| Title | (Invited Paper) Robust and Resilient Designs from the Bottom-Up: Technology, CAD, Circuit, and System Issues |
| Author | Vijay J. Reddi, David Z. Pan (University of Texas at Austin, U.S.A.), Sani Nassif (IBM, U.S.A.), Keith A. Bowman (Intel, U.S.A.) |
| Page | pp. 7 - 16 |
| Keyword | resilient |
| Abstract | The semiconductor industry is facing a critical
research challenge: design future high performance and energy
efficient systems while satisfying historical standards for reliability and lower costs. The primary cause of this challenge
is device and circuit parameter variability, which results from
the manufacturing process and system operation. As technology
scales, the adverse impact of these variations on system-level
metrics increases. In this paper, we describe an interdisciplinary
effort toward robust and resilient designs that mitigate the
effects of device and circuit parameter variations in order to
enhance system performance, energy efficiency, and reliability.
Collaboration between the technology, CAD, circuit, and system
levels of the compute hierarchy can foster the development of
cost-effective and efficient solutions. |