Title | High-Density Integration of Functional Modules Using Monolithic 3D-IC Technology |
Author | *Shreepad Panth (Georgia Tech, U.S.A.), Kambiz Samadi, Yang Du (Qualcomm Research, U.S.A.), Sung Kyu Lim (Georgia Tech, U.S.A.) |
Page | pp. 681 - 686 |
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Title | Block-level Designs of Die-to-Wafer Bonded 3D ICs and Their Design Quality Tradeoffs |
Author | *Krit Athikulwongse (Georgia Tech, U.S.A.), Dae Hyun Kim (Cadence, U.S.A.), Moongon Jung, Sung Kyu Lim (Georgia Tech, U.S.A.) |
Page | pp. 687 - 692 |
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Title | Thermal-reliable 3D Clock-tree Synthesis Considering Nonlinear Electrical-thermal-coupled TSV Model |
Author | Yang Shang, Chun Zhang, *Hao Yu, Chuan Seng Tan (Nanyang Technological Univ., Singapore), Xin Zhao, Sung Kyu Lim (Georgia Tech, U.S.A.) |
Page | pp. 693 - 698 |
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Title | Stacking Signal TSV for Thermal Dissipation in Global Routing for 3D IC |
Author | *Po-Yang Hsu, Hsien-Te Chen, TingTing Hwang (National Tsing Hua Univ., Taiwan) |
Page | pp. 699 - 704 |
Detailed information (abstract, keywords, etc) | |
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