Title | (Invited Paper) Three-Dimensional Integration Technology and Integrated Systems |
Author | *Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka (Tohoku Univ., Japan) |
Page | pp. 409 - 415 |
Detailed information (abstract, keywords, etc) | |
Slides |
Title | (Invited Paper) A 3D Prototyping Chip based on a Wafer-level Stacking Technology |
Author | *Nobuaki Miyakawa (Honda Research Institute, Japan) |
Page | pp. 416 - 420 |
Detailed information (abstract, keywords, etc) |
Title | (Invited Paper) CAD Challenges for 3D ICs |
Author | David Kung, *Ruchir Puri (IBM Corp., United States) |
Page | pp. 421 - 422 |
Detailed information (abstract, keywords, etc) |
Title | (Invited Paper) Addressing Thermal and Power Delivery Bottlenecks in 3D Circuits |
Author | *Sachin S. Sapatnekar (Univ. of Minnesota, United States) |
Page | pp. 423 - 428 |
Detailed information (abstract, keywords, etc) | |
Slides |
Title | (Invited Paper) The Road to 3D EDA Tool Readiness |
Author | *Charles Chiang, Subarna Sinha (Synopsys, United States) |
Page | pp. 429 - 436 |
Detailed information (abstract, keywords, etc) |