Technical Program Committee

Technical Program Chair

Iris Hui-Ru Jiang (National Taiwan University)

TPC Vice-Chairs

Yu Wang (Tsinghua University)

Dongsuk Jeon (Seoul National University)

Secretaries

Yu-Guang Chen (National Central University)

Chung-Wei Lin (National Taiwan University)

Jun Shiomi (Osaka University)

Subcommittees

* : subcommittee chairs

[1] System-Level Modeling and Design Methodologies: *Sri Parameswaran (University of Sydney); Hasindu Gamaarachchi (University of New South Wales); Jiang Xu (Hong Kong University of Science and Technology); Tuo Li (Chinese Academy of Sciences); Baris Aksanli (San Diego State University); Haris Javaid (AMD Xilinx- Singapore); Jing-Jia Liou (National Tsing Hua University); Yaoyao Ye (Shanghai Jiao Tong University); Ihsen Alouani (Queen’s University)
[2] Embedded, Cyberphysical (CSP), IoT Systems and Software: *Wenchao Li (Boston University); Chung-Wei Lin (National Taiwan University); Xin Chen (University of New Mexico); BaekGyu Kim (Daegu Gyeongbuk Institute of Science and Technology); Wanli Chang (Hunan University); Qi Zhu (Northwestern University); Fang-Jing Wu (National Taiwan University)
[3] Memory Architecture and Near/In Memory Computing: *Yuan-Hao Chang (Academia Sinica); Chien-Chung Ho (National Cheng Kung University); Po-Chun Huang (National Taipei University of Technology); Tseng-Yi Chen (National Central University); Yu-Pei Liang (National Chung Cheng University); Chenchen Fu (Southeast University); Hsiang-Yun Cheng (Academia Sinica); Qiao Li (Xiamen University); Chin-Hsien Wu (National Taiwan University of Science and Technology); Xianzhang Chen (Chongqing University); Ya-Shu Chen (National Taiwan University of Science and Technology); Ming-Chang Yang (The Chinese University of Hong Kong); Ren-Shuo Liu (National Tsing Hua University); Kuan-Hsun Chen (University of Twente)
[4] Tools and Design Methods with and for AI: *Yu Wang (Tsinghua University); Guangyu Sun (Peking University); Dongsuk Jeon (Seoul National University); Xiaoming Chen (Chinese Academy of Sciences); Liangzhen Lai (Meta); Cong Hao (Georgia Institute of Technology); M. Hassan Najafi (University of Louisiana at Lafayette); Wujie Wen (Lehigh University); Sitao Huang (University of California Irvine)
[5] Hardware Systems and Architectures for AI: *Yiran Chen (Duke University); Hao Yu (Southern University of Science and Technology); Xiongfei Liao (MediaTek); Fan Chen (Indiana University Bloomington); Jae-Joon Kim (Seoul National University); Li Zhang (Technische Universitat Darmstadt); Jongsun Park (Korea University); Mohamed M. Sabry Aly (Nanyang Technological University)
[6] Photonic/RF/Analog-Mixed Signal Design: *Yasuhiro Takashima (University of Kitakyushu); Hung-Ming Chen (National Yang Ming Chiao Tung University); Mark Po-Hung Lin (National Yang Ming Chiao Tung University); Akira Tsuchiya (The University of Shiga Prefecture); Ryosuke Matsuo (Osaka University); Markus Olbrich (Leibniz University Hannover)
[7] Approximate, Bio-inspired and Neuromorphic Computing: *Benjamin Carrion Schaefer (The University of Texas at Dallas); Kyuho Lee (Ulsan National Institute of Science and Technology); Chun-Feng Wu (National Yang Ming Chiao Tung University); Yue Zhang (Beihang University); Yutaka Matsuda (Nagoya University); Yung-Chih Chen (National Taiwan University of Science and Technology); Can Li (The University of Hong Kong)
[8] High-Level, Behavioral, and Logic Synthesis and Optimization: *Jie-Hong Roland Jiang (National Taiwan University); Kazutoshi Wakabayashi (The University of Tokyo); Victor Kravets (IBM); Kenshu Seto (Kumamoto University); Shih-Hsu Huang (Chung Yuan Christian University)
[9] Physical Design and Timing Analysis: *Wen-Hao Liu (Cadence); Pingqiang Zhou (ShanghaiTech University); Pei-Yu Lee (Synopsys); Tung-Chieh Chen (Maxeda Technology); Jingwei Lu (Amazon); Wenxing Zhu (Fuzhou University); Masato Inagi (Hiroshima City University); Taigon Song (Kyungpook National University); Chia-Tung Ho (Nvidia); Daijoon Hyun (Cheong-Ju University); Yu-Guang Chen (National Central University); Kuan-Yu Liao (Synopsys)
[10] Design for Manufacturability/Reliability and Low Power: *Bei Yu (The Chinese University of Hong Kong); Cheng Zhuo (Zhejiang University); William Fornaciari (Politecnico Milano); Hao Geng (ShanghaiTech University); Qi Sun (Cornell University); Yukihide Kohira (The University of Aizu); Jun Shiomi (Osaka University); Yuzhe Ma (HKUST-GZ); Fan Yang (Fudan University); Mohsen Ansari (Sharif University of Technology)
[11] Testing, Validation, Simulation, and Verification: *Hung-Pin Wen (National Yang Ming Chiao Tung University); Shi-Yu Huang (National Tsing Hua University); Harry Chen (Mediatek); Michiko Inoue (Nara Institute of Science and Technology); Tsung-Chu Huang (National Changhua University of Education); Haruo Kobayashi (Gunma University)
[12] Hardware and Embedded Security: *Gang Qu (University of Maryland); Makoto Ikeda (University of Tokyo); Prasanna Ravi (Nanyang Technological University); Sying-Jyan Wang (National Chung Hsing University); Tsung-Te Liu (National Taiwan University); Kaveh Shamsi (University of Texas at Dallas); Daisuke Fujimoto (Nara Institute of Science and Technology); Amin Rezaei (California State University at Long Beach); Yongqiang Lyu (Tsinghua University); Xiaolin Xu (Northeastern University); Pengfei Qiu (Beijing University of Posts and Telecommunications)
[13] Emerging Devices, Technologies and Applications: *Takashi Sato (Kyoto University); Indranil Sengupta (IIT Kharagpur); Sudip Roy (Indian Institute of Technology (IIT) Roorkee); Swaroop Ghosh (Penn State University); Anupam Chattopadhyay (Nanyang Technological University); Shigeru Yamashita (Ritsumeikan University); Younghyun Kim (University of Wisconsin-Madison); Hailong Yao (University of Science and Technology Beijing); Yawen Wu (University of Pittsburgh); Hiromitsu Awano (Kyoto University)