| Title | (Invited Paper) (Tutorial) Is 3D Integration an Opportunity or Just a Hype? |
| Author | *Jin-Fu Li (National Central University/Industrial Technology Research Institute, Taiwan), Cheng-Wen Wu (Tsing-Hua University, Taiwan) |
| Page | pp. 541 - 543 |
| Keyword | 3D Integration, through silicon via, test, design, VLSI |
| Abstract | Three-dimensional (3D) integration using through silicon via (TSV) is an emerging technology for integrated circuit designs. 3D integration technology provides numerous opportunities to designers looking for more cost-effective system chip solutions. In addition to stacking homogeneous memory dies, 3D integration technology supports heterogeneous integration of memories, logic, sensors, etc. It eases the interconnect performance limitation, provides higher functionality, results in small form factor, etc. On the other hand, there are challenges that should be overcome before volume production of TSV-based 3D ICs becomes possible, e.g., technological challenges, yield and test challenges, thermal and power challenges, infrastructure challenges, etc. |
| Slides |
| Title | (Panel Discussion) (Panel) Is 3D Integration an Opportunity or Just a Hype? |
| Author | Organizers & Moderators: Cheng-Wen Wu (National Tsing Hua University/Industrial Technology Research Institute, Taiwan), Jin-Fu Li (National Central University/Industrial Technology Research Institute, Taiwan), Panelists: Albert Li (GUC, Taiwan), Erik Jan Marinissen (IMEC, Belgium), Ding-Ming Kwai (Industrial Technology Research Institute, Taiwan), Kyu-Myung Choi (Samsung, Republic of Korea), Makoto Takahashi (Toshiba, Japan) |
| Page | pp. 544 - 547 |
| Keyword | 3D Integration, through silicon via, test, design |
| Abstract | Three-dimensional (3D) integration using through silicon via (TSV) is an emerging technology for integrated circuit designs. 3D integration technology provides numerous opportunities to designers looking for more cost-effective system chip solutions. In addition to stacking homogeneous memory dies, 3D integration technology supports heterogeneous integration of memories, logic, sensors, etc. It eases the interconnect performance limitation, provides higher functionality, results in small form factor, etc. On the other hand, there are challenges that should be overcome before volume production of TSV-based 3D ICs becomes possible, e.g., technological challenges, yield and test challenges, thermal and power challenges, infrastructure challenges, etc. |