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The 13th Asia and South Pacific Design Automation Conference

Session 5C  Thermal Analysis and DFM
Time: 13:30 - 15:35 Wednesday, January 23, 2008
Location: Room 311A
Chairs: Takashi Sato (Tokyo Inst. of Tech., Japan), Hideki Asai (Shizuoka Univ., Japan)

5C-1 (Time: 13:30 - 13:55)
TitleArchitecture-level Thermal Behavioral Characterization For Multi-Core Microprocessors
AuthorDuo Li, *Sheldon X.-D. Tan (Univ. of California, Riverside, United States), Murli Tirumala (Intel, United States)
Pagepp. 456 - 461
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5C-2 (Time: 13:55 - 14:20)
TitleFull-Chip Thermal Analysis for the Early Design Stage via Generalized Integral Transforms
Author*Pei-Yu Huang, Chih-Kang Lin, Yu-Min Lee (Nat'l Chiao Tung Univ., Taiwan)
Pagepp. 462 - 467
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5C-3 (Time: 14:20 - 14:45)
TitleA Stochastic Local Hot Spot Alerting Technique
AuthorHwisung Jung, *Massoud Pedram (Univ. of Southern California, United States)
Pagepp. 468 - 473
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5C-4 (Time: 14:45 - 15:10)
TitleDesign Rule Optimization of Regular layout for Leakage Reduction in Nanoscale Design
AuthorAnupama R. Subramaniam, Ritu Singhal, *Chi-Chao Wang, Yu Cao (Arizona State Univ., United States)
Pagepp. 474 - 479
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5C-5 (Time: 15:10 - 15:35)
TitleInvestigation of Diffusion Rounding for Post-Lithography Analysis
AuthorPuneet Gupta (Univ. of California, Los Angles, United States), Andrew B. Kahng (Univ. of California, San Diego, United States), *Youngmin Kim (Univ. of Michigan, Ann Arbor, United States), Saumil Shah (Blaze-DFM, United States), Dennis Sylvester (Univ. of Michigan, Ann Arbor, United States)
Pagepp. 480 - 485
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