Technical Program Committee
Technical Program Chair
Atsushi Takahashi, Tokyo Institute of Technology, Japan
Technical Program Vice Chairs
Taewhan Kim, Seoul National University, Korea
Tohru Ishihara, Kyoto University, Japan
Secretaries
Shimpei Sato, Tokyo Institute of Technology, Japan
Yukihide Kohira, Aizu University, Japan
Chikaaki Kodama, Toshiba Memory, Japan
Subcommittees
* : subcommittee chairs
- [1] System-Level Modeling and Design Methodology
- *Preeti Ranjan Panda, Indian Institute of Technology Delhi, India
- Jing-Jia Liou, National Tsing Hua University, Taiwan
- Masashi Tawada, Waseda University, Japan
- Akash Kumar, Technische Universitaet Dresden, Germany
- Jongeun Lee, UNIST, Korea
- Naehyuck Chang, KAIST, Korea
- Hiroshi Nakamura, University of Tokyo, Japan
- Sri Parameswaran, University of New South Wales, Australia
- Keni Qiu, Capital Normal University, China
- Jing-Jia Liou, National Tsing Hua University, Taiwan
- [2] Embedded System Architecture and Design
- *Wei Zhang, Hong Kong University of Science and Technology, Hong Kong
- Chun-Yi Lee, National Tsing Hua University, Taiwan
- Yongpan Liu, Tsinghua University, China
- Yun Liang, Peking University, China
- Yajun Ha, ShanghaiTech University, China
- Hyung Gyu Lee, Daegu University, Korea
- Ji-Hoon Kim, Seoul National University of Science and Technology, Korea
- Wujie Wen, Florida International University, USA
- Heng Yu, United Arab Emirates University, United Arab Emirates
- Hsiang-Yun Cheng, Academia Sinica, Taiwan
- Chun-Yi Lee, National Tsing Hua University, Taiwan
- [3] On-chip Communication and Networks-on-Chip
- *Mehdi Tahoori, Karlsruhe Institute of Technology, Germany
- Jiang Xu, Hong Kong University of Science and Technology, Hong Kong
- Partha Pande, Washington State University, USA
- Madhu Mutyam, Indian Institute of Technology Madras, India
- John Kim, KAIST, Korea
- Jiang Xu, Hong Kong University of Science and Technology, Hong Kong
- [4] Embedded Software
- *Zili Shao, Hong Kong Polytechnic University, Hong Kong
- Chung-Ta King, National Tsing Hua University, Taiwan
- Sungjoo Yoo, Seoul National University, Korea
- Jalil Boukhobza, University of Western Brittany, France
- Yi Wang, Shenzhen University, China
- Mengying Zhao, Shandong University, China
- Franco Fummi, University of Verona, Italy
- Yuan-Hao Chang, Academia Sinica, Taiwan
- Chung-Ta King, National Tsing Hua University, Taiwan
- [5] Device/Circuit-Level Modeling, Simulation and Verification
- *Jaijeet Roychowdhury, UC Berkeley, USA
- Alper Demir, Koc University, Turkey
- Jason C. Verley, Sandia National Laboratory, USA
- Rajit Manohar, Yale University, USA
- Soumyajit Mandal, Case Western Reserve University, USA
- Markus Olbrich, Leibniz Universität Hannover, Germany
- Mark Po-Hung Lin. National Chung Cheng University, Taiwan
- Alper Demir, Koc University, Turkey
- [6] Power Analysis, Low Power Design, and Thermal Management
- *Chia-Lin Yang. National Taiwan University, Taiwan
- Cheng Zhuo, Zhejiang University, China
- Jae-Joon Kim, Pohang University of Science and Technology, Korea
- Masaaki Kondo, University of Tokyo, Japan
- Koji Inoue, Kyushu University, Japan
- Sheldon Tan, University of California at Riverside, USA
- Soo Youn Kim, Dongguk University, Korea
- Tsung-Te Liu, National Taiwan University, Taiwan
- Joonho Kong, Kyungpook National University, Korea
- Cheng Zhuo, Zhejiang University, China
- [7] Logic/High-Level Synthesis and Optimization
- *Zhiru Zhang, Cornell University, USA
- Shouyi Yin, Tsinghua University, China
- Fabrizio Ferrandi, Politecnico di Milano, Italy
- Seiya Shibata, NEC, Japan
- Benjamin Carrion Schafer, The University of Texas at Dallas, USA
- Jie-Hong Roland Jiang, National Taiwan University, Taiwan
- Shouyi Yin, Tsinghua University, China
- [8] Physical Design
- *Yasuhiro Takashima, University of Kitakyushu, Japan
- Seokhyeong Kang, Ulsan National Institute of Science and Technology, Korea
- Hyung-Ock Kim, Samsung Electronics, Korea
- Hung-Ming Chen, National Chiao Tung University, Taiwan
- Masato Inagi, Hiroshima City University, Japan
- Sheqin Dong, Tsinghua University, China
- Seokhyeong Kang, Ulsan National Institute of Science and Technology, Korea
- [9] Design for Manufacturability and Reliability
- *Xuan Zeng, Fudan University, China
- *Masanori Hashimoto, Osaka University, Japan
- Martin Wong , University of Illinois at Urbana-Champaign, USA
- Charles Chiang, Synopsys, Inc., USA
- Yukihide Kohira, Aizu University, Japan
- Ting-Chi Wang, National Tsing Hua University, Taiwan
- Tetsuaki Matsunawa, Toshiba Memory, Japan
- Takashi Sato, Kyoto University, Japan
- Bong Hyun Lee, Samsung, Korea
- *Masanori Hashimoto, Osaka University, Japan
- [10] Test and Design for Testability
- *Jin-Fu Li, National Central University, Taiwan
- Satoshi Ohtake, Oita University, Japan
- Kohei Miyase, Kyushu Institute of Technology, Japan
- Seetal Potluri , Xilinx Asia Pacific Pte. Ltd., Singapore
- Ying Zhang, Tongji University, China
- Satoshi Ohtake, Oita University, Japan
- [11] Security and Fault-Tolerant System
- *Yier Jin, University of Florida, USA
- Jakub Szefer, Yale University, USA
- Fareena Saqib, The University of North Carolina at Charlotte, USA
- Estelle Wang, Continental Automotive, Singapore
- Qiaoyan Yu, University of New Hampshire, USA
- Gang Qu, Unviersity of Maryland, USA
- Xiaoxiao Wang, Beihang University, China
- Li Shang, University of Colorado Boulder, USA
- Bei Yu, Chinese University at Hong Kong, Hong Kong
- Jakub Szefer, Yale University, USA
- [12] Emerging Technology
- *Yiran Chen, Duke University, USA
- Danghui Wang, Northwestern Polytechnical University, China
- Shigeru Yamashita, Ritsumeikan University, Japan
- Deliang Fan, University of Central Florida, USA
- Po-Chun Huang, Yuan Ze University, Taiwan
- Jianlei Yang, Beihang University, China
- Li Jiang, Shanghai Jiao Tong University, China
- Pingqiang Zhou, ShanghaiTech University, China
- Danghui Wang, Northwestern Polytechnical University, China
- [13] Emerging Application
- *Tsung-Yi Ho, National Tsing Hua University, Taiwan
- Masanori Muroyama, Tohoku University, Japan
- Noboru Yoneoka, Fujitsu Laboratories Ltd., Japan
- Hailong Yao, Tsinghua University, China
- Yanzhi Wang , Syracuse University, USA
- Sehwan Kim, Dankook University, Korea
- Younghyun Kim, University of Wisconsin–Madison, USA
- Sudip Roy, Indian Institute of Technology Roorkee, India
- Masanori Muroyama, Tohoku University, Japan