Technical Program Committee
Technical Program Chair
Naehyuck Chang (KAIST, Korea)
Technical Program Vice Chairs
TingTing Hwang (National Tsing Hua University, Taiwan)
Yasuhiro Takashima (University of Kitakyushu, Japan)
Secretaries
Hyung Gyu Lee (Daegu University, Korea)
Subcommittees
* : subcommittee chairs
- [1] System-Level Modeling and Design Methodologies
- * Soonhoi Ha (Seoul National University, Korea)
- Ing-Jer Huang (National Sun Yat-Sen University, Taiwan)
- Yosinori Watanebe (Cadence Design Systems, USA)
- Hoeseok Yang (Ajou University, Korea)
- Makoto Sugihara (Kyushu University, Japan)
- Akash Kumar (National University of Singapore, Singapore)
- Fan Dongrui (Chinese Academy of Sciences, China)
- Ing-Jer Huang (National Sun Yat-Sen University, Taiwan)
- [2] Embedded System Architectures and Design
- * Tulika Mitra (National University of Singapore, Singapore)
- Hiroyuki Tomiyama (Ritsumeikan University, Japan)
- Muhammad Shafique (Karlsruhe Institute of Technology, Germany)
- Wei Zhang (Hong Kong University of Science and Technology, Hong Kong)
- Guangyu Sun (Peking University, China)
- Preeti Ranjan Panda (IIT Delhi, India)
- Dongkun Shin (Sungkyunkwan University, Korea)
- Hiroyuki Tomiyama (Ritsumeikan University, Japan)
- [3] On-chip Communication and Networks-on-Chips
- * Mehdi Tahoori (Karlsruhe Institute of technology, Germany)
- Jiang XU (Hong Kong University of Science and Technology, Hong Kong)
- Romain Lemaire (CEA-LETI, France)
- Koushik Chakraborty (Utah State University, USA)
- Yoshinori Takeuchi (Osaka University, Japan)
- Masoud Daneshtalab (University of Turku, Finland)
- Jiang XU (Hong Kong University of Science and Technology, Hong Kong)
- [4] System-on-Chip Architectures and Design
- * Sri Parameswaran (University of New South Wales, Australia)
- Paul Bogdon (University of Southern California, USA)
- Angelo Ambrose (University of New South Wales, Australia)
- Lars Bauer (Karlsruhe Institute of Technology, Germany)
- Paul Bogdon (University of Southern California, USA)
- [5] Device/Circuit-Level Modeling, Simulation and Verification
- * Luca Daniel (Massachusetts Institute of Technology, USA)
- Jaijeet Roychowdhury (University of California at Berkeley, USA)
- Wenjian Yu (Tsinghua University., China)
- Ibrahim (Abe) Elfadel (Masdar University, United Arab Emirates)
- Dipanjan Gope (Indian Institute of Science, India)
- Roberto Suaya (Univ. Tecn. Nacion. Buenos Aires, Argentina)
- Jaijeet Roychowdhury (University of California at Berkeley, USA)
- [6] Logic/Behavioral/High-Level Synthesis and Optimizations
- * Robert Wille (University of Bremen, Germany)
- Zhiru Zhang (Cornell University, USA)
- Anupam Chattopadhyay (RWTH Aachen University, Germany)
- Iris Hui-Ru Jiang (National Chiao Tung University, China)
- Mineo Kaneko (JAIST, Japan)
- Thambipillai Srikanthan (Nanyang Technological University, Singapore)
- Zhiru Zhang (Cornell University, USA)
- [7] Analog, RF and Mixed Signals
- * Sheldon Tan (University of California, Riverside, USA)
- Guoyong Shi (Shanghai Jiatong University, China)
- Hai Wang (University of Electronic Science and Technology of China, China)
- Mark Lin (National Chung Cheng University, Taiwan)
- Zuochang Ye (Tsinghua University, China)
- Guoyong Shi (Shanghai Jiatong University, China)
- [8] System-Level Power and Thermal Management
- * Chia-Lin Yang (National Taiwan University, Taiwan)
- Jae-Joon Kim (Posetech, Korea)
- Danella Zhao (University of Louisiana at Lafayette, USA)
- Takashi Nakada (University of Tokyo, Japan)
- Guihai Yan (ICT , China)
- Donghwa Shin (Yeungnam University, Korea)
- Yu Wang (Tsinghua University, China)
- Jae-Joon Kim (Posetech, Korea)
- [9] Device/Circuit/Gate-Level Low Power Design
- * Masanori Hashimoto (Osaka University, Japan)
- Kimiyoshi Usami (Shibaura Institute of Technology, Japan)
- Yiyu Shi (Missouri University of Science and Technology, USA)
- Bing Li (Technical University of Munich, Germany)
- Bong Hyun Lee (Samsung, Korea)
- Kimiyoshi Usami (Shibaura Institute of Technology, Japan)
- [10] Embedded Software
- * Jason Xue (City University of Hong Kong, China)
- Zili Shao (Hong Kong Polytechnic University, Hong Kong)
- Chengmo Yang (University of Delaware, USA)
- kyoungwoo Lee (Yonsei University, Korea)
- Nan Guan (Northeastern University, China)
- Sidharta Andalam (TUM, Singapore)
- Qi Zhu (University of California at Riverside, USA)
- Zili Shao (Hong Kong Polytechnic University, Hong Kong)
- [11] Physical Design
- * David Z. Pan (University of Texas, Austin, USA)
- Ting-Chi Wang (National Tsing Hua University, Taiwan)
- Guojie Luo (Peking University, China)
- Shigetoshi Nakatake (Univ. of Kitakyushu, Korea)
- Tung-Chieh Chen (Synopsys, USA)
- Yongchan (James) Ban (LG Electronics, Korea)
- Ting-Chi Wang (National Tsing Hua University, Taiwan)
- [12] Timing and Signal/Power Integrity
- * Hao Yu (Nanyang Technological University, Singapore)
- Fan Yang (Fudan University, China)
- Ray Cheung (City University of Hong Kong, Hong Kong)
- Yungseon Eo (Hanyang University, Korea)
- Fan Yang (Fudan University, China)
- [13] Design for Manufacturability and Reliability
- * Evangeline Young (Chinese University at Hong Kong, China)
- Xuan Zeng (Fudan University, China)
- Shigeki Nojima (Toshiba Corporation, Japan)
- Martin Wong (University of Illinois at Urbana-Champaign, USA)
- Jae-seok Yang (Samsung, Korea)
- Charles Chiang (Synopsys, USA)
- Zhuo Feng (Michigan Technological University, USA)
- Xuan Zeng (Fudan University, China)
- [14] Test and Design for Testability
- * Tomokazu Yoneda (NAIST, Japan)
- Yu Huang (Mentor Graphics, USA)
- Kohei Miyase (Kyushu Institute of Technology, Japan)
- Sungho Kang (Yonsei University, Korea)
- Chien-Mo Li (National Taiwan University, Taiwan)
- Yu Huang (Mentor Graphics, USA)
- [15] Security and Fault-Tolerant Systems
- * Swarup Bhunia (Case Western Reserve University, USA)
- Jongsun Park (Korea University, Korea)
- Patrick Schaumont (Virginia Tech., USA)
- Kenneth Mai (Carnegie Mellon University, USA)
- Yongdae Kim (KAIST, Korea)
- Jongsun Park (Korea University, Korea)
- [16] Emerging Technologies
- * Yiran Chen (University of Pittsburgh, USA)
- Jingtong Hu (Oklahoma State University, USA)
- Weisheng Zhao (Universite Paris-Sud, France)
- Duo Liu (Chongqing University, China)
- Danghui Wang (Northwestern Polytechnical University, China)
- Jingtong Hu (Oklahoma State University, USA)
- [17] Emerging Applications I (Bio+nano+3D+quantum)
- * Tsung-Yi Ho (National Cheng Kung University, Taiwan)
- Juinn-Dar Huang (National Chiao Tung University, Taiwan)
- Dajiang Zhou (Waseda University, Japan)
- Yasushi Sugama (Fujitsu, Japan)
- Juinn-Dar Huang (National Chiao Tung University, Taiwan)
- [18] Emerging Applications II (Energy+EV+IoT+Smart grid+ Data center)
- * Tohru Ishihara (Kyoto University, Japan)
- Ittetsu Taniguchi (Ritsumeikan University, Japan)
- Sehwan (Paul) Kim (Dankook University, Korea)
- Yongpan Liu (Tsinghua University, China)
- Ittetsu Taniguchi (Ritsumeikan University, Japan)