Title | (Invited Paper) Yield Enhancement for 3D-Stacked ICs: Recent Advances and Challenges |
Author | *Qiang Xu, Li Jiang (Chinese Univ. of Hong Kong, Hong Kong), Huiyun Li (Shenzhen Institutes of Advanced Technology, China), Bill Eklow (Cisco Systems, U.S.A.) |
Page | pp. 731 - 737 |
Detailed information (abstract, keywords, etc) |
Title | (Invited Paper) Yield-Aware Time-Efficient Testing and Self-fixing Design for TSV-Based 3D ICs |
Author | *Jing Xie, Yu Wang, Yuan Xie (Pennsylvania State Univ., U.S.A.) |
Page | pp. 738 - 743 |
Detailed information (abstract, keywords, etc) |
Title | (Invited Paper) On Test and Repair of 3D Random Access Memory |
Author | Cheng-Wen Wu (National Tsing Hua Univ., Taiwan), *Shyue-Kun Lu (National Taiwan Univ. of Science and Tech., Taiwan), Jin-Fu Li (National Central Univ., Taiwan) |
Page | pp. 744 - 749 |
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Title | (Invited Paper) Design for Manufacturability and Reliability for TSV-based 3D-ICs |
Author | *David Z. Pan (Univ. of Texas, Austin, U.S.A.), Sung Kyu Lim, Krit Athikulwongse, Moongon Jung (Georgia Tech, U.S.A.), Joydeep Mitra, Jiwoo Pak (Univ. of Texas, Austin, U.S.A.), Mohit Pathak (Georgia Tech, U.S.A.), Jae-seok Yang (Univ. of Texas, Austin, U.S.A.) |
Page | pp. 750 - 755 |
Detailed information (abstract, keywords, etc) |