Title | Architecture-level Thermal Behavioral Characterization For Multi-Core Microprocessors |
Author | Duo Li, *Sheldon X.-D. Tan (Univ. of California, Riverside, United States), Murli Tirumala (Intel, United States) |
Page | pp. 456 - 461 |
Detailed information (abstract, keywords, etc) |
Title | Full-Chip Thermal Analysis for the Early Design Stage via Generalized Integral Transforms |
Author | *Pei-Yu Huang, Chih-Kang Lin, Yu-Min Lee (Nat'l Chiao Tung Univ., Taiwan) |
Page | pp. 462 - 467 |
Detailed information (abstract, keywords, etc) |
Title | A Stochastic Local Hot Spot Alerting Technique |
Author | Hwisung Jung, *Massoud Pedram (Univ. of Southern California, United States) |
Page | pp. 468 - 473 |
Detailed information (abstract, keywords, etc) |
Title | Design Rule Optimization of Regular layout for Leakage Reduction in Nanoscale Design |
Author | Anupama R. Subramaniam, Ritu Singhal, *Chi-Chao Wang, Yu Cao (Arizona State Univ., United States) |
Page | pp. 474 - 479 |
Detailed information (abstract, keywords, etc) |
Title | Investigation of Diffusion Rounding for Post-Lithography Analysis |
Author | Puneet Gupta (Univ. of California, Los Angles, United States), Andrew B. Kahng (Univ. of California, San Diego, United States), *Youngmin Kim (Univ. of Michigan, Ann Arbor, United States), Saumil Shah (Blaze-DFM, United States), Dennis Sylvester (Univ. of Michigan, Ann Arbor, United States) |
Page | pp. 480 - 485 |
Detailed information (abstract, keywords, etc) |