特別セッション
- 日程: 2009年1月20 ~ 22日
- 会場: パシフィコ横浜・会議センター 4階
日時 | タイトル | |
1D | 1月20日(火)/ 10:15~12:20 |
講演・ポスター: "ユニバーシティLSIデザインコンテスト" |
2D | 1月20日(火)/ 13:30~15:35 |
招待講演: "EDA Acceleration Using New Architectures" |
3D | 1月20日(火)/ 15:55~18:00 |
招待講演: "Hardware Dependent Software for Multi- and Many-Core Embedded Systems" |
4D | 1月21日(水)/ 10:15-12:20 |
招待講演: "Challenges in 3D Integrated Circuit Design" |
9D | 1月22日(木)/ 15:55-18:00 |
招待講演・パネル討論: "Dependable VLSI: Device, Design and Architecture - How should they cooperate ? -" |
1D : 1月20日(火) 10:15~12:20
講演・ポスター: "ユニバーシティLSIデザインコンテスト"
2D : 1月20日(火) 13:30~15:35
- 招待講演: "EDA Acceleration Using New Architectures"
- Organizer: Damir A. Jamsok (IBM Corp., United States)
- 2D-1: Aspects of GPU for General Purpose High Performance Computing
- Reiji Suda (Univ. of Tokyo/JST CREST, Japan), Takayuki Aoki (Tokyo Inst. of Tech./JST CREST, Japan), Shoichi Hirasawa (Univ. of Electro-Communications/JST CREST, Japan), Akira Nukada (Tokyo Inst. of Tech./JST CREST, Japan), Hiroki Honda (Univ. of Electro-Communications/JST CREST, Japan), Satoshi Matsuoka (Tokyo Inst. of Tech./JST CREST/NII, Japan) - 2D-2 : Designing and Optimizing Compute Kernels on Nvidia GPUs
- Damir A. Jamsek (IBM Research, United States) - 2D-3 : Parallelizing Fundamental Algorithms such as Sorting on Multi-core Processors for EDA Acceleration
- Masato Edahiro (NEC Corp./Univ. of Tokyo, Japan)
- 2D-1: Aspects of GPU for General Purpose High Performance Computing
3D : 1月20日(火) 15:55~18:00
- 招待講演: "Hardware Dependent Software for Multi- and Many-Core Embedded Systems"
- 3D-1: Introduction to Hardware-dependent Software Design
- Rainer Dömer (Univ. of California, Irvine, United States), Andreas Gerstlauer (Univ. of Texas, Austin, United States), Wolfgang Müller (Univ. of Paderborn, Germany) - 3D-2: Using a Dataflow abstracted Virtual Prototype for HdS-Design
- Wolfgang Ecker, Stefan Heinen (Infineon Technologies AG, Germany) - 3D-3: Needs and Trends in Embedded Software Development for Consumer Electronics
- Yasutaka Tsunakawa (Sony Corp., Japan) - 3D-4: Hardware-dependent Software Synthesis for Many-Core Embedded Systems
- Samar Abdi, Gunar Schirner, Ines Viskic, Hansu Cho, Yonghyun Hwang, Lochi Yu, Daniel Gajski (Univ.~of California, Irvine, United States)
- 3D-1: Introduction to Hardware-dependent Software Design
4D : 1月21日(水) 10:15~12:20
- 招待講演: "Challenges in 3D Integrated Circuit Design"
- 4D-1: Three-Dimensional Integration Technology and Integrated Systems
- Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka (Tohoku Univ., Japan) - 4D-2: A 3D Prototyping Chip based on a Wafer-level Stacking Technology
- Nobuaki Miyakawa (Honda Research Institute, Japan) - 4D-3: Design and CAD Challenges for 3D ICs
- David Kung, Ruchir Puri (IBM Corp., United States) - 4D-4: Addressing Thermal and Power Delivery Bottlenecks in 3D Circuits
- Sachin S. Sapatnekar (Univ.~of Minnesota, United States) - 4D-5: The Road to 3D Readiness of EDA Tool Readiness
- Charles Chiang, Subarna Sinha (Synopsys, United States)
- 4D-1: Three-Dimensional Integration Technology and Integrated Systems
9D : 1月22日(木) 15:55-18:00
- 招待講演・パネル討論: "Dependable VLSI: Device, Design and Architecture - How should they cooperate ? -"
Organizer: Shuichi Sakai (Univ. of Tokyo, Japan) Panelists: Hidetoshi Onodera (Kyoto Univ., Japan)
Hiroto Yasuura (Kyushu Univ., Japan)
James C. Hoe (Carnegie Mellon Univ., United States)