Technical Program Committee

Technical Program Chair

Taewhan Kim (Seoul National University, Korea)

Technical Program Vice Chairs

Tsung-Yi Ho (National Tsing Hua University, Taiwan)

Masanori Hashimoto (Osaka University, Japan)

Secretaries

Yuan-Hao Chang (Academia Sinica, Taiwan)

Chien-Chung Ho (National Chung Cheng University, Taiwan)

Ji-Hoon Kim (Ewha Womans University, Korea)

Subcommittees

* : subcommittee chairs
[1] System-Level Modeling and Design Methodology
*Sri Parameswaran (University of New South Wales, Australia)
Akash Kumar (Technische Universitaet Dresden, Germany)
Jongeun Lee (UNIST, Korea)
Naehyuck Chang ( KAIST, Korea)
Hiroshi Nakamura (University of Tokyo, Japan)
Keni Qiu (Capital Normal University, China)
Muhammad Shafique (TU Vienna, Austria)
Kiseok Chung (Hanyang University, Korea)
[2] Embedded System Architecture and Design
*Wujie Wen (Florida International University, USA)
Xue Lin (Northeastern University, USA)
Raymond (Ruirui) Huang (Alibaba Cloud, Seattle, USA)
Hsiang-Yun Cheng (Academia Sinica, Taiwan)
Jaehyun Park (University of Ulsan, Korea)
Wanli Chang (University of York, UK)
Yongpan Liu (Tsinghua University, China)
Lei Jiang (Indiana University Bloomingto, USA)
Xiang Chen (George Mason University, USA)
Guangyu Sun (Peking University, China)
[3] On-chip Communication and Networks-on-Chip
*Jiang Xu (Hong Kong University of Science and Technology, Hong Kong)
Keiji Kimura (Waseda University, Japan)
Yaoyao Ye (Shanghai Jiao Tong University, China)
John Kim (KAIST, Korea)
Bing Li (Technical University of Munich, German)
Lide Duan (University of Texas at San Antonio, USA)
[4] Embedded Software
*Franco Fummi (University of Verona, Italy)
Yi Wang (Shenzhen University, China)
Mengying Zhao (Shenzhen University, China)
Jalil Boukhobza (University of Western Brittany, France)
Hiren Patel (University of Waterloo, Canada)
Sudipta Chattopadhyay (Singapore University of Technology and Design, Singapore)
Zebo Peng (Linköping University, Sweden)
Wang Yi (Uppsala University, Sweden)
[5,6] Device/Circuit-Level Modeling, Simulation and Verification & Analog, RF and Mixed Signal
*Jaeha Kim (Seoul National University, Korea)
Soumyajit Mandal (Case Western Reserve University, USA)
Rajit Manohar (Yale University, USA)
Jintae Kim (Konkuk University, Korea)
Mark Po-Hung Lin (National Chung Cheng University, Taiwan)
SoYoung Kim (Sungkyunkwan University, Korea)
Jun Tao (Fudan University, China)
[7] Power Analysis, Low Power Design, and Thermal Management
*Sheldon Tan (University of California at Riverside, USA)
Cheng Zhuo (Zhejiang University, China)
Hai Wang (UESTC, China)
Haibao Chen (Shanghai Jiaotong University, China)
Hao Yu (Southern University of Science and Technology, China)
Hussam Amrouch (Karlsruhe Institute of Technology (KIT), German)
Masaaki Kondo (University of Tokyo, Japan)
Yuko Hara-Azumi (Tokyo Institute of Technology, Japan)
Jun Shiomi (Kyoto University, Japan)
[8] Logic/High-Level Synthesis and Optimization
*Zhiru Zhang (Cornell University, USA)
Mihir Choudhury (IBM Research, USA)
Fabrizio Ferrandi (Politecnico di Milano, Italy)
Weikang Qian (Shanghai Jiao Tong University, China)
John Wickerson (Imperial College London, UK)
Shouyi Yin (Tsinghua University, China)
[9] Physical Design
*Martin Wong (University of Illinois at Urbana-Champaign, USA)
Yasuhiro Takashima (University of Kitakyushu, Japan)
Seokhyeong Kang (Ulsan National Institute of Science and Technology, Korea)
Hyung-Ock Kim (Samsung Electronics, Korea)
Hung-Ming Chen (National Chiao Tung University, Taiwan)
Wenxing Zhu (Fuzhou University, China)
[10,11] Design for Manufacturability and Reliability & Timing and Signal/Power Integrity
*Charles Chiang (Synopsys. Inc., USA)
Iris Hui-Ru Jiang (National Taiwan University, Taiwan)
Shigeki Nojima (Toshiba Memory, Japan)
Changhao Yan (Fudan University, China)
Evangeline Y.F. Young (Chinese University of Hong Kong, Hong Kong)
Jaehwan Kim (Samsung Electronics, Korea)
Xuan Zeng (Fudan University, China)
Bonghyun Lee (Samsung Electronics, Korea)
Ngai Wong (University of Hong Kong, Hong Kong)
Jie Gu (Northwestern University, USA)
Bei Yu (Chinese University of Hong Kong, Hong Kong)
Shao Yun Fang (National Taiwan University of Science and Technology, Taiwan)
Wenjian Yu (Tsing Hua University, China)
[12] Test and Design for Testability
*Kohei Miyase (Kyushu Institute of Technology, Japan)
Ying Zhang (Tongji University, China)
Seetal Potluri (Technische Universität Dresden, Germany)
Satoshi Ohtake (Oita University, Japan)
Jin-Fu Li (National Central University, Taiwan)
Michihiro Shintani (Nara Institute of Science and Technology (NAIST), Japan)
[13] Security and Fault-Tolerant System
*Jakub Szefer (Yale University, USA)
Yunheung Paek (Seoul National University, Korea)
Ray C.C. Cheung (City University of Hong Kong, Hong Kong)
Hai Zhou (Northwestern University, USA)
Estelle Wang (Continental Automotive Singapore Pte Ltd., Singapore)
Chengmo Yang (University of Delaware, USA)
Dong Kyue Kim (Hanyang University, Korea)
[14] Emerging Technology
*Shigeru Yamashita (Ritsumeikan University, Japan)
Xiaoming Chen (Institute of Computing Technology, Chinese Academy of Sciences, China)
Byung-Soo Choi (Electronics and Telecommunications Research Institute, Korea)
Deliang Fan (University of Central Florida, USA)
Li Jiang (Shanghai Jiao Tong University, China)
Tsun-Ming Tseng (Technical University of Munich, German)
Jianlei Yang (Beihang University, China)
Pingqiang Zhou (ShanghaiTech University, China)
[15] Emerging Application
*Jiang Hu (Texas A&M University, USA)
Zhihao Jiang (Shanghai Tech University, China)
Yanzhi Wang (Syracuse University, USA)
Younghyun Kim (University of Wisconsin, USA)
Masanori Muroyama (Tohoku University, Japan)
Noboru Yoneoka (Fujitsu Laboratories Ltd., Japan)
Chung-Wei Lin (National Taiwan University, Taiwan)
Yongqiang Lyu (Tsinghua University, China)

Last Updated on: October 24, 2018