| Title | (Panel Discussion) Advanced Packaging and 3D Technologies |
| Author | Organizer: Yoshio Masubuchi (Toshiba, Japan), Moderator: Kenichi Osada (Hitachi, Japan), Panelists: Geert Van der Plas (IMEC, Belgium), Hirokazu Ezawa (Toshiba, Japan), Yasumitsu Orii (IBM, Japan), Yoichi Hiruta (J-Devices, Japan), Chris Cheung (Cadence Design Systems, U.S.A.) |
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