Student Forum at ASP-DAC 2011 Call for Posters
Call for Posters
The Student Forum at ASP-DAC 2011 is a poster session for graduate students to present their research work. This is a great opportunity for students to get feedback and have discussion with people from academia and industry. Travel grants will be provided for some of the students attending the forum and awards will be given to outstanding presentations. Please check the website for updates.
Download the Call for Posters in PDF format (52KB).
Graduate students are eligible for the Student Forum.
|Submission Deadline||Extended October 29, 2010,
|Notification Date||November 26, 2010|
|Forum Date||January 27, 2011|
- Abstract of the poster presentation including name, advisor, institution, contact information, estimated graduation date, track number, figures, tables and bibliography (if applicable). The abstract must be at most two pages (hard limit).
- A list of all papers related to the poster presentation authored or co-authored by the student, including posters in Ph.D. Forum at DAC or DATE and Student Forum at ASP-DAC.
- A published supporting paper authored or co-authored by the student and related to the poster presentation.
- Abstracts of completed research as well as research in early stages can be submitted.
- Submitted abstracts will be reviewed by the poster selection committee.
The following points will be mainly taken into account in the review process
in addition to the normal paper selection criteria:
- Achievements and methodologies for a completed (or almost completed) research.
- Directions and potentials for research in the early stages.
- The poster selection committee gives the priority to the abstracts that
meet the following criteria:
- Achievements and methodologies are supported by experiments.
- Directions and potentials are supported by feasibility analysis.
- It has not been presented at the Ph.D. Forum at DAC or DATE or the Student Forum at ASP-DAC.
- The abstract must be in .pdf format. The font should not be smaller than 10 points. Please make sure all pages print well.
- The abstract must be well organized and should not have any spelling error.
- The bibliography and the list of published papers must be in IEEE style (See http://www.ieee.org/web/publications/authors/transjnl/index.html) Author Digital Tool Box).
-  System-Level Modeling and Simulation/Verification:
- System-level modeling, specification, language, performance analysis, system-level simulation/verification, hardware-software co-simulation/co-verification, etc.
-  System-Level Synthesis and Optimization:
- System-on-chip and multi-processor SoC (MPSoC) design methodology, hardware-software partitioning, hardware-software co-design, IP/platform-based design, application-specific instruction-set processor (ASIP) synthesis, low power system design, etc.
-  System-Level Memory/Communication Design and Networks on Chip:
- Communication-based architecture design, network-on-chip (NoC) design methodologies and CAD, interface synthesis, system communication architecture, memory architecture, low power communication design, etc.
-  Embedded and Real-Time Systems:
- Embedded system design, real-time system design, OS, middleware, compilation techniques, memory/cache optimization, interfacing and software issues.
-  High-Level/Behavioral/Logic Synthesis and Optimization:
- High-Level/behavioral/RTL synthesis, technology-independent optimization, technology mapping, interaction between logic design and layout, sequential and asynchronous logic synthesis, resource scheduling, allocation, and synthesis.
-  Validation and Verification for Behavioral/Logic Design:
- Logic simulation, symbolic simulation, formal verification, equivalence checking, transaction-level/RTL and gate-level modeling and validation, assertion-based verification, coverage-analysis, constrained-random testbench generation.
-  Physical Design:
- Floorplanning, partitioning, placement, buffer insertion, routing, interconnect planning, clock network synthesis, post-placement optimization, layout verification, package/PCB routing, etc.
-  Timing, Power, Thermal Analysis and Optimization:
- Deterministic and statistical static timing analysis, statistical performance analysis and optimization, low power design, power and leakage analysis, power/ground and package analysis and optimization, thermal analysis, etc.
-  Signal/power Integrity, Interconnect/Device/Circuit Modeling and Simulation:
- Signal/power integrity, clock and bus analysis, interconnect and substrate modeling/extraction, package modeling, device modeling/simulation, circuit simulation, high-frequency and electromagnetic simulation of circuits, etc.
-  Design for Manufacturability/Yield and Statistical Design:
- DFM, DFY, CAD support for OPC and RET, variability analysis, yield analysis and optimization, reliability analysis, design for resilience and robustness, cell library design, design fabrics, etc.
-  Test and Design for Testability:
- Testable design, fault modeling, ATPG, BIST and DFT, memory test and repair, core and system test, delay test, analog and mixed signal test.
-  Analog, RF and Mixed Signal Design and CAD:
- Analog/RF synthesis, analog layout, verification and simulation techniques, noise analysis, mixed-signal design considerations.
-  Emerging technologies and applications:
- Design case studies for emerging applications: multimedia, consumer electronics, communication, networking, ubiquitous computing and biomedical applications, etc.
- Post CMOS technologies: nanotechnology, quantum, optical interconnect, 3D integration, probabilistic architecture, microfluidics, molecular, bioelectronics, etc., with emphasis on modeling, analysis, novel circuit/architecture, CAD tools, and design methodologies.
Sponsored by :
Supported by :
IPSJ SIGSLDM, ASP-DAC 2011, IEEE CAS Society Japan Chapter
If you have any questions, please send e-mail to the following address: student-forum2011 [@] slrc.kyushu-u.ac.jp ( [@] indicates @.)
- Shinobu Nagayama (Hiroshima City University, Japan)
- Oliver Diessel (University of New South Wales, Australia)
- Poster Selection Committee Members:
- Eui-Young Chung (Yonsei University, Korea)
- Sung Woo Chung (Korea University, Korea)
- Goerschwin Fey (University of Bremen, Germany)
- Koji Hashimoto (Fukuoka University, Japan)
- Yih-Lang Li (National Chiao Tung University, Taiwan)
- Chien-Nan Jimmy Liu (National Central University, Taiwan)
- Yung-Hsiang Lu (Perdue University, USA)
- Douglas Maskell (Nanyang Technological University, Singapore)
- Kohei Miyase (Kyushu Institute of Technology, Japan)
- Masanori Natsui (Tohoku University, Japan)
- Adam Postula (University of Queensland, Australia)
- Hiroshi Saito (University of Aizu, Japan)
- Chun-Yao Wang (National Tsing Hua University, Taiwan)
- Takayuki Watanabe (University of Shizuoka, Japan)
- Grant Wigley (University of South Australia, Australia)
- Weng-Fai Wong (National University of Singapore, Singapore)
- Chai-Lin Yang (National Taiwan University, Taiwan)
- Shingo Yoshizawa (Hokkaido University, Japan)
- Ting-Chi Wang (National Tsing Hua University, Taiwan)
- Yasuhiro Takashima (University of Kitakyushu, Japan)
- ASP-DAC liaison:
- Yasuhiro Takashima (University of Kitakyushu, Japan)