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The 14th Asia and South Pacific Design Automation Conference

Session 5D  Designers' Forum: Consumer SoC
Time: 13:30 - 15:35 Wednesday, January 21, 2009
Location: Room 416+417
Chair: Yoshio Masubuchi (Toshiba Corporation, Japan)

5D-1 (Time: 13:30 - 14:10)
Title(Invited Paper) Development of Full-HD Multi-standard Video CODEC IP Based on Heterogeneous Multiprocessor Architecture
Author*Hiroaki Nakata, Koji Hosogi, Masakazu Ehama, Takafumi Yuasa, Toru Fujihira (Hitachi, Ltd., Japan), Kenichi Iwata, Motoki Kimura, Fumitaka Izuhara, Seiji Mochizuki, Masaki Nobori (Renesas Technology Corp., Japan)
Pagepp. 528 - 534
KeywordCODEC, video, full-HD, H.264, VC-1
AbstractTo support numerous video codec standards and full-HD videos on different consumer devices, a multi-standard CODEC IP based on a heterogeneous multiprocessor architecture was developed. Operation-specific processors were designed in regards to two types of processing: stream processing and pixel processing. The CODEC also uses effectively several dedicated circuits. To design the CODEC, we developed a C-language model to check our design. The CODEC can process full-HD videos formatted in H.264, MPEG-2, MPEG-4, and VC-1 at 162 MHz operating frequency.
Slides

5D-2 (Time: 14:10 - 14:50)
Title(Invited Paper) A 65nm Dual-mode Baseband and Multimedia Application Processor SoC with Advanced Power and Memory Management
Author*Tatsuya Kamei, Tetsuhiro Yamada, Takao Koike, Masayuki Ito, Takahiro Irita, Kenichi Nitta, Toshihiro Hattori, Shinichi Yoshioka (Renesas Technology Corp., Japan)
Pagepp. 535 - 539
Keywordapplication processor, mobile phone, low power, multi-media, MMU
AbstractA Dual-mode baseband (W-CDMA/HSDPA and GSM/GPRS/EDGE) and multimedia application processor SoC is described. The SoC fabricated in triple-Vth 65nm CMOS has 3 CPU cores and 20 separate power domains to achieve both high performance and low power. The SoC adopts the Partial Clock Activation scheme that reduces power by 42% for long-time music replay. The IP-MMU is introduced to reduce maximum memory footprint by 43MB, sharing external memory among CPUs and HW-IPs using virtual address space that enables reuse of physically fragmented memory.
Slides

5D-3 (Time: 14:50 - 15:30)
Title(Invited Paper) UniPhier: Series Development and SoC Management
Author*Yoshito Nishimichi, Nobuo Higaki, Masataka Osaka, Seiji Horii, Hisato Yoshida (Panasonic Corp., Japan)
Pagepp. 540 - 545
Keywordplatform, SoC, UniPhier
AbstractA digital CE integrated platform “UniPhier” (Universal Platform for High-quality Image Enhancing Revolution) has been developed to accelerate sharing technology and design assets across product categories from mobile phones to home-use AV. On the integrated platform, it’s easy to use software and hardware assets that allows reusing across product categories, and great enhance of digital CE products has been realized. In this paper, an overview of the integrated platform “UniPhier” and it’s SoC (System on a Chip) application examples are described.