| Title | (Panel Discussion) Advanced Packaging and 3D Technologies |
| Author | Organizer: Yoshio Masubuchi (Toshiba, Japan), Moderator: Kenichi Osada (Hitachi, Japan), Panelists: Geert Van der Plas (IMEC, Belgium), Hirokazu Ezawa (Toshiba, Japan), Yasumitsu Orii (IBM, Japan), Yoichi Hiruta (J-Devices, Japan), Chris Cheung (Cadence Design Systems, U.S.A.) |
| Abstract | 3D packaging is a key technology to satisfy a growing demand to realize highly integrated system and memory. The panel session explores the technologies of three dimensional stacked chips and discusses the challenges to design and test of such integrated chips. |
| Slides | |