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The 16th Asia and South Pacific Design Automation Conference

Session 9D  Designers' Forum: Advanced Packaging and 3D Technologies
Time: 16:00 - 18:00 Friday, January 28, 2011
Location: Room 416+417
Organizer: Yoshio Masubuchi (Toshiba, Japan)

9D-1 (Time: 16:00 - 17:30)
Title(Panel Discussion) Advanced Packaging and 3D Technologies
AuthorOrganizer: Yoshio Masubuchi (Toshiba, Japan), Moderator: Kenichi Osada (Hitachi, Japan), Panelists: Geert Van der Plas (IMEC, Belgium), Hirokazu Ezawa (Toshiba, Japan), Yasumitsu Orii (IBM, Japan), Yoichi Hiruta (J-Devices, Japan), Chris Cheung (Cadence Design Systems, U.S.A.)
Abstract3D packaging is a key technology to satisfy a growing demand to realize highly integrated system and memory. The panel session explores the technologies of three dimensional stacked chips and discusses the challenges to design and test of such integrated chips.