Special Session

  • Date: January 20 - 22, 2009
  • Place: Pacifico Yokohama, Conference Center, 4F
Date/Time Title
1D Tuesday, January 20/
10:15-12:20
Presentation + Poster Discussion: "University LSI Design Contest"
2D Tuesday, January 20/
13:30-15:35
Invited Talks: "EDA Acceleration Using New Architectures"
3D Tuesday, January 20/
15:55-18:00
Invited Talks: "Hardware Dependent Software for Multi- and Many-Core Embedded Systems"
4D Wednesday, January 21/
10:15-12:20
Invited Talks: "Challenges in 3D Integrated Circuit Design"
9D Thursday, January 22/
15:55-18:00
Invited Talks + Panel Discussion: "Dependable VLSI: Device, Design and Architecture - How should they cooperate ? -"

1D : Tuesday, January 20, 10:15-12:20

Presentation + Poster Discussion: "University LSI Design Contest"

2D : Tuesday, January 20, 13:30-15:35

Invited Talks: "EDA Acceleration Using New Architectures"
Organizer: Damir A. Jamsok (IBM Corp., United States)
  • 2D-1 : Aspects of GPU for General Purpose High Performance Computing
    - Reiji Suda (Univ. of Tokyo/JST CREST, Japan), Takayuki Aoki (Tokyo Inst. of Tech./JST CREST, Japan), Shoichi Hirasawa (Univ. of Electro-Communications/JST CREST, Japan), Akira Nukada (Tokyo Inst. of Tech./JST CREST, Japan), Hiroki Honda (Univ. of Electro-Communications/JST CREST, Japan), Satoshi Matsuoka (Tokyo Inst. of Tech./JST CREST/NII, Japan)
  • 2D-2 : Designing and Optimizing Compute Kernels on Nvidia GPUs
    - Damir A. Jamsek (IBM Research, United States)
  • 2D-3 : Parallelizing Fundamental Algorithms such as Sorting on Multi-core Processors for EDA Acceleration
    - Masato Edahiro (NEC Corp./Univ. of Tokyo, Japan)

3D : Tuesday, January 20, 15:55-18:00

Invited Talks: "Hardware Dependent Software for Multi- and Many-Core Embedded Systems"
  • 3D-1: Introduction to Hardware-dependent Software Design
    - Rainer Dömer (Univ. of California, Irvine, United States), Andreas Gerstlauer (Univ. of Texas, Austin, United States), Wolfgang Müller (Univ. of Paderborn, Germany)
  • 3D-2: Using a Dataflow abstracted Virtual Prototype for HdS-Design
    - Wolfgang Ecker, Stefan Heinen (Infineon Technologies AG, Germany)
  • 3D-3: Needs and Trends in Embedded Software Development for Consumer Electronics
    - Yasutaka Tsunakawa (Sony Corp., Japan)
  • 3D-4: Hardware-dependent Software Synthesis for Many-Core Embedded Systems
    - Samar Abdi, Gunar Schirner, Ines Viskic, Hansu Cho, Yonghyun Hwang, Lochi Yu, Daniel Gajski (Univ.~of California, Irvine, United States)

4D : Wednesday, January 21, 10:15-12:20

Invited Talks: "Challenges in 3D Integrated Circuit Design"
  • 4D-1: Three-Dimensional Integration Technology and Integrated Systems
    - Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka (Tohoku Univ., Japan)
  • 4D-2: A 3D Prototyping Chip based on a Wafer-level Stacking Technology
    - Nobuaki Miyakawa (Honda Research Institute, Japan)
  • 4D-3: Design and CAD Challenges for 3D ICs
    - David Kung, Ruchir Puri (IBM Corp., United States)
  • 4D-4: Addressing Thermal and Power Delivery Bottlenecks in 3D Circuits
    - Sachin S. Sapatnekar (Univ.~of Minnesota, United States)
  • 4D-5: The Road to 3D Readiness of EDA Tool Readiness
    - Charles Chiang, Subarna Sinha (Synopsys, United States)

9D : Thursday, January 22, 15:55-18:00

Invited Talks + Panel Discussion: "Dependable VLSI: Device, Design and Architecture - How should they cooperate ? -"
Organizer: Shuichi Sakai (Univ. of Tokyo, Japan)
Panelists: Hidetoshi Onodera (Kyoto Univ., Japan)
Hiroto Yasuura (Kyushu Univ., Japan)
James C. Hoe (Carnegie Mellon Univ., United States)

Last Updated on: 10 30, 2008