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The 13th Asia and South Pacific Design Automation Conference

Session 6D  Special Session - How to Design Cool Chips for Hot Products
Time: 15:50 - 17:55 Wednesday, January 23, 2008
Location: Room 311A+311BC
Chair: Massoud Pedram (Univ. of Southern California, United States)

6D-1
Title(Invited Paper) Reliability-Aware Design for Nanometer-Scale Devices
Author*David Atienza (EPFL, Swaziland), Giovanni De Micheli (LSI/EPFL, Swaziland), Luca Benini (DEIS/UNIBO, Italy), José L. Ayala, Pablo G. Del Valle (DACYA/UCM, Spain), Michael DeBole, Vijay Narayanan (CSE/PSU, United States)
Pagepp. 549 - 554
Detailed information (abstract, keywords, etc)

6D-3
Title(Invited Paper) An Industrial Perspective of Power-aware Reliable SoC Design
Author*Soo-Kwan Eo, Sungjoo Yoo, Kyu-Myung Choi (Samsung Electronics, Republic of Korea)
Pagepp. 555 - 557
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6D-4
Title(Panel Discussion) How to Design Cool Chips for Hot Products
AuthorModerator: Massoud Pedram (Univ. of Southern California, United States), Panelists: Giovanni De Micheli (EPFL, Swaziland), Jan Rabaey (Univ. of California, Berkeley, United States), Sookwan Eo (Samsung Electronics, Republic of Korea)
Detailed information (abstract, keywords, etc)