Title | (Invited Paper) Reliability-Aware Design for Nanometer-Scale Devices |
Author | *David Atienza (EPFL, Swaziland), Giovanni De Micheli (LSI/EPFL, Swaziland), Luca Benini (DEIS/UNIBO, Italy), José L. Ayala, Pablo G. Del Valle (DACYA/UCM, Spain), Michael DeBole, Vijay Narayanan (CSE/PSU, United States) |
Page | pp. 549 - 554 |
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Title | (Invited Paper) An Industrial Perspective of Power-aware Reliable SoC Design |
Author | *Soo-Kwan Eo, Sungjoo Yoo, Kyu-Myung Choi (Samsung Electronics, Republic of Korea) |
Page | pp. 555 - 557 |
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Title | (Panel Discussion) How to Design Cool Chips for Hot Products |
Author | Moderator: Massoud Pedram (Univ. of Southern California, United States), Panelists: Giovanni De Micheli (EPFL, Swaziland), Jan Rabaey (Univ. of California, Berkeley, United States), Sookwan Eo (Samsung Electronics, Republic of Korea) |
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