(Back to Session Schedule)

The 17th Asia and South Pacific Design Automation Conference

Session S1  Special Session 1: Robust and Resilient Designs from the Bottom-Up: Technology, CAD, Circuit, and System Issues
Time: 14:00 - 15:40 Tuesday, January 31, 2012
Location: Room 204A
Chair: Martin D.F. Wong (Univ. of Illinois, Urbana-Champaign, U.S.A.)

S1-1
Title(Invited Paper) Robust and Resilient Designs from the Bottom-Up: Technology, CAD, Circuit, and System Issues
AuthorVijay J. Reddi, David Z. Pan (Univ. of Texas, Austin, U.S.A.), Sani Nassif (IBM, U.S.A.), Keith A. Bowman (Intel, U.S.A.)
Pagepp. 7 - 16
Detailed information (abstract, keywords, etc)

S1-2 (Time: 14:00 - 14:25)
Title(Invited Paper) Technology Challenges beyond 22nm
Author*Sani Nassif (IBM, U.S.A.)
Detailed information (abstract, keywords, etc)

S1-3 (Time: 14:25 - 14:50)
Title(Invited Paper) Physical CAD for Robust Designs
Author*David Z. Pan (Univ. of Texas, Austin, U.S.A.)
Detailed information (abstract, keywords, etc)

S1-4 (Time: 14:50 - 15:15)
Title(Invited Paper) Resilient Circuit Design Trade-Offs for Improving Performance & Energy Efficiency
Author*Keith A. Bowman (Intel, U.S.A.)
Detailed information (abstract, keywords, etc)

S1-5 (Time: 15:15 - 15:40)
Title(Invited Paper) Coordinated System Design for Resiliency
Author*Vijay J. Reddi (Univ. of Texas, Austin, U.S.A.)
Detailed information (abstract, keywords, etc)