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The 15th Asia and South Pacific Design Automation Conference
Author Index

Table of Contents:   A  B  C  D  E  F  G  H  I  J  K  L  M  N  O  P  R  S  T  U  V  W  X  Y  Z  

A

Abdi, Samar (Concordia University)   p. 717 (8D-2)
Abraham, Jacob A. (The University of Texas at Austin)   p. 312 (4B-4)
Agarwal, Kanak (IBM Austin Research Lab)   p. 739 (9A-1)
Ai, Yan-Qing (Department of Electronic Engineering, The Chinese University of Hong Kong)   p. 379 (4D-20)
Alizadeh, Bijan (The University of Tokyo)   p. 425 (5B-4)
Amano, Hideharu (Keio University)   p. 369 (4D-15)
Amano, Hideharu (Keio University)   p. 377 (4D-19)
Anderson, Jason H. (University of Toronto)   p. 1 (1A-1)
Aono, Shuichi (SESAME Technology Inc.)   p. 137 (2B-4)
Arabzadeh, Mona (Amirkabir University of Technology)   p. 849 (10B-1)
Arai, Hiroaki (Tohoku University)   p. 371 (4D-16)
Asada, Kunihiro (VLSI Design and Education Center(VDEC), The University of Tokyo)   p. 355 (4D-7)
Asai, Hideki (Shizuoka University)   p. 137 (2B-4)
Athikulwongse, Krit (Georgia Institute of Technology)   p. 474 (6A-2)
Austin, Todd (Univ. of Michigan)   (3D-2)
Ayoub, Raid (University of California at San Diego)   p. 891 (10C-4)

B

Bawiec, Marek Arkadiusz (Wrocław University of Technology)   p. 861 (10B-3)
Bazargan, Kia (University of Minnesota)   p. 55 (1C-2)
Benini, Luca (University of Bologna)   p. 167 (2D-1)
Bertacco, Valeria (Univ. of Michigan)   p. 255 (3D-3)
Blaauw, David (Univ. of Michigan, Ann Arbor)   p. 681 (8B-4)
Blaauw, David (University of Michigan)   p. 739 (9A-1)
Boghrati, Baktash (University of Minnesota)   p. 757 (9B-1)
Bowman, Keith (Intel Corporation)   p. 625 (7D-1)
Brisk, Philip (EPFL)   p. 707 (8C-4)
Buttazzo, Giorgio C. (Scuola Superiore Sant'Anna of Pisa)   p. 7 (1A-2)

C

Cai, Siao-Jie (National Taiwan University)   p. 143 (2C-1)
Cai, Yici (Tsinghua University)   p. 25 (1B-1)
Cai, Yici (Tsinghua University)   p. 763 (9B-2)
Castrillon, Jeronimo (RWTH Aachen University)   p. 897 (10D-3)
Chakrapani, Lakshmi N. B. (Rice University)   p. 628 (7D-3)
Chan, Brian P.W. (Department of Electronic Engineering, The Chinese University of Hong Kong)   p. 379 (4D-20)
Chang, Bo-Sen (National Taiwan University)   p. 651 (8A-3)
Chang, Chia-Ming (Chung Yuan Christian University)   p. 480 (6A-3)
Chang, Kai-Hui (Avery Design Systems)   p. 787 (9C-2)
Chang, Naehyuck (Seoul National University)   p. 69 (1D-1)
Chang, Po-Hsien (University of California, Santa Barbara)   p. 607 (7C-2)
Chang, Shuo-Wen (Feng Chia University)   p. 367 (4D-14)
Chang, Yao-Wen (National Taiwan University)   p. 169 (3A-1)
Chang, Yao-Wen (National Taiwan University)   p. 331 (4C-3)
Chang, Yao-Wen (Graduate Institute of Electronics Engineering, National Taiwan University)   p. 395 (5A-3)
Chang, Yung-Hsu (Univ. of Michigan, Ann Arbor)   p. 681 (8B-4)
Chao, Kai-Yuan (Intel Corporation)   p. 549 (7A-1)
Chao, Kai-Yuan (Intel Corporation)   p. 838 (10A-3s)
Chau, Thomas C.P. (Department of Computer Science and Engineering, The Chinese University of Hong Kong)   p. 379 (4D-20)
Chen, Charlie Chung Ping (National Taiwan University)   p. 593 (7B-4)
Chen, Chia-Ying (Janine) (University of California, Santa Barbara)   p. 419 (5B-3)
Chen, Deming (UIUC)   p. 587 (7B-3)
Chen, Gengsheng (Fudan University)   p. 25 (1B-1)
Chen, Gengsheng (Fudan University)   p. 31 (1B-2)
Chen, Hui-chi (National Chiao Tung University)   p. 389 (5A-2)
Chen, Hung-Ming (NCTU)   p. 319 (4C-1)
Chen, Jian-Jia (ETH Zurich)   p. 7 (1A-2)
Chen, Jian-Jia (ETH Zurich)   p. 81 (1D-3)
Chen, Jian-Jia (Swiss Federal Institute of Technology (ETH), Zürich)   p. 885 (10C-3)
Chen, Liang-Bi (National Sun Yat-Sen University)   p. 353 (4D-6)
Chen, Song (Waseda University)   p. 535 (6C-4)
Chen, Ting-Sheng (SoC Technology Center, Industrial Technology Research Institute)   p. 187 (3A-4s)
Chen, Weiwei (Center for Embedded Computer Systems, University of California, Irvine)   p. 161 (2C-4)
Chen, Yibo (The Pennsylvania State University)   p. 193 (3A-5s)
Chen, Yibo (Penn State University)   p. 689 (8C-1)
Chen, Yibo (Penn State University)   p. 781 (9C-1)
Chen, Zhi-Wei (Chung Hua University)   p. 287 (4A-4)
Cheng, Ching-Hwa (Feng Chia University)   p. 357 (4D-8)
Cheng, Ching-Hwa (Feng Chia University)   p. 359 (4D-9)
Cheng, Ching-Hwa (Feng Chia University)   p. 367 (4D-14)
Cheng, Chung-Chun (Graduate Institute of Electronics Engineering, National Taiwan University)   p. 395 (5A-3)
Cheng, Chung-Kuan (UCSD)   p. 119 (2B-1)
Cheng, Chung-Kuan (University of California, San Diego)   p. 125 (2B-2)
Cheng, Lerong (UCLA)   p. 751 (9A-3)
Cheng, Wu-Tung (Mentor Graphics Corporation)   p. 493 (6B-1)
Cheng, Wu-Tung (Mentor Graphics)   p. 511 (6B-4)
Chiang, Cheng-Lung (National Sun Yat-Sen University)   p. 353 (4D-6)
Chiang, Po-Yi (National Chiao Tung University)   p. 568 (7A-4)
Chien, Feng-Tso (Feng Chia University)   p. 359 (4D-9)
Chien, Feng-Tso (Feng Chia University)   p. 367 (4D-14)
Chien, Sheng-Wei (National Taiwan University)   p. 651 (8A-3)
Cho, MinSik (IBM Research)   p. 637 (8A-1)
Choi, Jung Hwan (Samsung Electronics)   p. 401 (5A-4)
Choi, Kyu-Myung (Samsung)   p. 544 (6D-2)
Chou, Hong-Zu (National Taiwan University)   p. 787 (9C-2)
Chou, Yung-Fa (SoC Technology Center, Industrial Technology Research Institute)   p. 187 (3A-4s)
Chow, Wing-Kai (The Hong Kong Polytechnic University)   p. 467 (6A-1)
Choy, Oliver C.S. (Department of Electronic Engineering, The Chinese University of Hong Kong)   p. 379 (4D-20)
Chun, Ji Hwan (Paul) (Intel Corporation)   p. 312 (4B-4)
Chung, Chen-I (Feng Chia University)   p. 357 (4D-8)
Chung, Chen-I (Feng Chia University)   p. 367 (4D-14)
Coskun, Ayse Kivilcim (University of California, San Diego)   p. 873 (10C-1)
Cui, Jin (Nanyang Technological University)   p. 793 (9C-3)

D

Das, Debasish (Northwestern University)   p. 61 (1C-3)
Dasgupta, Aurobindo (Intel Corp.)   p. 401 (5A-4)
Datta, Suman (The Pennsylvania State University)   p. 181 (3A-3)
Davoodi, Azadeh (University of Wisconsin)   p. 593 (7B-4)
De Micheli, Giovanni (EPFL)   p. 167 (2D-1)
De, Vivek K. (Intel Corporation)   (7D-4)
De, Vivek K. (Intel Corporation)   p. 625 (7D-1)
Diemer, Jonas (Institute of Computer and Network Engineering, TU Braunschweig)   p. 529 (6C-3)
Dinh, Quang (UIUC)   p. 587 (7B-3)
Doemer, Rainer (Center for Embedded Computer Systems, University of California, Irvine)   p. 161 (2C-4)
Doemer, Rainer (University of California, Irvine)   p. 713 (8D-1)
Domer, Rainer (University of California, Irvine)   p. 903 (10D-4)
Dong, Sheqin (Tsinghua University)   p. 535 (6C-4)
Dong, Xiangyu (The Pennsylvania State University)   p. 193 (3A-5s)
Du, Peng (University of California, San Diego)   p. 125 (2B-2)

E

Eachempati, Soumya (The Pennsylvania State University)   p. 431 (5C-1)
Ebrahimi, Hassan (Amirkabir)   p. 832 (10A-2)
Edwards, Doug (the University of Manchester)   p. 437 (5C-2)
Engin, Ege (SDSU)   p. 119 (2B-1)
Ernst, Rolf (Institute of Computer and Network Engineering, TU Braunschweig)   p. 529 (6C-3)

F

Falkerstern, Paul (Pennsylvania State University)   p. 169 (3A-1)
Fan, Fang-Yu (TSMC)   p. 319 (4C-1)
Ferrandi, Fabrizio (Politecnico di Milano)   p. 799 (9C-4)
Fujii, Mototsugu (Renesas Technology Corp.)   p. 701 (8C-3)
Fujimura, Toru (University of Kitakyushu)   p. 843 (10A-4s)
Fujisawa, Hisanori (Fujitsu Laboratories Ltd.)   p. 371 (4D-16)
Fujita, Masahiro (The University of Tokyo)   p. 425 (5B-4)
Fujiwara, Hideo (Nara Institute of Science and Technology)   p. 413 (5B-2)
Fukase, Masa-aki (Hirosaki University)   p. 375 (4D-18)
Fuketa, Hiroshi (Osaka University)   p. 361 (4D-10)

G

Gao, Ping (Aries Design Automation)   p. 619 (7C-4)
Gerstlauer, Andreas (University of Texas, Austin)   p. 725 (8D-3)
Gerstlauer, Andreas (University of Texas, Austin)   p. 903 (10D-4)
Geuskens, Bibiche (Intel Corporation)   p. 625 (7D-1)
Goto, Satoshi (Waseda University)   p. 535 (6C-4)
Gu, Chenjie (University of California, Berkeley)   p. 205 (3B-2)
Guo, Jiun-In (National Chung Cheng University)   p. 359 (4D-9)
Guo, Ruifeng (Mentor Graphics)   p. 511 (6B-4)
Gupta, Puneet (UCLA)   p. 751 (9A-3)
Gupta, Saket (University of Minnesota)   p. 199 (3B-1)

H

Habasaki, Tadayuki (NEC Micro Systems, Ltd.)   p. 305 (4B-3)
Hamasaki, Hiroyuki (Renesas Technology)   p. 464 (5D-4)
Hao, Zhigang (Shanghai Jiaotong University)   p. 383 (5A-1)
Hashida, Tatsunori (Shibaura Institute of Technology)   p. 369 (4D-15)
Hashimoto, Masanori (Osaka University)   p. 361 (4D-10)
Hashimoto, Masanori (Osaka University)   p. 775 (9B-4)
He, Lei (Electrical Engineering Department, UCLA)   p. 325 (4C-2)
He, Lei (UCLA)   p. 751 (9A-3)
He, Rui (Memorial University of Newfoundland)   p. 299 (4B-2)
He, Yi (The University of Texas at Dallas)   p. 95 (2A-1)
He, Yi (University of Texas at Dallas)   p. 879 (10C-2)
He, Zijian (Institute of Computing Technology, CAS)   p. 499 (6B-2)
Hieda, Takuji (Graduate School of Information Science and Technology, Osaka University)   p. 101 (2A-2)
Ho, Kuan-Hsien (National Taiwan University)   p. 331 (4C-3)
Ho, Sam M.H. (Department of Electronic Engineering, The Chinese University of Hong Kong)   p. 379 (4D-20)
Ho, Tsung-Yu (National Sun Yat-Sen University)   p. 353 (4D-6)
Ho, Yuan-Kai (Graduate Institute of Electronics Engineering, National Taiwan University)   p. 395 (5A-3)
Hong, JeeYoung (Tokyo Institute of Technology)   p. 351 (4D-5)
Hong, Xian-Long (Tsinghua University)   p. 49 (1C-1)
Hong, Xianlong (Tsinghua Univ.)   p. 769 (9B-3)
Hori, Yuichi (Keio University)   p. 349 (4D-4)
Hoshi, Yasuhiko (Renesas Technology)   p. 464 (5D-4)
Hsieh, Wei-Jhih (National Taiwan University)   p. 651 (8A-3)
Hsieh, Wen-Tsan (Industrial Technology Research Institute)   p. 815 (9D-3)
Hsueh, Fu-Lung (TSMC)   p. 821 (9D-4)
Hu, Jiang (Texas A&M University)   p. 745 (9A-2)
Hu, Xiang (UCSD)   p. 119 (2B-1)
Hu, Xiang (University of California, San Diego)   p. 125 (2B-2)
Hu, Yu (Electrical and Computer Engineering Department, University of Alberta)   p. 325 (4C-2)
Hu, Yu Hen (University of Wisconsin)   p. 593 (7B-4)
Huang, Chien-Jen (National Tsing Hua University)   p. 381 (4D-21)
Huang, Chua-Huang (Feng Chia University)   p. 821 (9D-4)
Huang, Chung Yang (Ric) (GIEE, National Taiwan University)   p. 669 (8B-2)
Huang, Chung-Yang (Ric) (National Taiwan University)   p. 143 (2C-1)
Huang, Chung-Yang (Ric) (National Taiwan University)   p. 613 (7C-3)
Huang, Ing-Jer (National Sun Yat-Sen University)   p. 353 (4D-6)
Huang, Jiun-Lang (National Taiwan University)   p. 493 (6B-1)
Huang, Kai (ETH Zurich)   p. 7 (1A-2)
Huang, Shi-Yi (National Changhua University of Education)   p. 444 (5C-3)
Huang, Shi-Yu (TinnoTek Corp./National Tsing Hua Univ.)   p. 815 (9D-3)
Huang, Shih-Hsu (Chung Yuan Christian University)   p. 480 (6A-3)
Huang, Yu (Mentor Graphics)   p. 511 (6B-4)
Hung, Hsi (National Cheng Kung University)   p. 555 (7A-2)
Hung, Shih-Hao (National Taiwan University)   p. 19 (1A-4)

I

Ienne, Paolo (EPFL)   p. 707 (8C-4)
Ikebuchi, Diasuke (Keio University)   p. 369 (4D-15)
Ikeda, Makoto (VLSI Design and Education Center(VDEC), The University of Tokyo)   p. 355 (4D-7)
Imai, Masaharu (Graduate School of Information Science and Technology, Osaka University)   p. 101 (2A-2)
Imanishi, Daisuke (Tokyo Institute of Technology)   p. 351 (4D-5)
Irwin, Mary Jane (The Pennsylvania State University)   p. 431 (5C-1)
Ito, Shogo (Tokyo Institute of Technology)   p. 363 (4D-12)
Ito, Takao (Toshiba Corp.)   p. 305 (4B-3)
Ito, Takashi (Tohoku University)   p. 371 (4D-16)
Izumi, Kenji (NEC Micro Systems, Ltd.)   p. 305 (4B-3)

J

Jamadagni, H S (CEDT,Indian Institute of Science, Bangalore)   p. 217 (3B-4)
Jang, Wooyoung (University of Texas at Austin)   p. 523 (6C-2)
Jantsch, Axel (Royal Institute of Technology)   p. 223 (3C-1)
Jerraya, Ahmed (LETI)   (2D-2)
Jhong, Ming-Ching (Chung Hua University)   p. 287 (4A-4)
Jhou, Jyun-Sian (Feng Chia University)   p. 357 (4D-8)
Jiang, Jie-Hong Roland (National Taiwan University)   p. 331 (4C-3)
Jose, Bijoy A (FERMAT LAB, Virginia Polytechnic Institute and State University)   p. 149 (2C-2)
Jose, Bijoy Antony (FERMAT Lab, Virginia Tech)   p. 13 (1A-3)
Joshi, Vivek (University of Michigan)   p. 739 (9A-1)
Jou, C. P. (TSMC)   p. 821 (9D-4)
Ju, Jiun-Cheng (National Sun Yat-Sen University)   p. 353 (4D-6)

K

Kahng, Andrew B. (UC San Diego)   p. 241 (3C-4)
Kahng, Andrew B. (UC San Diego)   p. 825 (10A-1)
Kamata, Masahiro (Keio University)   p. 369 (4D-15)
Kang, Byungtae (Samsung Electronics Co.)   p. 259 (3D-4)
Kang, Seokhyeong (UC San Diego)   p. 825 (10A-1)
Kao, Tzi-Wei (National Changhua University of Education)   p. 444 (5C-3)
Karnik, Tanay (Intel Corporation)   p. 625 (7D-1)
Kato, Masaru (Keio University)   p. 377 (4D-19)
Kauschke, Michael (Intel)   p. 529 (6C-3)
Kawada, Shun (Tohoku University)   p. 343 (4D-1)
Kawada, Shun (Tohoku University)   p. 347 (4D-3)
Kawakita, Masahiro (Toshiba Corp.)   p. 305 (4B-3)
Khellah, Muhammad (Intel Corporation)   p. 625 (7D-1)
Ki, Wing-Hung (Hong Kong University of Science and Technology)   p. 75 (1D-2)
Kido, Hideaki (Hitachi Ltd)   p. 464 (5D-4)
Kim, Byung Guk (Purdue University)   p. 401 (5A-4)
Kim, Dongyun (Samsung Electronics Co.)   p. 259 (3D-4)
Kim, Jungsoo (KAIST)   p. 575 (7B-1)
Kim, Kyungho (Samsung Electronics Co.)   p. 259 (3D-4)
Kim, Nam Sung (University of Wisconsin-Madison)   p. 229 (3C-2)
Kim, Nam Sung (University of Wisconsin)   p. 593 (7B-4)
Kim, Taemin (Department of Computer Science, University of California, Los Angeles)   p. 695 (8C-2)
Kim, Taewhan (Seoul National University)   p. 131 (2B-3)
Kim, Taewhan (Seoul National University)   p. 486 (6A-4)
Kim, Tak-Yung (Seoul National University)   p. 486 (6A-4)
Kim, Younghyun (Seoul National University)   p. 69 (1D-1)
Kimura, Masayuki (Keio University)   p. 377 (4D-19)
Kimura, Shinji (Waseda University)   p. 337 (4C-4)
Kodi, Avinash (Ohio University)   p. 450 (5C-4)
Kohara, Takahiro (Graduate School of Engineering, Tohoku University)   p. 345 (4D-2)
Kohira, Yukihide (The University of Aizu)   p. 281 (4A-3)
Koike, Hiroki (Kyushu Institute of Technology)   p. 365 (4D-13)
Kojima, Masahiro (NEC Micro Systems, Ltd.)   p. 305 (4B-3)
Kojima, Michiko (NEC Micro Systems, Ltd.)   p. 305 (4B-3)
Kojima, Yuu (Keio University)   p. 369 (4D-15)
Kondo, Masaaki (The University of Electro-Communications)   p. 369 (4D-15)
Kondratyev, Alex (Cadence Design Systems)   p. 701 (8C-3)
Kong, Hui (University of Illinois at Urbana-Champaign)   p. 275 (4A-2)
Kotani, Koji (Tohoku University)   p. 371 (4D-16)
Koyama, Satoshi (Shibaura Institute of Technology)   p. 369 (4D-15)
Krishnan, Ramakrishnan (The Pennsylvania State University)   p. 181 (3A-3)
Krishnan, Ramakrishnan (The Pennsylvania State University)   p. 431 (5C-1)
Kulkarni, Jaydeep (Intel Corporation)   p. 625 (7D-1)
Kumar, Anshul (Indian Institute of Technology, Delhi)   p. 707 (8C-4)
Kumar, Rakesh (UIUC)   p. 825 (10A-1)
Kuo, Sy-Yen (National Taiwan University)   p. 787 (9C-2)
Kuroda, Tadahiro (Keio University)   p. 349 (4D-4)
Kuwada, Kimihiko (Semiconductor Technology Academic Research Center)   p. 775 (9B-4)
Kuwahara, Masanori (Toshiba)   p. 457 (5D-2)
Kwai, Ding-Ming (SoC Technology Center, Industrial Technology Research Institute)   p. 187 (3A-4s)
Kwai, Ding-Ming (Industrial Technology Research Institute)   p. 544 (6D-2)
Kyung, Chong-Min (KAIST)   p. 575 (7B-1)

L

Lai, Jim (Global Unichip Corporation)   (3K-1)
Lata, Kusum (CEDT,Indian Institute of Science, Bangalore)   p. 217 (3B-4)
Lau, Oscar K.L. (Department of Electronic Engineering, The Chinese University of Hong Kong)   p. 379 (4D-20)
Lavagno, Luciano (Cadence Design Systems)   p. 701 (8C-3)
Lee, Chung-Nan (National Sun Yat-Sen University)   p. 353 (4D-6)
Lee, Elone (Feng Chia University)   p. 359 (4D-9)
Lee, Jae Wook (The University of Texas at Austin)   p. 312 (4B-4)
Lee, Ju-Yueh (Electrical Engineering Department, UCLA)   p. 325 (4C-2)
Lee, Jungseob (University of Wisconsin-Madison)   p. 229 (3C-2)
Lee, Sungchul (Hanyang University)   p. 259 (3D-4)
Lee, Wonghee (Graduate School of Engineering, Tohoku University)   p. 345 (4D-2)
Lee, Yongho (Seoul National University)   p. 131 (2B-3)
Lee, Younghoon (KAIST)   p. 575 (7B-1)
Lee, Yu-Min (National Chiao Tung University)   p. 568 (7A-4)
Lei, Chi-Un (The University of Hong Kong)   p. 37 (1B-3)
Lei, Zhao (Keio University)   p. 369 (4D-15)
Leong, Philip H.W. (School of Electrical and Information Engineering, University of Sydney)   p. 379 (4D-20)
Leupers, Rainer (RWTH Aachen University)   p. 897 (10D-3)
Li, Albert (GUC)   p. 544 (6D-2)
Li, Duo (University of California, Riverside)   p. 763 (9B-2)
Li, Huawei (Institute of Computing Technology, CAS)   p. 499 (6B-2)
Li, Jin-Fu (National Central University/Industrial Technology Research Institute)   p. 541 (6D-1)
Li, Jin-Fu (National Central University/Industrial Technology Research Institute)   p. 544 (6D-2)
Li, Li (WuHan University of Technology)   p. 769 (9B-3)
Li, Minming (City University of Hong Kong)   p. 113 (2A-4)
Li, Minming (Computer Science Department, City University of Hong Kong)   p. 325 (4C-2)
Li, Ning (Tokyo Institute of Technology)   p. 363 (4D-12)
Li, Tai-Lun (National Changhua University of Education)   p. 444 (5C-3)
Li, Xiaowei (Institute of Computing Technology, CAS)   p. 499 (6B-2)
Li, Yih-Lang (National Chiao Tung University)   p. 389 (5A-2)
Li, Yih-Lang (National Chiao Tung University)   p. 657 (8A-4)
Liang, Bor-Sung (Sunplus Core Technology)   (5D-3)
Lim, Sung Kyu (Georgia Institute of Technology)   p. 175 (3A-2)
Lim, Sung Kyu (Georgia Institute of Technology)   p. 474 (6A-2)
Lin, Bill (UC San Diego)   p. 241 (3C-4)
Lin, Chang-Tzu (SoC Technology Center, Industrial Technology Research Institute)   p. 187 (3A-4s)
Lin, Chih-Ta (National Chiao Tung University)   p. 657 (8A-4)
Lin, How-Rern (Providence University)   p. 444 (5C-3)
Lin, Jai-Ming (National Cheng Kung University)   p. 555 (7A-2)
Lin, Kai-Li (National Tsing Hua University)   p. 235 (3C-3)
Lin, Kuen-Huei (National Taiwan University)   p. 143 (2C-1)
Lin, Yen-Hung (National Chiao Tung University)   p. 657 (8A-4)
Liu, Bo (University of Kitakyushu)   p. 843 (10A-4s)
Liu, Chung-Laung (National Tsing Hua University)   (1K-1)
Liu, Frank (IBM Austin Research Lab)   p. 745 (9A-2)
Liu, I-Min (Atoptech)   p. 319 (4C-1)
Liu, Shenghua (Tsinghua University)   p. 49 (1C-1)
Liu, Tiantian (City University of Hong Kong)   p. 113 (2A-4)
Liu, Wen-Hao (National Chiao Tung University)   p. 389 (5A-2)
Liu, Xiao (The Chinese University of Hong Kong)   p. 262 (3D-5)
Liu, Xuexin (UC Riverside)   p. 211 (3B-3)
Liu, Xun (North Carolina State University)   p. 695 (8C-2)
Liu, Zheng (Memorial University of Newfoundland)   p. 293 (4B-1)
Lo, Chen-Kang (National Tsing Hua University)   p. 235 (3C-3)
Louri, Ahmed (The University of Arizona)   p. 450 (5C-4)
Lu, Chao (Purdue University)   p. 89 (1D-4)
Lu, Jingwei (The Hong Kong Polytechnic University)   p. 467 (6A-1)
Lu, Katrina (Intel)   p. 637 (8A-1)
Lu, Shih-Lien (Intel Corporation)   p. 625 (7D-1)
Lu, Yi-Chang (National Taiwan University)   p. 651 (8A-3)
Lu, Yuan-Ching (National Taiwan University)   p. 651 (8A-3)
Lv, Tao (Institute of Computing Technology, CAS)   p. 499 (6B-2)
Lysecky, Roman (The University of Arizona)   p. 450 (5C-4)

M

Ma, Hsi-Pin (National Tsing Hua University)   p. 381 (4D-21)
Ma, Qiang (University of Illinois at Urbana-Champaign)   p. 549 (7A-1)
Ma, Yuchun (Tsinghua University)   p. 49 (1C-1)
Ma, Yuchun (Tsinghua Univ.)   p. 769 (9B-3)
Maidee, Pongstorn (University of Minnesota)   p. 55 (1C-2)
Majumdar, Rupak (Conputer Science Department, UCLA)   p. 325 (4C-2)
Malik, Avinash (University of Auckland)   p. 107 (2A-3)
Mandai, Shingo (The University of Tokyo)   p. 355 (4D-7)
Marchal, Paull (IMEC)   (2D-2)
Marinissen, Erik Jan (IMEC)   p. 544 (6D-2)
Maskell, Douglas L. (Nanyang Technological University)   p. 793 (9C-3)
Masuda, Hiroki (Shibaura Institute of Technology)   p. 369 (4D-15)
Mateja, Michael (Advanced Micro Devices, Inc)   p. 419 (5B-3)
Matsumoto, Nobu (Center for Semiconductor Research and Development, Semiconductor Company, Toshiba Corporation)   p. 101 (2A-2)
Matsunaga, Taeko (Waseda University)   p. 337 (4C-4)
Matsunaga, Yusuke (Kyushu University)   p. 337 (4C-4)
Matsushita, Kouta (Tokyo Institute of Technology)   p. 363 (4D-12)
Matsuzawa, Akira (Tokyo Institute of Technology)   p. 351 (4D-5)
Matsuzawa, Akira (Tokyo Institute of Technology)   p. 363 (4D-12)
Mi, Ning (University of California, Riverside)   p. 763 (9B-2)
Minami, Fumihiro (Semiconductor Technology Academic Research Center)   p. 775 (9B-4)
Mitsuyama, Yukio (Osaka University)   p. 361 (4D-10)
Miyakawa, Nobuaki (Honda Research)   (2D-2)
Miyamoto, Naoto (Tohoku University)   p. 371 (4D-16)
Miyamoto, Naoto (Tohoku University)   p. 373 (4D-17)
Mizobuchi, Koichi (DISP Development, Texas Instruments Japan)   p. 345 (4D-2)
Mohanram, Kartik (Rice University)   p. 867 (10B-4)
Mookerjea, Saurabh (The Pennsylvania State University)   p. 181 (3A-3)
Mooney, Vincent (Georgia Institute of Technology/Nanyang Technological University)   (7D-4)
Morimoto, Hiroyuki (Kyushu Institute of Technology)   p. 365 (4D-13)
Moser, Clemens (ETH Zurich)   p. 81 (1D-3)
Murakami, Ryosuke (Hirosaki University)   p. 375 (4D-18)
Murali, Srinivasan (iNoCs/EPFL)   (2D-2)
Murali, Srinivasan (iNoCs/EPFL)   p. 167 (2D-1)
Muramatsu, Shoji (Hitachi Ltd)   p. 464 (5D-4)

N

Najm, Farid (University of Toronto)   p. 601 (7C-1)
Nakamura, Atsushi (Renesas Technology)   p. 464 (5D-4)
Nakamura, Hiroshi (University of Tokyo)   p. 369 (4D-15)
Nakamura, Kazuyuki (Kyushu Institute of Technology)   p. 365 (4D-13)
Nakatake, Shigetoshi (University of Kitakyushu)   p. 305 (4B-3)
Nakatake, Shigetoshi (University of Kitakyushu)   p. 843 (10A-4s)
Nakayama, Noriyasu (Fujitsu Advanced Technologies)   p. 701 (8C-3)
Nakura, Toru (VLSI Design and Education Center(VDEC), The University of Tokyo)   p. 355 (4D-7)
Namiki, Mitaro (University of Agriculture and Technology)   p. 369 (4D-15)
Nanjundappa, Mahesh (FERMAT LAB, Virginia Polytechnic Institute and State University)   p. 149 (2C-2)
Nara, Ryuta (Waseda University)   p. 407 (5B-1)
Narayanan, Vijaykrishnan (The Pennsylvania State University)   p. 181 (3A-3)
Narayanan, Vijaykrishnan (The Pennsylvania State University)   p. 431 (5C-1)
Narendra, Siva (Tyfone, Inc.)   (7D-4)
Narendra, Siva (Tyfone, Inc./Portland State University)   p. 626 (7D-2)
Nian, Jing Jia (GIEE, National Taiwan University)   p. 669 (8B-2)
Nikodem, Maciej (Wrocław University of Technology)   p. 861 (10B-3)
Niu, Dimin (The Pennsylvania State University)   p. 193 (3A-5s)

O

Obien, Marie Engelene J. (Nara Institute of Science and Technology)   p. 413 (5B-2)
Oh, Dongkeun (University of Wisconsin)   p. 593 (7B-4)
Ohmi, Tadahiro (Tohoku University)   p. 373 (4D-17)
Ohtsuki, Tatsuo (Waseda University)   p. 407 (5B-1)
Okada, Kenichi (Tokyo Institute of Technology)   p. 351 (4D-5)
Okada, Kenichi (Tokyo Institute of Technology)   p. 363 (4D-12)
Okumura, Takaaki (Semiconductor Technology Academic Research Center)   p. 775 (9B-4)
Olivarez, Mike (Freescale Semiconductor, Inc.)   (10D-1)
Onoye, Takao (Osaka University)   p. 361 (4D-10)
Ota, Yutaka (Center for Semiconductor Research and Development, Semiconductor Company, Toshiba Corporation)   p. 101 (2A-2)

P

Paik, Seungwhun (KAIST)   p. 581 (7B-2)
Paik, Seungwhun (KAIST)   p. 675 (8B-3)
Palem, Krishna (Rice University/Nanyang Technological University)   (7D-4)
Palem, Krishna (Rice University/Nanyang Technological University)   p. 628 (7D-3)
Pan, David Z. (University of Texas at Austin)   p. 523 (6C-2)
Pan, David Z. (University of Texas at Austin)   p. 637 (8A-1)
Pan, Hsin-Chieh (National Taiwan University)   p. 493 (6B-1)
Pan, Song-Bin (Chung Yuan Christian University)   p. 480 (6A-3)
Patel, Hiren D (Department of ECE, University of Waterloo)   p. 149 (2C-2)
Paul, Kolin (Indian Institute of Technology, Delhi)   p. 707 (8C-4)
Peng, Ke (University of Connecticut)   p. 511 (6B-4)
Pétrot, Frédéric (TIMA Laboratory, INP Grenoble)   p. 155 (2C-3)
Pilato, Christian (Politecnico di Milano)   p. 799 (9C-4)
Pomeranz, Irith (Purdue University)   p. 505 (6B-3)
Pothineni, Nagaraju (Google, India)   p. 707 (8C-4)
Pradhan, Dhiraj (University of Bristol)   p. 181 (3A-3)
Pun, Kong-Pang (Department of Electronic Engineering, The Chinese University of Hong Kong)   p. 379 (4D-20)
Puri, Ruchir (IBM)   (2D-2)

R

Raghunathan, Vijay (Purdue University)   p. 89 (1D-4)
Raychowdhury, Arijit (Intel Corporation)   p. 625 (7D-1)
Reddy, Sudhakar M. (University of Iowa)   p. 505 (6B-3)
Rhines, Walden C. (Mentor Graphics)   (2K-1)
Rosing, Tajana (University of California at San Diego)   p. 891 (10C-4)
Rosing, Tajana Simunic (University of California, San Diego)   p. 873 (10C-1)
Rostami, Masoud (Rice University)   p. 867 (10B-4)
Roy, Kaushik (Purdue University)   p. 89 (1D-4)
Roy, Kaushik (Purdue University)   p. 401 (5A-4)
Roychowdhury, Jaijeet (University of California, Berkeley)   p. 205 (3B-2)

S

Saeedi, Mehdi (Amirkabir University of Technology)   p. 849 (10B-1)
Safarpour, Sean (Vennsa Technologies)   p. 601 (7C-1)
Saheb Zamani, Morteza (Amirkabir University of Technology)   p. 849 (10B-1)
Saito, Yoshiki (Keio University)   p. 377 (4D-19)
Sakai, Shin (Tohoku University)   p. 343 (4D-1)
Sakai, Shin (Tohoku University)   p. 347 (4D-3)
Salcic, Zoran (University of Auckland)   p. 107 (2A-3)
Samadi, Kambiz (UC San Diego)   p. 241 (3C-4)
Sander, Ingo (Royal Institute of Technology)   p. 223 (3C-1)
Sano, Toru (Keio University)   p. 377 (4D-19)
Santinelli, Luca (Scuola Superiore Sant'Anna of Pisa)   p. 7 (1A-2)
Santinelli, Luca (Scuola Superiore Sant'Anna, Pisa)   p. 885 (10C-3)
Sapatnekar, Sachin (University of Minnesota)   p. 745 (9A-2)
Sapatnekar, Sachin S. (University of Minnesota)   p. 199 (3B-1)
Sapatnekar, Sachin S. (University of Minnesota)   p. 517 (6C-1)
Sapatnekar, Sachin S. (University of Minnesota)   p. 757 (9B-1)
Sartori, John (UIUC)   p. 825 (10A-1)
Sato, Tomoaki (Hirosaki University)   p. 375 (4D-18)
Schafer, Benjamin Carrion (NEC Corporation)   p. 809 (9D-2)
Schirner, Gunar (Northeastern University, Boston)   p. 725 (8D-3)
Schirner, Gunar (Northeastern University)   p. 903 (10D-4)
Schranzhofer, Andreas (Swiss Federal Institute of Technology (ETH), Zürich)   p. 885 (10C-3)
Sciuto, Donatella (Politecnico di Milano)   p. 799 (9C-4)
Seki, Naomi (Keio University)   p. 369 (4D-15)
Seo, Jueun (Seoul National University)   p. 69 (1D-1)
Seomun, Jun (KAIST)   p. 581 (7B-2)
Sha, Edwin (The University of Texas at Dallas)   p. 95 (2A-1)
Sha, Edwin H.M. (University of Texas at Dallas)   p. 879 (10C-2)
Sham, Chiu-Wing (The Hong Kong Polytechnic University)   p. 467 (6A-1)
Shankar, Karthik (The University of Arizona)   p. 450 (5C-4)
Shao, Hui (Hong Kong University of Science and Technology)   p. 75 (1D-2)
Sharifi, Shervin (University of California, San Diego)   p. 873 (10C-1)
Shayan, Amirali (UCSD)   p. 119 (2B-1)
Shayan, Amirali (University of California, San Diego)   p. 125 (2B-2)
Shen, Hao (TIMA Laboratory, INP Grenoble)   p. 155 (2C-3)
Shi, Guoyong (Shanghai Jiaotong University)   p. 383 (5A-1)
Shih, Xin-Wei (Graduate Institute of Electronics Engineering, National Taiwan University)   p. 395 (5A-3)
Shimazaki, Kenji (Semiconductor Technology Academic Research Center)   p. 775 (9B-4)
Shin, Donghwa (Seoul National University)   p. 69 (1D-1)
Shin, Hyunchul (Hanyang University)   p. 259 (3D-4)
Shin, Juyong (Hanyang University)   p. 259 (3D-4)
Shin, Youngsoo (KAIST)   p. 581 (7B-2)
Shin, Youngsoo (KAIST)   p. 675 (8B-3)
Shirai, Toshiki (Shibaura Institute of Technology)   p. 369 (4D-15)
Shiue, Albert (Alvaview Technologies)   (10D-2)
Shukla, Sandeep K (FERMAT LAB, Virginia Polytechnic Institute and State University)   p. 149 (2C-2)
Shukla, Sandeep Kumar (FERMAT Lab, Virginia Tech)   p. 13 (1A-3)
Singh, Jawar (University of Bristol)   p. 181 (3A-3)
Sinha, Subarna (Synopsys)   p. 561 (7A-3)
Somasekhar, Dinesh (Intel Corporation)   p. 625 (7D-1)
Song, Wei (the University of Manchester)   p. 437 (5C-2)
Soon, Thean-Siew (National Taiwan University)   p. 19 (1A-4)
Soundararajan, Niranjan (The Pennsylvania State University)   p. 431 (5C-1)
Su, Alan P. (Global Unichip)   p. 732 (8D-4)
Su, Alan P. (Global Unichip Corp.)   p. 821 (9D-4)
Su, Guan-Chan (National Chiao Tung University)   p. 657 (8A-4)
Sugawa, Shigetoshi (Tohoku University)   p. 343 (4D-1)
Sugawa, Shigetoshi (Graduate School of Engineering, Tohoku University)   p. 345 (4D-2)
Sugawa, Shigetoshi (Tohoku University)   p. 347 (4D-3)
Sun, Jin (The University of Arizona)   p. 450 (5C-4)
Sun, Wei-Tsun (University of Auckland)   p. 107 (2A-3)
Sylvester, Dennis (Univ. of Michigan, Ann Arbor)   p. 681 (8B-4)
Sylvester, Dennis (University of Michigan)   p. 739 (9A-1)

T

Tahoori, Mehdi (Northeastern University/Karlsruhe Institute of Technology)   p. 855 (10B-2)
Takach, Andres (Mentor Graphics Corporation)   p. 689 (8C-1)
Takach, Andres (Mentor Graphics Corporation)   p. 781 (9C-1)
Takahashi, Atsushi (Osaka University)   p. 281 (4A-3)
Takahashi, Makoto (Toshiba)   p. 544 (6D-2)
Takashima, Risako (Keio University)   p. 349 (4D-4)
Takayama, Naoki (Tokyo Institute of Technology)   p. 363 (4D-12)
Takeda, Seidai (University of Tokyo)   p. 369 (4D-15)
Takeuchi, Yoshinori (Graduate School of Information Science and Technology, Osaka University)   p. 101 (2A-2)
Tan, Sheldon (UC Riverside)   p. 25 (1B-1)
Tan, Sheldon (UC Riverside)   p. 31 (1B-2)
Tan, Sheldon (UC Riverside)   p. 211 (3B-3)
Tan, Sheldon (University of California, Riverside)   p. 763 (9B-2)
Tanaka, Hiroaki (Center for Semiconductor Research and Development, Semiconductor Company, Toshiba Corporation)   p. 101 (2A-2)
Tashiro, Yoshiaki (Tohoku University)   p. 343 (4D-1)
Tashiro, Yoshiaki (Tohoku University)   p. 347 (4D-3)
Tatesawa, Mitsuru (Renesas Technology Corp.)   p. 701 (8C-3)
Tehranipoor, Mohammad (University of Connecticut)   p. 511 (6B-4)
Thiele, Lothar (ETH Zurich)   p. 7 (1A-2)
Thiele, Lothar (ETH Zurich)   p. 81 (1D-3)
Thiele, Lothar (Swiss Federal Institute of Technology (ETH), Zürich)   p. 885 (10C-3)
Togawa, Nozomu (Waseda University)   p. 407 (5B-1)
Tokunaga, Carlos (Intel Corporation)   p. 625 (7D-1)
Trambadia, Ashish (NECHCL ST)   p. 809 (9D-2)
Tsai, Kuen-Yu (National Taiwan University)   p. 651 (8A-3)
Tsai, Kun-Han (Mentor Graphics Corporation)   p. 493 (6B-1)
Tsai, Min-Chun (Brion Technology)   p. 645 (8A-2)
Tsai, Shih Heng (GIEE, National Taiwan University)   p. 669 (8B-2)
Tsay, Ren-Song (National Tsing Hua University)   p. 235 (3C-3)
Tschanz, James (Intel Corporation)   p. 625 (7D-1)
Tsui, Chi-Ying (Hong Kong University of Science and Technology)   p. 75 (1D-2)
Tu, Chia-Heng (National Taiwan University)   p. 19 (1A-4)
Tu, Wen-Pin (Chung Yuan Christian University)   p. 480 (6A-3)
Tumeo, Antonino (Politecnico di Milano)   p. 799 (9C-4)
Tunbunheng, Vasutan (Keio University)   p. 377 (4D-19)
Tunc, Cihan (Northeastern University)   p. 855 (10B-2)
Tzeng, Jian-Lung (National Tsing Hua University)   p. 381 (4D-21)

U

Umahashi, Yusuke (Shibaura Institute of Technology)   p. 369 (4D-15)
Unno, Masaki (Shizuoka University)   p. 137 (2B-4)
Usami, Kimiyoshi (Shibaura Institute of Technology)   p. 369 (4D-15)

V

Velev, Miroslav (Aries Design Automation)   p. 619 (7C-4)
Veneris, Andreas (University of Toronto)   p. 601 (7C-1)

W

Wakabayashi, Kazutoshi (NEC Corporation)   p. 809 (9D-2)
Wang, Hai (UC Riverside)   p. 31 (1B-2)
Wang, Hai (UC Riverside)   p. 211 (3B-3)
Wang, Janet M. (The University of Arizona)   p. 450 (5C-4)
Wang, Jia (Illinois Institute of Technology)   p. 61 (1C-3)
Wang, Jia (Illinois Institute of Technology)   p. 663 (8B-1)
Wang, Li-C. (Univ. of California, Santa Barbara)   p. 247 (3D-1)
Wang, Li-C. (University of California, Santa Barbara)   p. 419 (5B-3)
Wang, Li-C. (University of California, Santa Barbara)   p. 607 (7C-2)
Wang, Teng-Han (National Taiwan University)   p. 493 (6B-1)
Wang, Yan (Institute of Microelectronics, Tsinghua University)   p. 645 (8A-2)
Wang, Yu (Tsinghua Univ.)   p. 49 (1C-1)
Wang, Yu (Tsinghua University)   p. 169 (3A-1)
Wang, Yu (Tsinghua University)   p. 689 (8C-1)
Wang, Yu (Tsinghua Univ.)   p. 769 (9B-3)
Wang, Yu (Tsinghua University)   p. 781 (9C-1)
Watanabe, Yosinori (Cadence Design Systems)   p. 701 (8C-3)
Wei, Yaoguang (University of Minnesota)   p. 745 (9A-2)
Wilkerson, Chris (Intel Corporation)   p. 625 (7D-1)
Wong, Martin (UIUC)   p. 587 (7B-3)
Wong, Martin D. F. (University of Illinois at Urbana-Champaign)   p. 275 (4A-2)
Wong, Martin D. F. (University of Illinois at Urbana-Champaign)   p. 549 (7A-1)
Wong, Martin D. F. (University of Illinois at Urbana-Champaign)   p. 838 (10A-3s)
Wong, Ngai (The University of Hong Kong)   p. 37 (1B-3)
Wong, Ngai (Department of Electrical and Electronic Engineering, The University of Hong Kong)   p. 43 (1B-4)
Wu, An-Yeu (Andy) (STC/ITRI)   (5D-1)
Wu, Cheng-Wen (Tsing-Hua University)   p. 541 (6D-1)
Wu, Cheng-Wen (National Tsing Hua University/Industrial Technology Research Institute)   p. 544 (6D-2)
Wu, Meng-Fan (National Taiwan University)   p. 493 (6B-1)
Wu, Tsung-Yi (National Changhua University of Education)   p. 444 (5C-3)
Wu, Tsung-You (National Chiao Tung University)   p. 568 (7A-4)
Wu, Wen-Ching (SoC Technology Center, Industrial Technology Research Institute)   p. 187 (3A-4s)

X

Xiao, Linfu (The Chinese University of Hong Kong)   p. 561 (7A-3)
Xiao, Zigang (The Chinese University of Hong Kong)   p. 269 (4A-1)
Xie, Yuan (Pennsylvania State University)   (2D-2)
Xie, Yuan (Pennsylvania State University)   p. 169 (3A-1)
Xie, Yuan (The Pennsylvania State University)   p. 193 (3A-5s)
Xie, Yuan (Penn State University)   p. 689 (8C-1)
Xie, Yuan (Penn State University)   p. 781 (9C-1)
Xiong, Wei (Institute of Microelectronics, Tsinghua University)   p. 645 (8A-2)
Xu, Cathy Qun (The University of Texas at Dallas)   p. 95 (2A-1)
Xu, Cathy Qun (University of Texas at Dallas)   p. 879 (10C-2)
Xu, Jingyu (Synopsys)   p. 561 (7A-3)
Xu, Ning (WuHan University of Technology)   p. 769 (9B-3)
Xu, Qiang (The Chinese University of Hong Kong)   p. 262 (3D-5)
Xue, Chun Jason (City University of Hong Kong)   p. 95 (2A-1)
Xue, Chun Jason (City University of Hong Kong)   p. 113 (2A-4)
Xue, Chun Jason (City University of Hong Kong)   p. 879 (10C-2)

Y

Yamamoto, Akihiro (Renesas Technology)   p. 464 (5D-4)
Yamashita, Koichiro (Fujitsu Laboratories Ltd.)   p. 805 (9D-1)
Yan, Boyuan (UC Riverside)   p. 25 (1B-1)
Yan, Jin-Tai (Chung Hua University)   p. 287 (4A-4)
Yan, Tan (University of Illinois at Urbana-Champaign)   p. 275 (4A-2)
Yanagisawa, Masao (Waseda University)   p. 407 (5B-1)
Yanamandra, Aditya (The Pennsylvania State University)   p. 431 (5C-1)
Yang, Bo (University of Kitakyushu)   p. 843 (10A-4s)
Yang, Jae-Seok (University of Texas at Austin)   p. 637 (8A-1)
Yasuda, Yoshihiro (Keio University)   p. 377 (4D-19)
Yeh, Hu-Hsi (National Taiwan University)   p. 613 (7C-3)
Yeh, Jen-Chieh (Industrial Technology Research Institute)   p. 815 (9D-3)
Yoo, Sungjoo (POSTECH)   p. 575 (7B-1)
Young, Evangeline F.Y. (The Chinese University of Hong Kong)   p. 269 (4A-1)
Young, Evangeline F.Y. (The Chinese University of Hong Kong)   p. 561 (7A-3)
Young, Fung-Yu (The Chinese University of Hong Kong)   p. 467 (6A-1)
Young, William (TSMC)   p. 821 (9D-4)
Yu, Bei (Tsinghua University)   p. 535 (6C-4)
Yu, Hao (Berkeley Design Automation)   p. 211 (3B-3)
Yu, Lee-eun (KAIST)   p. 675 (8B-3)
Yu, Wenjian (Tsinghua University)   p. 119 (2B-1)
Yu, Zhiping (Institute of Microelectronics, Tsinghua University)   p. 645 (8A-2)
Yuan, Kun (University of Texas at Austin)   p. 637 (8A-1)
Yuan, Xingliang (Illinois Institute of Technology)   p. 663 (8B-1)
Yuan, Yu-Han (National Tsing Hua University)   p. 381 (4D-21)
Yuen, Steve C.L. (Department of Electronic Engineering, The Chinese University of Hong Kong)   p. 379 (4D-20)
Yuh, Ping-Hung (National Taiwan University)   p. 517 (6C-1)
Yuya, Hanai (Keio University)   p. 349 (4D-4)

Z

Zamani, Morteza (Amirkabir)   p. 832 (10A-2)
Zarandi, HamidReza (Amirkabir)   p. 832 (10A-2)
Zeng, Jing (Advanced Micro Devices, Inc)   p. 419 (5B-3)
Zhang, Hongbo (University of Illinois at Urbana-Champaign)   p. 838 (10A-3s)
Zhang, Jinyu (Institute of Microelectronics, Tsinghua University)   p. 645 (8A-2)
Zhang, Lihong (Memorial University of Newfoundland)   p. 293 (4B-1)
Zhang, Lihong (Memorial University of Newfoundland)   p. 299 (4B-2)
Zhang, Ling (UCSD)   p. 119 (2B-1)
Zhang, Wanping (Qualcomm Inc./UCSD)   p. 119 (2B-1)
Zhang, Zheng (Department of Electrical and Electronic Engineering, The University of Hong Kong)   p. 43 (1B-4)
Zhao, Wenbo (University of California, San Diego)   p. 125 (2B-2)
Zhao, Xin (Georgia Institute of Technology)   p. 175 (3A-2)
Zhao, Xin (Georgia Institute of Technology)   p. 474 (6A-2)
Zhou, Hai (Northwestern University)   p. 61 (1C-3)
Zhou, Pingqiang (University of Minnesota)   p. 517 (6C-1)
Zhou, Shi-Ting (University of Wisconsin-Madison)   p. 229 (3C-2)
Zhu, Jun (Royal Institute of Technology)   p. 223 (3C-1)
Zhu, Qiang (Cadence Design Systems)   p. 701 (8C-3)
Zhu, Zhi (Qualcomm Inc.)   p. 119 (2B-1)
Zhuo, Cheng (Univ. of Michigan, Ann Arbor)   p. 681 (8B-4)