Title | (Invited Paper) Challenges in Integration of Diverse Functionalities on CMOS |
Author | *Kazuya Masu, Noboru Ishihara (Tokyo Inst. of Tech., Japan), Toshifumi Konishi (NTT-AT, Japan), Katsuyuki Machida (Tokyo Inst. of Tech., Japan), Hiroshi Toshiyoshi (Univ. of Tokyo, Japan) |
Page | pp. 390 - 393 |
Detailed information (abstract, keywords, etc) |
Title | (Invited Paper) 3DIC from Concept to Reality |
Author | Frank Lee, Bill Shen, Willy Chen, *Suk Lee (Taiwan Semiconductor Manufacturing Company, Taiwan) |
Page | pp. 394 - 398 |
Detailed information (abstract, keywords, etc) |
Title | (Invited Paper) 2.5D Design Methodology |
Author | *Sinya Tokunaga (STARC, Japan) |
Page | pp. 399 - 402 |
Detailed information (abstract, keywords, etc) |
Title | (Invited Paper) Design Issues in Heterogeneous 3D/2.5D Integration |
Author | *Dragomir Milojevic, Pol Marchal, Erik Jan Marinissen, Geert Van der Plas, Diederik Verkest, Eric Beyne (IMEC, Belgium) |
Page | pp. 403 - 410 |
Detailed information (abstract, keywords, etc) |