| Title | (Invited Paper) Systems Modeling for Additional Development in Automotive E/E Architecture |
| Author | *Hidekazu Nishimura (Keio University, Japan) |
| Page | pp. 408 - 409 |
| Keyword | Car Electronics, System Modeling |
| Abstract | Systems modeling in automotive electrical and electronic (E/E) architecture is described according to systems engineering process. The purpose of my presentation is to show the importance of system architecture using SysML (Systems Modeling Language). Access and protection system is treated as an example designed in additional development based on the new requirements such as “user friendliness” and “omotenashi”. It is shown that model-based systems engineering is effective and useful to obtain system architecture. |
| Title | (Invited Paper) Implementation and Evaluation of Image Recognition Algorithm for An Intelligent Vehicle using Heterogeneous Multi-Core SoC |
| Author | *Nau Ozaki, Masato Uchiyama, Yasuki Tanabe, Shuichi Miyazaki, Takaaki Sawada, Takanori Tamai, Moriyasu Banno (Toshiba Corp., Japan) |
| Page | pp. 410 - 415 |
| Keyword | Car Electronics, Image Recognition |
| Abstract | Image recognition algorithm is becoming one of the most important technology for intelligent vehicle application such as Advanced Driver Assistance Systems (ADAS), however its computational costs are still considerably high. To realize such applications using image recognition algorithm as hard real-time task with low power consumption, we have developed heterogeneous multi-core SoC specialized for image recognition [1]. Subsequently, several image recognition applications have been developed using this SoC. In this paper, we address two ADAS applications and image recognition algorithms for them, and evaluate them on the SoC. The results of the evaluation show that the SoC allows these applications to run with significantly low power consumption comparing with general purpose CPU. |
| Title | (Invited Paper) Trend in Power Devices for Electric and Hybrid Electric Vehicles |
| Author | *Khalid Hussein, Akira Fujita, Katsumi Sato (Mitsubishi Electric Corp., Japan) |
| Page | p. 416 |
| Keyword | Car Electronics, Power Devices |
| Abstract | Since the very successful release of the world’s first mass-produced HEV (hybrid electric vehicle) in 1997, the number of HEVs as well as EVs (electric vehicles) has been gradually increasing in major cities around the world. Reliable and efficient power devices transferring energy between the battery and the motor/generator represent the heart of the electric power-train that realizes the electric-mobility concept. The objective of this presentation is to give a quick preview of the early mass-produced power modules for EV/HEVs and to highlight the advancement achieved so far in addressing the automotive severe reliability and high performance requirements. The presentation will also cover some of the power devices trends in terms of the major pillars comprising automotive power modules: (1) power chip technology, (2) packaging technology, and (3) functional integration. |