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The 17th Asia and South Pacific Design Automation Conference

Session 3C  Yield and Manufacturability Enhancement
Time: 10:40 - 12:20 Wednesday, February 1, 2012
Location: Room 202
Chairs: Zheng Shi (Zhejiang Univ., China), Charles H.-P. Wen (National Chiao Tung Univ., Taiwan)

3C-1 (Time: 10:40 - 11:05)
TitleEPIC: Efficient Prediction of IC Manufacturing Hotspots With A Unified Meta-Classification Formulation
AuthorDuo Ding, Bei Yu, Joydeep Ghosh, *David Z. Pan (Univ. of Texas, Austin, U.S.A.)
Pagepp. 263 - 270
Detailed information (abstract, keywords, etc)

3C-2 (Time: 11:05 - 11:30)
TitleGNOMO: Greater-than-NOMinal Vdd Operation for BTI Mitigation
Author*Saket Gupta, Sachin Sapatnekar (Univ. of Minnesota, U.S.A.)
Pagepp. 271 - 276
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3C-3 (Time: 11:30 - 11:55)
TitleTier-Adaptive-Voltage-Scaling (TAVS): A Methodology for Post-Silicon Tuning of 3D ICs
AuthorKwanyeob Chae, *Saibal Mukhopadhyay (Georgia Tech, U.S.A.)
Pagepp. 277 - 282
Detailed information (abstract, keywords, etc)

3C-4 (Time: 11:55 - 12:20)
TitleBody Bias Clustering for Low Test-Cost Post-Silicon Tuning
AuthorShuta Kimura, *Masanori Hashimoto, Takao Onoye (Osaka Univ., Japan)
Pagepp. 283 - 289
Detailed information (abstract, keywords, etc)