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Call for Papers
Final paper submission will be extended since the conference registration is delayed due to the virtual conference. The due date of the final submission will be determined shortly.
Download the Call for Papers / Call for Designs in PDF format (453KB).
Call for Papers ASP-DAC 2021
Aims of the Conference:
ASP-DAC 2021 is the 26th annual international conference on VLSI design automation in Asia and South Pacific regions, one of the most active regions of design and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies related to Electronic Design Automation (EDA). The format of the meeting intends to cultivate and promote an instructive and productive interchange of ideas among EDA researchers/developers and system/circuit/device designers. All scientists, engineers, and students who are interested in theoretical and practical aspects of VLSI design and design automation are welcomed to ASP-DAC.
In light of the continued Covid-19 pandemic situation, the format of the conference is subject to future change. The options include fully in-person conference, hybrid conference (in person plus live video presentation) and fully virtual conferences. All papers presented, whether in-person or online, will be published. Please check the ASP-DAC 2021 website for updates.
Areas of Interest:
Original papers in, but not limited to, the following areas are invited.
1 System-Level Modeling and Design Methodology:
1.1. HW/SW co-design, co-simulation and co-verification
1.2. System-level design exploration, synthesis, and optimization
1.3. System-level formal verification
1.4. System-level modeling, simulation and validation tools/methodology
1.5. Networks-on-chip and NoC-based system design
2 Embedded Systems and Cyberphysical Systems:
2.1. Many- and multi-core SoC architecture
2.2. IP/platform-based SoC design
2.3. Domain-specific architecture
2.4. Dependable architecture
2.5. Cyber physical system
2.6. Internet of things
3 Embedded Systems Software:
3.1. Kernel, middleware, and virtual machine
3.2. Compiler and toolchain
3.3. Real-time system
3.4. Resource allocation for heterogeneous computing platform
3.5. Storage software and application
3.6. Human-computer interface
4 Memory Architecture and Near/In Memory Computing:
4.1. Storage system and memory architecture
4.2. On-chip memory architectures and management: Scratchpads, compiler, controlled memories, etc.
4.3. Memory and storage hierarchies with emerging memory technologies
4.4. Near-memory and in-memory computing
4.5. Memory architecture and management for emerging memory technologies
5 AI/Machine Learning System Designs:
5.1. Hardware and devices for deep neural networks
5.2. Design method for learning on a chip
5.3. Systems and design methods for deep neural computing
5.4. Neural network acceleration co-design techniques
5.5. Design techniques for AI of Things
6 Photonic/RF/Analog-Mixed Signal Design:
6.1. Analog/mixed-signal/RF synthesis
6.2. Analog layout, verification, and simulation techniques
6.3. High-frequency electromagnetic simulation of circuit
6.4. Mixed-signal design consideration
6.5. Communication and computing using photonics
7 Approximate, Bio-Inspired and Neuromorphic Computing:
7.1. Circuit and system techniques for approximate and stochastic computing
7.2. Neuromorphic computing
7.3. CAD for approximate and stochastic systems
7.4. CAD for bio-inspired and neuromorphic systems
8 Logic/High-Level Synthesis and Optimization:
8.1. High-level synthesis tool and methodology
8.2. Combinational, sequential and asynchronous logic synthesis
8.3. Logic synthesis and physical design technique for FPGA
8.4. Technology mapping
9 Physical Design:
9.1. Floorplanning, partitioning and placement
9.2. Interconnect planning and synthesis
9.3. Placement and routing optimization
9.4. Clock network synthesis
9.5. Post layout and post-silicon optimization
9.6. Package/PCB/3D-IC routing
10 Design for Manufacturability and Reliability:
10.1. Reticle enhancement, lithography-related design and optimization
10.2. Resilience under manufacturing variation
10.3. Design for manufacturability, yield, and defect tolerance
10.4. Reliability, aging and soft error analysis
10.5. Design for reliability, aging, and robustness
10.6. Machine learning for smart manufacturing and process control
11 Design and Analysis for Timing and Low Power:
11.1. Power modeling, analysis and simulation
11.2. Low-power design and optimization at circuit and system levels
11.3. Thermal aware design and dynamic thermal management
11.4. Energy harvesting and battery management
11.5. Deterministic/statistical timing analysis and optimization
11.6. Signal/power integrity, EM modeling and analysis
11.7. Extraction, TSV and package modeling
12 Testing, Validation, Simulation, and Verification:
12.1. ATPG, BIST and DFT
12.2. System test and 3D IC test
12.3. Online test and fault tolerance
12.4. Memory test and repair
12.5. RTL and gate-leveling modeling, simulation, and verification
12.6. Circuit-level formal verification
12.7. Device/circuit-level simulation tool and methodology
13 Hardware and Embedded Security:
13.1. Hardware-based security
13.2. Detection and prevention of hardware Trojans
13.3. Side-channel attacks, fault attacks and countermeasures
13.4. Design and CAD for security
13.5. Cyberphysical system security
13.6. Nanoelectronic security
13.7. Supply chain security and anti-counterfeiting
14 Emerging Devices, Technologies and Applications:
14.1. Quantum and Ising computing
14.2. Nanotechnology, MEMS
14.3. Biomedical, biochip, and biodata processing.
14.4. Edge, fog and cloud computing
14.5. Energy-storage/smart-grid/smart-building design and optimization
14.6. Automotive system design and optimization
14.7. New transistor/device and process technology: spintronic, phase-change, single-electron etc.
Please note that each paper shall be accompanied by at least one different conference registration at the speaker’s registration rate (e.g., two speaker registrations are needed for presenting two accepted papers). But any registered co-author can present the work at the conference. ACM and IEEE reserve the right to exclude a paper from distribution after the conference (e.g., removal from ACM Digital Library and IEEE Xplore) if the paper is not presented at the conference by the author of the paper. ASP-DAC does not allow double and/or parallel submissions of similar work to any other conferences, symposia, and journals.
Submission of Papers:
Deadline for submission:
Paper registration: 5 PM AOE (Anywhere on earth) July 26 (Sun), 2020
PDF update: 5 PM AOE (Anywhere on Earth) Aug. 2 (Sun.), 2020
The deadline is hard and strict. No exceptions are allowed.
Notification of acceptance: Sep. 13 (Sun), 2020
Deadline for final version: 5 PM AOE (Anywhere on earth) Nov. 6 (Fri), 2020
Final paper submission will be extended since the conference registration is delayed due to the virtual conference. The due date of the final submission will be determined shortly.
Specification of the paper submission format will be available at the WEB site:
https://www.aspdac.com/aspdac2021/
Panels, Special Sessions and Tutorials:
Suggestions and proposals are welcome and have to be addressed to the Conference Secretariat
(e-mail: aspdac2021 [at] aspdac.com) no later than August 2 (Sun), 2020.
Sponsors:
ACM SIGDA, IEEE CASS, IEEE CEDA, IEICE ESS, IPSJ SIGSLDM
ASP-DAC2021 Chairs:
General Chair: Toshihiro Hattori (Renesas Electronic Corporation)
Technical Program Chair: Sheldon Tan (University of California, Riverside)
Technical Program Vice Chair: Masanori Hashimoto (Osaka University)
Contact:
Conference Secretariat: aspdac2021 [at] aspdac.com
TPC Secretariat: aspdac2021-tpc [at] aspdac.com