| Title | Model Based Layout Pattern Dependent Metal Filling Algorithm for Improved Chip Surface Uniformity in the Copper Process |
| Author | *Subarna Sinha, Jianfeng Luo, Charles Chiang (Synopsys, United States) |
| Page | pp. 1 - 6 |
| Detailed information (abstract, keywords, etc) | |
| Title | Fast and Accurate OPC for Standard-Cell Layouts |
| Author | *David M. Pawlowski, Liang Deng, Martin D. F. Wong (Univ. of Illinois, Urbana-Champaign, United States) |
| Page | pp. 7 - 12 |
| Detailed information (abstract, keywords, etc) | |
| Title | Coupling-aware Dummy Metal Insertion for Lithography |
| Author | *Liang Deng (Univ. of Illinois, Urbana-Champaign, United States), Kaiyuan Chao (Intel Co., United States), Hua Xiang (IBM, United States), Martin D. F. Wong (Univ. of Illinois, Urbana-Champaign, United States) |
| Page | pp. 13 - 18 |
| Detailed information (abstract, keywords, etc) | |
| Title | Fast Buffer Insertion for Yield Optimization under Process Variations |
| Author | Ruiming Chen, *Hai Zhou (Northwestern Univ., United States) |
| Page | pp. 19 - 24 |
| Detailed information (abstract, keywords, etc) | |
| Title | A Global Minimum Clock Distribution Network Augmentation Algorithm for Guaranteed Clock Skew Yield |
| Author | *Bao Liu, Andrew Kahng, Xu Xu (Univ. of California, San Diego, United States), Jiang Hu, Ganesh Venkataraman (Texas A&M Univ., United States) |
| Page | pp. 25 - 31 |
| Detailed information (abstract, keywords, etc) | |