| Title | Reevaluating the Latency Claims of 3D Stacked Memories |
| Author | *Daniel W. Chang (Univ. of Wisconsin, Madison, U.S.A.), Gyungsu Byun (West Virginia Univ., U.S.A.), Hoyoung Kim, Minwook Ahn, Soojung Ryu (Samsung Electronics Co., Ltd., Republic of Korea), Nam S. Kim, Michael Schulte (Univ. of Wisconsin, Madison, U.S.A.) |
| Page | pp. 657 - 662 |
| Detailed information (abstract, keywords, etc) | |
| Slides | |
| Title | Heterogeneous Memory Management for 3D-DRAM and External DRAM with QoS |
| Author | *Le-Nguyen Tran (Univ. of California, Irvine, U.S.A.), Houman Homayoun (George Mason Univ., U.S.A.), Fadi J. Kurdahi, Ahmed M. Eltawil (Univ. of California, Irvine, U.S.A.) |
| Page | pp. 663 - 668 |
| Detailed information (abstract, keywords, etc) | |
| Title | Line Sharing Cache: Exploring Cache Capacity with Frequent Line Value Locality |
| Author | *Keitarou Oka, Hiroshi Sasaki, Koji Inoue (Kyushu Univ., Japan) |
| Page | pp. 669 - 674 |
| Detailed information (abstract, keywords, etc) | |
| Slides | |
| Title | ShieldUS: A Novel Design of Dynamic Shielding for Eliminating 3D TSV Crosstalk Coupling Noise |
| Author | *Yuan-Ying Chang, Yoshi Shih-Chieh Huang (National Tsing Hua Univ., Taiwan), Vijaykrishnan Narayanan (Pennsylvania State Univ., U.S.A.), Chung-Ta King (National Tsing Hua Univ., Taiwan) |
| Page | pp. 675 - 680 |
| Detailed information (abstract, keywords, etc) | |
| Slides | |