Special Sessions

  • Date: Tuesday, January 25-27 2006 (10:15 - 18:05)
  • Place: Pacifico Yokohama, Room 416+417, 4F

Date/Time Title
1D January 25 / 10.15 - 12.20 Presentation + Poster Discussion: University Design Contest
2D January 25 / 13.30 - 15.35 Invited Talks: Electrothermal Design of Nanoscale Integrated Circuits
3D January 25 / 16.00 - 18.05 Invited Talks: Flash Memory in Embedded Systems
4D January 26 / 10.15 - 12.20 Invited Talks: Open Access Overview
7D January 27 / 10.15 - 12.20 Invited Talks + Panel Disucssion: H.264/AVC Design Challenges and Solutions

Wednesday, January 25, 10:15-12:20, 1D

"Presentation + Poster Discussion: University Design Contest"

Wednesday, January 25, 13:30-15:35, 2D

"Invited Talks: Electrothermal Design of Nanoscale Integrated Circuits"

  • 2D-1
    Electrothermal Analysis and Optimization Techniques for Nanoscale Integrated Circuits
    - Yong Zhan, Brent Goplen, Sachin S. Sapatnekar (Univ. of Minnesota, United States)
  • 2D-2
    Electrothermal Engineering in the Nanometer Era: from devices and interconnects to circuits and systems
    - Kaustav Banerjee (Univ. of California, Santa Barbara, United States)
  • 2D-3
    Area Optimization for Leakage Reduction and Thermal Stability in Nanometer Scale Technologies
    - Ja Chun Ku, Yehea Ismail (Northwestern Univ., United States)
  • 2D-4
    Device/Circuit Co-Design for Efficient Thermal Solutions for FinFET Technology
    - Aditya Bansal, Mesut Meterelliyoz, Jung Hwan Choi, Kaushik Roy, Jayathi Murthy (Purdue Univ., United States)

Wednesday, January 25, 16:00-18:05, 3D

"Invited Talks: Flash Memory in Embedded Systems"

  • 3D-1
    Current Trends in Flash Memory Technology
    - Sang Lyul Min, Eyee Hyun Nam (Seoul National Univ., Republic of Korea)
  • 3D-2
    Configurability of Performance and Overheads in Flash Management
    - Tei-Wei Kuo (National Taiwan Univ., Taiwan)

Thursday, January 26, 10:15-12:20, 4D

"Invited Talks: Open Access Overview"

  • 4D-1
    Open Access Overview
    - Eric Leavitt (Cadence, United States)
  • 4D-2
    Industrial Experience
    - Yoshio Inoue (Renesas, Japan)
  • 4D-3
    EDA Vendor Adoption
    Hillel Ofek (Sagantec, United States)
  • 4D-4
    Academic Involvement
    - Igor Markov, David Papa (Univ. of Michigan, United States)

Friday, January 27, 10:15-12:20, 7D

"Invited Talks + Panel Disucssion: H.264/AVC Design Challenges and Solutions"

  • 7D-1
    Introduction to H.264/AVC and the Special Session
    - Youn-Long Lin (National Tsing Hua Univ., Taiwan)
  • 7D-2
    Algorithm and DSP Implementation of H.264
    - Hsueh-Ming Hang (National Chiao-Tung Univ., Taiwan)
  • 7D-3
    Hardware Architecture Design of an H.264/AVC Video Codec
    - Liang-Gee Chen (National Taiwan Univ., Taiwan)
  • 7D-4
    ASIP Approach for H.264 Implementation
    - Myung-Hoon Sunwoo (Ajo Univ., Republic of Korea)
  • 7D-5
    Panel Discussion
    Moderator: Wayne Wolf (Princeton Univ.)
    Panelists: Youn-Long Lin (National Tsing Hua Univ.)
    Hsueh-Ming Hang (National Chiao-Tung Univ.)
    Liang-Gee Chen (National Taiwan Univ.)
    Myung-Hoon Sunwoo (Ajo Univ.)
Last Updated on: October 21, 2005