Tuesday, January 20, 2009 |
Wednesday, January 21, 2009 |
A | B | C | D |
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Keynote Session II 9:00 - 10:00 |
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System Level Architectures 10:15 - 12:20 |
Beyond Traditional Floorplanning and Placement 10:15 - 12:20 |
Signal/Power Integrity and Simulation 10:15 - 12:20 |
Special Session: Challenges in 3D Integrated Circuit Design 10:15 - 12:20 |
Energy-Aware System Level Design Methodology 13:30 - 15:35 |
Design for Manufacturing and Reliability 13:30 - 15:35 |
Analog, RF and Mixed-Signal CAD 13:30 - 15:35 |
Designers' Forum: Consumer SoC 13:30 - 15:35 |
System Level Simulation and Modeling 15:55 - 18:00 |
Chip and Package Routing Techniques 15:55 - 18:00 |
Designers' Forum: ESL Design Methods 15:55 - 18:00 |
Thursday, January 22, 2009 |