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The 17th Asia and South Pacific Design Automation Conference

Session 3K  Keynote 3
Time: 11:10 - 12:00 Tuesday, January 31, 2012
Location: Room 204A+204B

3K-1 (Time: 11:10 - 12:00)
Title(Keynote Address) Trends, Challenges and Solutions of Design Ecosystem for 20nm and Beyond
AuthorCliff Hou (Taiwan Semiconductor Manufacturing Co. Ltd., Taiwan)
AbstractIn moving to a new process technology, readiness of the design ecosystem - EDA and IP - plays crucial enabling roles. As the complexity and cost of feature scaling grow, the ecosystem is facing challenges that require collective changes by its constituents to evolve accordingly. In this talk, we will first look at the driving forces behind process technology roadmap. Next we will discuss the trend such roadmap ushers in, as well as the resultant challenges facing the ecosystem as the industry moves toward 20nm. We will then move to propose a collaborative framework under which foundry, EDA and IP vendors and customers partner to address the challenges. Finally, we will offer a preview of the ecosystem beyond 20nm and how collaboration will continue to be adjusted to enable future success.