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The 18th Asia and South Pacific Design Automation Conference

Session 5A  Designers' Forum: Heterogeneous Devices and Multi-Dimensional Integration Design Technologies
Time: 13:40 - 15:40 Thursday, January 24, 2013
Organizer: Akihiko Okubora (Sony, Japan)

5A-1 (Time: 13:40 - 14:10)
Title(Invited Paper) Challenges in Integration of Diverse Functionalities on CMOS
Author*Kazuya Masu, Noboru Ishihara (Tokyo Inst. of Tech., Japan), Toshifumi Konishi (NTT-AT, Japan), Katsuyuki Machida (Tokyo Inst. of Tech., Japan), Hiroshi Toshiyoshi (Univ. of Tokyo, Japan)
Pagepp. 390 - 393
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5A-2 (Time: 14:10 - 14:40)
Title(Invited Paper) 3DIC from Concept to Reality
AuthorFrank Lee, Bill Shen, Willy Chen, *Suk Lee (Taiwan Semiconductor Manufacturing Company, Taiwan)
Pagepp. 394 - 398
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5A-3 (Time: 14:40 - 15:10)
Title(Invited Paper) 2.5D Design Methodology
Author*Sinya Tokunaga (STARC, Japan)
Pagepp. 399 - 402
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5A-4 (Time: 15:10 - 15:40)
Title(Invited Paper) Design Issues in Heterogeneous 3D/2.5D Integration
Author*Dragomir Milojevic, Pol Marchal, Erik Jan Marinissen, Geert Van der Plas, Diederik Verkest, Eric Beyne (IMEC, Belgium)
Pagepp. 403 - 410
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