| Title | Thermal Simulator of 3D-IC with Modeling of Anisotropic TSV Conductance and Microchannel Entrance Effects |
| Author | Hanhua Qian, Hao Liang, Chip-Hong Chang, Wei Zhang, *Hao Yu (Nanyang Technological Univ., Singapore) |
| Page | pp. 485 - 490 |
| Detailed information (abstract, keywords, etc) | |
| Slides | |
| Title | A Novel Cell Placement Algorithm for Flexible TFT Circuit with Mechanical Strain and Temperature Consideration |
| Author | *Juin-Li Lin, Po-Hsun Wu, Tsung-Yi Ho (National Cheng Kung Univ., Taiwan) |
| Page | pp. 491 - 496 |
| Detailed information (abstract, keywords, etc) | |
| Slides | |
| Title | Improving Energy Efficiency for Energy Harvesting Embedded Systems |
| Author | Yang Ge, Yukan Zhang, *Qinru Qiu (Syracuse Univ., U.S.A.) |
| Page | pp. 497 - 502 |
| Detailed information (abstract, keywords, etc) | |
| Title | Modeling Variability and Irreproducibility of Nanoelectronic Resistive Switches for Circuit Simulation |
| Author | *Arne Heittmann, Tobias G. Noll (RWTH Aachen Univ., Germany) |
| Page | pp. 503 - 508 |
| Detailed information (abstract, keywords, etc) | |