Technical Program Committee
Technical Program Chair
Hyunchul Shin (Hanyang Univ., Korea)
Technical Program Vice Chair
Yao-Wen Chang (National Taiwan Univ., Taiwan)
Nozomu Togawa (Waseda Univ., Japan)
Secretary
Youngsoo Shin (KAIST, Korea)
Yungseon Eo (Hanyang Univ., Korea)
Sub committees and sub committee chairs
* : subcommittee chairs
- [01] System-Level Modeling and Simulation/Verification
- * Ing-Jer Huang (National Sun-Yat-Sen Univ., Taiwan)
- Byeong Min (Samsung, Korea)
- Chia-Lin Yang (National Taiwan Univ., Taiwan)
- Nagisa Ishiura (Kwansei Gakuin Univ., Japan)
- Joerg Henkel (Univ. of Karlsruhe, Germany)
- [02] System-Level Synthesis and Optimization
- * Yuichi Nakamura (NEC, Japan)
- Li Shang (Univ. of Colorado, USA)
- Danella Zhao (Univ. of Louisiana at Lafayette, USA)
- Tsuyoshi Isshiki (Tokyo Institute of Technology, Japan)
- Jen-Chieh Yeh (ITRI, Taiwan)
- Hiroshi Saito (Aizu Univ. , Japan)
- Masanori Murooka (Tohoku Univ., Japan)
- [03] System-Level Memory/Communication Design and Networks on Chip
- * Yuan Xie (Pennsylvania State Univ., USA)
- Hiroyuki Tomiyama (Nagoya Univ., Japan)
- Yoshinori Takeuchi (Osaka Univ., Japan)
- Michihiro Koibuchi (National Institute of Informatics, Japan)
- Yunheung Paek (Seoul National Univ., Korea)
- Yu Wang (Tsinghua Univ., China)
- Jiang Xu (Hongkong Univ. of Science and Technology, Hongkong)
- David Atienza (EPFL, Switzerland)
- Fabien Clermidy (CEA-LETI, France)
- [04] Embedded and Real-Time Systems
- * Naehyuck Chang (Seoul National Univ., Korea)
- Samarjit Chakraborty (Technical Univ. of Munich, Germany)
- Zili?Shao? (Hong Kong Polytechnic Univ., China)
- Pai Chou (UC Irvine, USA)
- Jian-Jia Chen (Karlsruhe Institue of Technology, Germany)
- Yiran Chen (Seagate, USA)
- Prabhat Mishra (Univ. of Florida, USA)
- Sangsoo Park (Ewha Womans Univ., Korea)
- Eli Bozorgzadeh (UC Irvine, USA)
- Dongwan Shin (Qualcomm, USA)
- [05] High-Level/Behavioral/Logic Synthesis and Optimization
- * Deming Chen (Univ. of Illinois at Urbana-Champaign, USA)
- Kiyoung Choi (Seoul National Univ., Korea)
- Rolf Drechsler (Univ. of Bremen, Germany)
- Hiroyuki Higuchi (Fujitsu Laboratories, Japan)
- Ani Nahapetian (UC Los Angeles, USA)
- M.B. Srinivas (International Institute of Information Technology, India)
- Chun-Yao Wang (National Tsing Hua Univ., Taiwan)
- Shigeru Yamashita (Ritsumeikan Univ., Japan)
- [06] Validation and Verification for Behavioral/Logic Design
- * Shin-ichi Minato (Hokkaido Univ., Japan)
- Yoshinori Watanabe (Cadence, USA)
- Kiyoharu Hamaguchi (Osaka Univ., Japan)
- Chung-Yang Huang (National Taiwan Univ., Taiwan)
- Miroslav Velev (Aries Design Automation, USA)
- In-Ho Moon (Synopsys, USA)
- [07] Physical Design
- * David Z. Pan (Univ. of Texas at Austin, USA)
- Shabbir Batterywala (Synopsys, India)
- Sheqin Dong (Tsinghua Univ., China)
- Jeong-Tyng Li (SpringSoft, USA)
- Yih-Lang Li (National Chiao Tung Univ., Taiwan)
- Wai Kei Mak (National Tsinghua Univ., Taiwan)
- Cliff Sze (IBM, USA)
- Yasuhiro Takashima (Univ. of Kitakyushu, Japan)
- Lingli Wang (Fudan Univ., China)
- Lihong Zhang (Memorial Univ., Canada)
- [08] Timing, Power Thermal Analysis and Optimization
- * Sachin Sapatnekar (Univ. of Minnesota, USA)
- Shih-Hsu Huang (Chung Yuan Christian Univ., Taiwan)
- Kimiyoshi Usami (Shibaura Institute of Technology, Japan)
- Massimo Poncino (Politecnico di Torino, Italy)
- Azadeh Davoodi (Univ. of Wisconsin, USA)
- Bong-Hyun Lee (Samsung, Korea)
- Lei He (UC Los Angeles, USA)
- Yuchun Ma (Tsinghua Univ., China)
- Masanori Hashimoto (Osaka Univ., Japan)
- Seong-Ook Jung (Yonsei Univ., Korea)
- [09] Signal/Power Integrity, Interconnect/Device/Circuit Modeling and Simulation
- * Yungseon Eo (Hanyang Univ., Korea)
- Kimihiro Ogawa (STARC, Japan)
- Yu-Min Roger Lee (National Chiao Tung Univ., Taiwan)
- Zuochang Ye (Tsinghua Univ., China)
- Sungroh Yoon (Korea Univ., Korea)
- Kyu-won Ken Choi (Illinois Institute of Technology, USA)
- Ram Archar (Carleton Univ., Canada)
- [10] Design for Manufacturability/Yield and Statistical Design
- * Puneet Gupta (UC Los Angeles, USA)
- Toshiyuki Shibuya (Fujitsu Laboratories, Japan)
- Murakata Masami (STARC, Japan)
- Kartik Mohanram (Rice Univ., USA)
- Andrew B. Kahng (UC San Diego, USA)
- Fedor G. Pikus (Mentor Graphics, USA)
- Zheng Shi (Zhejiang Univ., China)
- [11] Test and Design for Testability
- * Seiji Kajihara (Kyusyu Institute of Technology, Japan)
- Tomokazu Yoneda (NAIST, Japan)
- Shi-Yu Huang (National Tsing-Hua Univ., Taiwan)
- Kee Sup Kim (Samsung, Korea)
- Sungho Kang (Yonsei Univ., Korea)
- Yu Huang (Mentor Graphics, USA)
- [12] Analog, RF and Mixed Signal Design and CAD
- * Jaijeet Roychowdhury (UC Berkeley, USA)
- Eric Keiter (Sandia National Labs, USA)
- Chin-Fong Chiu (National Chip Implementation Center, Taiwan)
- Hao Yu (Nanyang Technological Univ., Singapore)
- [13] Emerging Technologies and Applications
- * Chin-Long Wey (National Central Univ., Taiwan)
- In-Cheol Park ( KAIST, Korea)
- Mehdi Baradaran Tahoori (Northeastern Univ., USA)
- Chun-Ming Huang (National Chip Implementation Center, Taiwan)
- Xiaoyang Zeng (Fudan Univ., China)
- Wei Zhang (Nanyang Technological Univ., Singapore)
- Hai (Helen) Li (Polytechnic Institute of New York Univ., USA)
- Jin-Fu Li (National Central Univ., Taiwan)
- Chi-Sheng Li (National Chip Implementation Center, Taiwan)