Technical Program Committee

Technical Program Chair

David Z. Pan (University of Texas at Austin, USA)

Technical Program Vice Chairs

Atsushi Takahashi (Tokyo Institute of Technology, Japan)

Tohru Ishihara (Kyoto University, Japan)

Secretaries

Zili Shao (Hong Kong Polytechnic University, Hong Kong)

Jason Xue (City University of Hong Kong, Hong Kong)

Bei Yu (The Chinese University of Hong Kong, Hong Kong)

Wei Zhang (Hong Kong University of Science and Technology, Hong Kong)

Shimpei Sato (Tokyo Institute of Technology, Japan)

Subcommittees

* : subcommittee chairs
[1] System-Level Modeling and Design Methodology
* Soonhoi Ha (Seoul National University, Korea)
Hoeseok Yang (Ajou University, Korea)
Preeti Ranjan Panda (IIT Delhi, India)
Jing-Jia Liou (National Tsing Hua University, Taiwan)
Liang Shi (Chongqing University, China)
Sungchan Kim (Chonbuk National University, Korea)
Qi Zhu (UC Riverside, USA)
Masashi Tawada (Waseda University, Japan)
Ing-Jer Huang (National Sun Yat-sen University, Taiwan)
[2] Embedded System Architecture and Design
* Wei Zhang (Hong Kong University of Science and Technology, Hong Kong)
Hyung Gyu Lee (Daegu University, Korea)
Yaoyao Ye (Shanghai Jiao Tong University, China)
Weichen Liu (Chongqing University, China)
Eric Liang (Peking University, China)
Lars Bauer (Karlsruhe Institute of Technology, Germany)
Ha Yajun (Institute for Infocomm Research, Astar, Singapore)
Chun-Yi Lee (National Tsing Hua University, Taiwan)
Chengmo Yang (University of Delaware, USA)
Yongpan Liu (Tsinghua University, China)
Ji-Hoon Kim (Seoul National University of Science and Technology, Korea)
Wujie Wen (Florida International University, USA)
Yuan Xie (UC Santa Barbara, USA)
[3] On-chip Communication and Networks-on-Chip
*Mehdi Tahoori (Karlsruhe Institute of Technology, Germany)
Yi-Jung Chen (National Tsing Hua University, Taiwan)
Yoshinori Takeuchi (Osaka University, Japan)
Romain Lemaire (CEA-LETI, France)
Koushik Chakraborty (Utah State University, USA)
[4] Embedded Software
*Zili Shao (Hong Kong Polytechnic University, Hong Kong)
Chung-Ta King (National Tsing Hua University, Taiwan)
Sungjoo Yoo (Seoul National University, Korea)
Jalil Boukhobza (University of Western Brittany, France)
Jingtong HU (Oklahoma State University, USA)
Yuko Hara-Azumi (Tokyo Institute of Technology, Japan)
[5] Device/Circuit-Level Modeling, Simulation and Verification
*Jaijeet Roychowdhury (UC Berkeley, USA)
Alper Demir (Koc University, Turkey)
Rajit Manohar (Cornell University, USA)
Jason Verley (Sandia National Laboratory, USA)
Soumyajit Mandal (Case Western Reserve University,USA)
[6] Analog, RF and Mixed Signal
*Ibrahim (Abe) Elfadel (Masdar Institute of Science and Technology, United Arab Emirates)
Quan Chen (University of Hong Kong, Hong Kong)
Zuochang Ye (Tsinghua University, China)
Zhuo Feng (Michigan Technical University, USA)
Markus Olbrich (University of Hannover, Germany)
[7] Cross-layer Power Analysis, Low Power Design, and Thermal Management
*Chia-Lin Yang (National Taiwan University, Taiwan)
Guihai Yan (Chinese Academy of Sciences, China)
Donghwa Shin (Yeungnam University, Korea)
Yu Wang (Tsinghua University, China)
Koji Inoue (Kyushu University, Japan)
Zhuo Cheng (Zhejiang University, China)
Jae-Joon Kim (Pohang University of Science and Technology, Korea)
Tsung-Te Liu (National Taiwan University, Taiwan)
Masaaki Kondo (University of Tokyo, Japan)
Dongrui Fan (Chinese Academy of Sciences, China)
Li Shang (University of Colorado, USA)
[8] Logic/Behavioral/High-Level Synthesis and Optimization
*Zhiru Zhang (Cornell University, USA)
Anupam Chattopadhyay (Nanyang Technological University, Singapore)
Fabrizio Ferrandi (Politecnico di Milano, Italy)
Benjamin Carrion Schafer (Hong Kong Polytechnic University, Hong Kong)
Seiya Shibata (NEC Corp., Japan)
Shouyi Yin (Tsinghua University, China)
[9] Physical Design
*Taewhan Kim (Seoul National University, Korea)
Seokhyeong Kang (Ulsan National Institute of Science and Technology, Korea)
Hyung-Ock Kim (Samsung Electronics, Korea)
Wai Kei Mak (National Tsing Hua University, Taiwan)
Tung-Chieh Chen (Synopsys, Taiwan)
Sheqin Dong (Tsinghua University, China)
Yasuhiro Takashima (University of Kitakyushu, Japan)
Masato Inagi (Hiroshima City University, Japan)
[10] Design for Manufacturability and Reliability
*Xuan Zeng (Fudan University, China)
Hai Zhou (Northwestern University, USA)
Yukihida Kohira (Aizu University, Japan)
Shao-Yun Fang (National Taiwan University, Taiwan)
Evangeline Young (The Chinese University of Hong Kong, Hong Kong)
Ting-Chi Wang (National Tsing Hua University, Taiwan)
Tetsuaki Matsunawa (Toshiba, Japan)
[11] Timing and Signal/Power Integrity
*Masanori Hashimoto (Osaka University, Japan)
Takashi Sato (Kyoto University, Japan)
Bong Hyun Lee (Samsung, Korea)
Ngai Wong (University of Hong Kong, Hong Kong)
Guoyong Shi (Shanghai Jiao Tong University, China)
[12] Test and Design for Testability
*Jin-Fu Li (National Central University, Taiwan)
Huaguo Liang (Hefei University of Technology, China)
Satoshi Ohtake (Oita University, Japan)
Kohei Miyase (Kyushu Institute of Technology, Japan)
Hua-Wei Li (Chinese Academy of Sciences, China)
[13] Security and Fault-Tolerant System
*Yier Jin (University of Central Florida, USA)
Chip Hong Chang (Nanyang Technological University, Korea)
Jakub Szefer (Yale University, USA)
Fareena Saqib (Florida Institute of Technology, USA)
Qiang Xu (The Chinese University of Hong Kong, Hong Kong)
Xiaoxiao Wang (Beihang University, China)
Ahmad-Reza Sadeghi (TU-Darmstadt, Germany)
Kang Li (Cyber Immunity Inc., USA)
[14] Emerging Technology
*Yiran Chen (University of Pittsburgh, USA)
Danghui Wang (Northwestern Polytechnical University, USA)
Shigeru Yamashita (Ritsumeikan University, Japan)
Weisheng Zhao (Beihang University, China)
Duo Liu (Chongqing University, China)
Yuan-Hao Chang (Academia Sinica, Taiwan)
Jongeun Lee (Ulsan National Institute of Science and Technology, Korea)
[15] Emerging Application
*Tohru Ishihara (Kyoto University, Japan)
Ittetsu Taniguchi (Ritsumeikan University, Japan)
Yasushi Sugama (Fujitsu, Japan)
Hailong Yao (Tsinghua University, China)
Younghyun Kim (University of Wisconsin–Madison, USA)
Juinn-Dar Huang (National Chiao Tung University, Taiwan)
Xiaojun Guo (Shanghai Jiao Tong University, China)

Last Updated on: 9 30, 2016