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The 17th Asia and South Pacific Design Automation Conference

Session S9  Special Session 9: Quality Assurance for 3D-Stacked ICs
Time: 16:10 - 17:50 Thursday, February 2, 2012
Location: Room 204A
Chair: Tai-Chen Chen (National Central Univ., Taiwan)

S9-1 (Time: 16:10 - 16:35)
Title(Invited Paper) Yield Enhancement for 3D-Stacked ICs: Recent Advances and Challenges
Author*Qiang Xu, Li Jiang (Chinese Univ. of Hong Kong, Hong Kong), Huiyun Li (Shenzhen Institutes of Advanced Technology, China), Bill Eklow (Cisco Systems, U.S.A.)
Pagepp. 731 - 737
Detailed information (abstract, keywords, etc)

S9-2 (Time: 16:35 - 17:00)
Title(Invited Paper) Yield-Aware Time-Efficient Testing and Self-fixing Design for TSV-Based 3D ICs
Author*Jing Xie, Yu Wang, Yuan Xie (Pennsylvania State Univ., U.S.A.)
Pagepp. 738 - 743
Detailed information (abstract, keywords, etc)

S9-3 (Time: 17:00 - 17:25)
Title(Invited Paper) On Test and Repair of 3D Random Access Memory
AuthorCheng-Wen Wu (National Tsing Hua Univ., Taiwan), *Shyue-Kun Lu (National Taiwan Univ. of Science and Tech., Taiwan), Jin-Fu Li (National Central Univ., Taiwan)
Pagepp. 744 - 749
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S9-4 (Time: 17:25 - 17:50)
Title(Invited Paper) Design for Manufacturability and Reliability for TSV-based 3D-ICs
Author*David Z. Pan (Univ. of Texas, Austin, U.S.A.), Sung Kyu Lim, Krit Athikulwongse, Moongon Jung (Georgia Tech, U.S.A.), Joydeep Mitra, Jiwoo Pak (Univ. of Texas, Austin, U.S.A.), Mohit Pathak (Georgia Tech, U.S.A.), Jae-seok Yang (Univ. of Texas, Austin, U.S.A.)
Pagepp. 750 - 755
Detailed information (abstract, keywords, etc)