Title | Analytical Placement of Mixed-Size Circuits for Better Detailed-Routability |
Author | Shuai Li, *Cheng-Kok Koh (Purdue Univ., U.S.A.) |
Page | pp. 41 - 46 |
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Title | Lithographic Defect Aware Placement Using Compact Standard Cells Without Inter-Cell Margin |
Author | *Seongbo Shim, Yoojong Lee, Youngsoo Shin (KAIST, Republic of Korea) |
Page | pp. 47 - 52 |
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Title | Structural Planning of 3D-IC Interconnects by Block Alignment |
Author | *Johann Knechtel (Dresden Univ. of Tech., Germany), Evangeline F. Y. Young (Chinese Univ. of Hong Kong, Hong Kong), Jens Lienig (Dresden Univ. of Tech., Germany) |
Page | pp. 53 - 60 |
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Title | Comprehensive Die-Level Assessment of Design Rules and Layouts |
Author | Rani Ghaida (GLOBALFOUNDRIES, U.S.A.), Yasmine Badr (Univ. of California, Los Angeles, U.S.A.), Mukul Gupta (Qualcomm, U.S.A.), Ning Jin (GLOBALFOUNDRIES, U.S.A.), *Puneet Gupta (Univ. of California, Los Angeles, U.S.A.) |
Page | pp. 61 - 66 |
Detailed information (abstract, keywords, etc) | |
Slides |