(Back to Session Schedule)

The 18th Asia and South Pacific Design Automation Conference

Session 2C  Simulation for Thermal and Power Grid Analysis
Time: 13:40 - 15:40 Wednesday, January 23, 2013
Chair: Youngsoo Shin (Korea Advanced Institute of Science and Technology, Republic of Korea)

2C-1 (Time: 13:40 - 14:10)
TitleI-LUTSim: An Iterative Look-Up Table Based Thermal Simulator for 3-D ICs
Author*Chi-Wen Pan, Yu-Min Lee (National Chiao Tung University, Taiwan), Pei-Yu Huang (Industrial Technology Research Institute, Taiwan), Chi-Ping Yang (National Chiao Tung University, Taiwan), Chang-Tzu Lin, Chia-Hsin Lee, Yung-Fa Chou, Ding-Ming Kwai (Industrial Technology Research Institute, Taiwan)
Pagepp. 151 - 156
Keyword3-D, IC, Thermal, Simulator, Table
AbstractThis work presents an iterative look-up table based thermal simulator, I-LUTSim, to efficiently estimate the temperature profile of three-dimensional integrated circuits. I-LUTSim includes two stages. First, the pre-process stage constructs thermal impulse response tables. Then, the simulation stage iteratively calculates the temperature profile via the table lookup. With this two-stage scheme, the maximum absolute error of I-LUTSim is less than 0.41% compared with that of a commercial tool ANSYS. Moreover, I-LUTSim is at least an order of magnitude faster than a fast matrix solver SuperLU for the full-chip temperature simulation.
Slides

2C-2 (Time: 14:10 - 14:40)
TitleCompact Nonlinear Thermal Modeling of Packaged Integrated Systems
Author*Zao Liu, Sheldon X.-D. Tan, Hai Wang (University of California, Riverside, U.S.A.), Ashish Gupta (Intel Corporation, U.S.A.), Sahana Swarup (University of California, Riverside, U.S.A.)
Pagepp. 157 - 162
KeywordThermal modeling, Nonlinear, Subspace identification
AbstractThis paper proposes a new thermal nonlinear modeling technique for packaged integrated systems. Thermal behavior of complicated systems like packaged electronic systems may exhibit nonlinear and temperature dependent properties. As a result, it is difficult to use a low order linear model to approximate the thermal behavior of the packaged integrated systems without accuracy loss. In this paper, we try to mitigate this problem by using piecewise linear (PWL) approach to characterizing the thermal behavior of those systems. The new method (called ThermSubPWL), which is the first proposed approach to nonlinear thermal modeling problem, identifies the linear local models for different temperature ranges using the subspace identification method. A linear transformation method is proposed to transform all the identified linear local models to the common state basis to build the continuous piecewise linear model. Experimental results validate the proposed method on a realistic packaged integrated system modeled via the multidomain/physics commercial tool, COMSOL, under practical power signal inputs. The new piecewise models can lead to much smaller model order without accuracy loss, which translates to significant savings in both the simulation time and the time required to identify the reduced models compared to applying the high order models.
Slides

2C-3 (Time: 14:40 - 15:10)
TitleA Multilevel H-matrix-based Approximate Matrix Inversion Algorithm for Vectorless Power Grid Verification
AuthorWei Zhao, Yici Cai, *Jianlei Yang (Dept. of Computer Science and Technology, Tsinghua University, China)
Pagepp. 163 - 168
KeywordPower grid, Vectorless verification, H-matrix, Multilevel method
AbstractVectorless power grid verification technique makes it possible to estimate the worst-case voltage fluctuations of the on-chip power delivery network at the early design stage. For most of the existing vectorless verification algorithms, the sub¬problem of linear system solution which computes the inverse of the power grid matrix takes up a large part of the computation time and has become a critical bottleneck of the whole algorithm. In this paper, we propose a new algorithm that combines the H-matrix-based technique and the multilevel method to construct a data-sparse approximate inverse of the power grid matrix. Experimental results have shown that the proposed algorithm can obtain an almost linear complexity both in runtime and memory consumption for efficient vectorless power grid verification.
Slides

2C-4 (Time: 15:10 - 15:40)
TitleRealization of Frequency-Domain Circuit Analysis Through Random Walk
AuthorTetsuro Miyakawa, Hiroshi Tsutsui, Hiroyuki Ochi, *Takashi Sato (Kyoto University, Japan)
Pagepp. 169 - 174
KeywordAC analysis, Random walk algorithm, Importance sampling, Incremental analysis
AbstractThis paper presents the realization of frequency-domain circuit analysis based on random walk framework for the first time. In conventional random walk based circuit analyses, the sample movement at a node is randomly chosen to follow the edge probabilities. The probabilities are determined by edge-admittances connecting to the node, which is impossible to apply for the frequency-domain analysis because the probabilities are imaginary numbers. By applying the idea of importance sampling, the intractable imaginary probabilities are converted into real numbers while maintaining the estimation correctness. Runtime acceleration through incremental analysis is also proposed.