoshida
Toshiba Corp., Japan
Moderator : Ron Collett
Collett International, Inc., USA
Panelists : Aart de Geus
Synopsys, Inc., USA
Shane Robison
Cadence Design Systems, Inc. USA
Wally Rhinse
Mentor Graphics Corp., USA
Jinya Katsube
Zuken Inc., Japan
Penny Herscher
Simplex, Inc., USA
Guido Arnout
CoWare, Inc., USA


Wednesday, January 26,Time : 13:30 - 15:30,Room : 502
Session A1 : (Special Session) University LSI Design Contest
Chair : Ryota Kasai
NTT, Japan
Co-Chair :Anantha Chandrakasan
MIT, USA


Wednesday, January 26,Time : 16:00 - 18:00,Room : 411/412
Session A2 : (Special Session) CAD for Embedded Systems
Chair : Miodrag Potkonjak
Univ. of California, Los Angeles, USA

A2.1 "Offline Program Re-mapping to Improve Branch Prediction Efficiency in Embedded Systems"
Stephen S. Brown, Jeet Asher, William H. Mangione-Smith
Univ. of California, Los Angeles, USA
A2.2 "Timing Driven Co-design of Networked Embedded Systems"
Dinesh Ramanathan, Ravindra Jejurikar, Rajesh K. Gupta
Univ. of California, Irvine, USA
A2.3 "Low-power Design Methodology and Applications utilizing Dual Supply Voltages"
Kimiyoshi Usami, Mutsunori Igarashi
Toshiba Corp., Japan
A2.4 "Co-Synthesis with custom ASICs"
Yuan Xie, Wayne Wolf
Princeton University, USA


Wednesday, January 26,Time : 16:00 - 18:00,Room : 413
Session E2 : (Special Session) System-In-Package (SIP)
Chair : Wayne W.-M. Dai
Univ. of California, Santa Cruz, USA

E2.1 "System-In-Package (SIP) : Challenges and Opportunities"
King L. Tai
Bell Laboratories, Lucent Technologies, USA
E2.2 "Taiwan Foundary for System-In-Package (SIP)"
Albert Lin
APack, Inc., Taiwan
E2.3 "Integration of Large-Scale FPGA and DRAM in a Package Using Chip-On-Chip Technology"
Michael X. Wang, Katsuharu Suzuki, Wayne W.-M. Dai
Univ. of California, Santa Cruz, USA
Yee L. Low, Kevin J. O'conner, King L. Tai
Bell Laboratories, Lucent Technology, USA
E2.4 "Modeling and Analysis of Integrated Spiral Inductors for RF System-In-Package (SIP)"
Minqing Liu, Wayne W.-M. Dai
Univ. of California, Santa Cruz, USA


Thursday, January 27,Time : 13:30 - 15:30,Room : 433/434
Session D4 : (Panel Discussion) Timing Closure : The Solution and Its Problems
Organizer : Ralph H.J.M. Otten
Delft University of Technology, The Netherlands
Moderator : Ralph H.J.M. Otten
Delft University of Technology, The Netherlands
Panelists : Raul Camposano
Synopsys, Inc., USA
Oliver Coudert
Monterey Design Systems, Inc., USA
Patrick Groeneveld
Magma Design Automation, USA
Leon Stok
Thomas J. Watson Research Center, IBM, USA


Friday, January 28,Time : 13:30 - 15:30,Room : 501
Session B7 : (Special Session) Future of System Level Design Languages
Chair : Masaharu Imai
Osaka Univ., Japan

B7.1 "SLDL and Rosetta"
Steven Schulz
Texas Instruments, Inc., USA
B7.2 "SystemC Standard"
Guido Arnout
Co-Ware, Inc., USA
B7.3 "Java based object oriented hardware specification and synthesis"
Tommy Kuhn, Wolfgang Rosenstiel
Univ. of Tuebingen, Germany
B7.4 "Superlog, A Unified Design Language for System-on-chip"
Peter Flake, Simon J. Davidmann
Co-Design Automation, Inc., USA


Friday, January 28,Time : 13:30 - 15:30,Room : 433/434
Session D7 : (Panel Discussion) Industry-Academia Cooperation
Organizer : Tokinori Kozawa
STARC, Japan
Moderator : Hiroto Yasuura
Kyushu Univ., Japan
Panelists : Ivo Bolson
IMEC, Belgium
Yuon-Long Lin
National Tsing Hua Univ., Taiwan
Toshiaki Masuhara
Hitachi Ltd., Japan
Jan Rabaey
Univ. of California, Berkeley, USA
Leon Stok
Thomas J. Watson Research Center, IBM, USA


Friday, January 28,Time : 16:00 - 17:30,Room : 501
Session B8 : (Panel Discussion) One Language or More? (How Can We Design an SoC at a System Level?)
Organizer : Masaharu Imai
Osaka Univ., Japan
Moderator : Gary Smith
Dataquest, USA
Panelists : Steven Schulz [SLDL]
Texas Instruments, Inc., USA
Karen Bartleson [SystemC]
Synopsys, Inc., USA
Daniel D. Gajski [SpecC]
Univ. of Calfornia, Irvine, USA
Wolfgang Rosenstiel [Java]
Univ. of Tuebingen, Germany
Peter Flake [Superlog]
Co-Design Automation, Inc., USA
Hiroto Yasuura [C/C++]
Kyushu Univ., Japan
Masaharu Imai [VHDL]
Osaka Univ., Japan


Embedded Tutorials and Invited Talks


Wednesday, January 26,Time: 13:30 - 14:00,Room: 501
B1.1 "Essential Issues for IP Reuse"
Daniel D. Gajski
Univ. of California, Irvine, USA
Viraphol Chaiyakul
Y Explorations Inc., USA
Allen C.-H. Wu
Tsing Hua University, Taiwan
Shojiro Mori
Toshiba Corp., Japan
Tom Nukiyama
NEC Corp., Japan
Larry Rosenberg
VSIA, USA


Wednesday, January 26,Time: 16:00 - 17:00,Room: 431/432
C2.1 "Synthesis Challenges for Next-Generation High-Performance and High-Density PLDs"
Jason Cong
Univ. of California, Los Angeles, USA
Songjie Xu
Aplus Design Technologies, Inc., USA


Thursday, January 27,Time: 11:30 - 12:00,Room: 413
E3.3 "Subwavelength Lithography Technologies (PSM, OPC)"
Tsuneo Terasawa
Hitachi Ltd., Japan


Thursday, January 27,Time: 13:30 - 14:30,Room: 411/412
A4.1 "IC Design Technology for Building System-On-A-Chip"
Rajesh Gupta
Univ. of California, Irvine, USA


Thursday, January 27,Time: 14:30 - 15:30,Room: 501
B4.3 "Reconfigurable Computing: Its Concept and a Practical Embodiment using Newly Developed Dynamically Reconfigurable Logic (DRL) LSI"
Masakazu Yamashina, Masato Motomura
NEC Corp., Japan


Thursday, January 27,Time: 14:30 - 15:30,Room: 413
E4.3 "Design for Manufacturability"
Andrzej J. Strojwas
Carnegie Mellon Univ., USA


Thursday, January 27,Time: 16:00 - 17:00,Room: 411/412
A5.1 "Low-Power Silicon Architectures for Wireless Communications"
Jan Rabaey
Univ. of California, Berkeley, USA


Thursday, January 27,Time: 16:00 - 17:00,Room: 501
B5.1 "Multilanguage System Design"
Rolf Ernst
Technical University Braunschweig, Germany
Ahmed A. Jerraya
TIMA Laboratory, France


Friday, January 28,Time: 11:00 - 11:30,Room: 431/432
C6.2 "Fault models and test generation for IDDQ Testing"
Yoshinobu Higami
Ehime Univ., Japan
Kewal K. Saluja
Univ. of Wisconsin
Yuzo Takamatsu
Ehime Univ., Japan
Kozo Kinoshita
Osaka Univ., Japan


Friday, January 28,Time: 11:30 - 12:00,Room: 431/432
C6.3 "Issues on SOC Testing in DSM Era"
Takashi Aikyo
Fujitsu Ltd., Japan


Friday, January 28,Time: 13:30 - 14:30,Room: 411/412
A7.1 "Design Challenges for 0.1um and Beyond"
Takayasu Sakurai
Univ. of Tokyo, Japan


Friday, January 28,Time: 14:30 - 15:30,Room: 413
E7.3 "Substrate Crosstalk Analysis in Mixed Signal CMOS Integrated Circuits"
Makoto Nagata, Atsushi Iwata
Hiroshima Univ., Japan


Friday, January 28,Time: 16:00 - 16:30,Room: 411/412
A8.1 "Importance of CAD Tools and Methodology in High Speed CPU Design"
Haruyuki Tago, Kazuhiro Hashimoto, Nobuyuki Ikumi, Masato Nagamatsu
Toshiba Corp., Japan
Yasuyuki Yamamoto, Masakazu Suzuoki
Sony Computer Entertainment, Japan