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The 16th Asia and South Pacific Design Automation Conference
Author Index

Table of Contents:   A  B  C  D  E  F  G  H  I  J  K  L  M  N  O  P  Q  R  S  T  U  V  W  X  Y  Z  

A

Abraham, Jacob A. (The University of Texas at Austin)   p. 37 (1B-3)
Abraham, Jacob A. (University of Texas at Austin)   p. 249 (3B-1)
Abraham, Jacob A. (The University of Texas at Austin)   p. 615 (7B-4)
Ahn, Junwhan (Seoul National University)   p. 573 (7A-1)
Aitken, Robert (ARM)   p. 707 (8B-2)
Akitomi, Tomoaki (Advanced Research Laboratory, Hitachi, Ltd.)   p. 567 (6D-4)
Amaki, Takehiko (Osaka University)   p. 81 (1D-5)
Amano, Hideharu (Keio University)   p. 87 (1D-8)
Anderson, Jason (University of Toronto)   p. 369 (4C-1)
Anderson, Jason (University of Toronto)   p. 831 (9C-2)
Ara, Koji (Advanced Research Laboratory, Hitachi, Ltd.)   p. 567 (6D-4)
Asada, Kunihiro (University of Tokyo)   p. 75 (1D-2)
Asada, Kunihiro (University of Tokyo)   p. 79 (1D-4)
Asada, Kunihiro (VLSI Design and Education Center (VDEC), the University of Tokyo)   p. 107 (1D-18)
Atienza, David (EPFL)   p. 255 (3B-2)

B

Baek, Donkyu (Korea Advanced Institute of Science and Technology)   p. 376 (4C-2)
Bahirat, Shirish (Colorado State University)   p. 345 (4B-1)
Bao, Dan (Fudan University)   p. 77 (1D-3)
Batude, Perrine (LETI)   p. 336 (4A-4)
Becker, Bernd (University of Freiburg)   p. 812 (9B-3)
Beidas, Rami (University of Toronto)   p. 461 (5C-2)
Beniyama, Fumiko (Advanced Research Laboratory, Hitachi, Ltd.)   p. 567 (6D-4)
Bi, Yu (Delft University of Technology)   p. 61 (1C-3)
Bian, Jinian (Tsinghua University)   p. 639 (7C-4)
Bobba, Shashikanth (Swiss Institute of Technology Lausanne (EPFL))   p. 336 (4A-4)
Bose, Ajoy (Atrenta Inc.)   (2K-1)
Bozorgzadeh, Eli (University of California, Irvine)   p. 141 (2A-4)
Brooks, David (Harvard University)   p. 291 (3C-4)

C

Chakrabarty, Krishnendu (Duke University)   p. 491 (6A-3)
Chakraborty, Ashutosh (University of Texas at Austin)   p. 336 (4A-4)
Chakraborty, Ashutosh (University of Texas at Austin)   p. 597 (7B-1)
Chakraborty, Samarjit (Technical University of Munich)   p. 225 (3A-1)
Chakraborty, Samarjit (Institute for Real-Time Computer Systems, Technical University of Munich)   p. 237 (3A-3)
Chandra, Vikas (ARM)   p. 707 (8B-2)
Chang, Che-Wei (National Taiwan University)   p. 668 (7D-4)
Chang, Cheng-Yen (National Chung Cheng University)   p. 73 (1D-1)
Chang, Chia-Jen (Department of Electrical Engineering, National Central University)   p. 330 (4A-3)
Chang, Fong-Yuan (National Tsing Hua University)   p. 533 (6C-2)
Chang, Hsiu-Cheng (National Chung Cheng University)   p. 73 (1D-1)
Chang, Hsiu-Ming (University of California, Santa Barbara)   p. 713 (8B-3)
Chang, Hsun-Hsiang (Dept. of Electrical Engineering National Cheng Kung University)   p. 591 (7A-4)
Chang, Kai-Hui (Avery Design Systems, Inc.)   p. 485 (6A-2)
Chang, Meng-Fan (National Tsing Hua University)   p. 197 (2D-1)
Chang, Shih-Chieh (Dept. of CS, National Tsing Hua University)   p. 609 (7B-3)
Chang, Ting (University of Michigan)   p. 217 (2D-4)
Chang, Ting-Mao (InPA Systems, Inc.)   p. 297 (3D-2)
Chang, Yuan-Hao (National Taipei University of Technology)   p. 661 (7D-3)
Chang, Yung-Chang (Industrial Technology Research Institute)   p. 431 (5B-1)
Chao, Kai-Yuan (Intel Corporation)   p. 633 (7C-3)
Chao, Kai-Yuan (Intel Corporation)   p. 787 (9A-3)
Chaturvedi, Vivek (Florida International University)   p. 135 (2A-3)
Chen, Chun-Chia (National Tsing Hua University)   p. 279 (3C-2)
Chen, Deming (University of Illinois at Urbana-Champaign)   p. 323 (4A-2)
Chen, Deming (University of Illinois at Urbana-Champaign)   p. 388 (4C-4)
Chen, Fan-Ta (National Tsing Hua University)   p. 105 (1D-17)
Chen, Fu-Wei (National Tsing Hua University)   p. 701 (8B-1)
Chen, Hung-Ming (National Chiao Tung University)   p. 837 (9C-3)
Chen, Jack J.H. (Taiwan Semiconductor Manufacturing Company)   p. 403 (4D-3)
Chen, Jen-Hom (Taiwan Semiconductor Manufacturing Company)   p. 403 (4D-3)
Chen, Jia-Wei (National Chung Cheng University)   p. 73 (1D-1)
Chen, Quan (The University of Hong Kong)   p. 55 (1C-2)
Chen, Raymond P.S. (Taiwan Semiconductor Manufacturing Company)   p. 403 (4D-3)
Chen, Sheng-Hsiung (SpringSoft)   p. 533 (6C-2)
Chen, Shenggang (National University of Defense Technology)   p. 91 (1D-10)
Chen, Shih-Liang (National Tsing Hua University)   p. 701 (8B-1)
Chen, Shuming (National University of Defense Technology)   p. 91 (1D-10)
Chen, Shuo-Hung (National Tsing Hua University)   p. 97 (1D-13)
Chen, Song (Waseda University)   p. 473 (5C-4)
Chen, Tai-Chen (Department of Electrical Engineering, National Central University)   p. 330 (4A-3)
Chen, Tianzhou (Zhejiang University)   p. 668 (7D-4)
Chen, Tianzhou (Zhejiang University)   p. 743 (8C-4)
Chen, Wei-Ming (National Tsing Hua University)   p. 99 (1D-14)
Chen, Weiwei (University of California, Irvine)   p. 311 (3D-5)
Chen, Xiaowen (National University of Defense Technology)   p. 91 (1D-10)
Chen, Xiaowen (Royal Institute of Technology)   p. 154 (2B-2)
Chen, Yi-Hang (National Chiao Tung University)   p. 585 (7A-3)
Chen, Yi-Siou (Dept. of Electrical Engineering National Cheng Kung University)   p. 591 (7A-4)
Chen, Ying-Jheng (National Taiwan University)   p. 668 (7D-4)
Chen, Ying-Yen (National Tsing Hua University)   p. 279 (3C-2)
Chen, Yiran (University of Pittsburgh)   p. 25 (1B-1)
Chen, Yiran (University of Pittsburgh)   p. 204 (2D-2)
Chen, Yu-Guang (Dept. of CS, National Tsing Hua University)   p. 609 (7B-3)
Chen, Yun (Fudan University)   p. 77 (1D-3)
Cheng, Ching-Hwa (Feng Chia University)   p. 73 (1D-1)
Cheng, Ching-Hwa (Dept. of Electronic Engineering Feng Chia University)   p. 85 (1D-7)
Cheng, Ching-Hwa (Dept. of Electronic Engineering Feng Chia University)   p. 93 (1D-11)
Cheng, Kwang-Ting (Tim) (University of California, Santa Barbara)   p. 273 (3C-1)
Cheung, Chris (Cadence Design Systems)   (9D-1)
Chiavipas, Win (Tokyo Institute of Technology)   p. 101 (1D-15)
Chien, Cheng-An (National Chung Cheng University)   p. 73 (1D-1)
Chien, Cheng-An (Dept. of CSIE, National Chung Cheng University)   p. 85 (1D-7)
Chien, Cheng-An (Dept. of CSIE, National Chung Cheng University)   p. 93 (1D-11)
Chien, Chung-Yen (National Tsing Hua University)   p. 279 (3C-2)
Chilstedt, Scott (University of Illinois at Urbana-Champaign)   p. 323 (4A-2)
Chiou, Lih-Yih (Dept. of Electrical Engineering National Cheng Kung University)   p. 591 (7A-4)
Chiu, Ching-Te (National Tsing Hua University)   p. 105 (1D-17)
Chiu, Ching-Te (National Tsing Hua University)   p. 431 (5B-1)
Chiu, CT (ASE)   (5D-1)
Chiu, Pi-Feng (Industrial Technology Research Institute)   p. 197 (2D-1)
Choi, Kiyoung (Seoul National University)   p. 573 (7A-1)
Chou, Hong-Zu (National Taiwan University)   p. 485 (6A-2)
Chou, Yung-Fa (Industrial Technology Research Institute)   p. 713 (8B-3)
Choy, Chiu-Sing (The Chinese University of Hong Kong)   p. 111 (1D-21)
Chuang, Jia-Ru (National Cheng Kung University)   p. 527 (6C-1)
Chung, Jaeyong (University of Texas at Austin)   p. 249 (3B-1)
Chung, Yeh-Ching (National Tsing Hua University)   p. 97 (1D-13)
Clarke, Edmund M. (Carnegie Mellon University)   p. 1 (1A-1)
Cong, Jason (University of California, Los Angeles)   p. 261 (3B-3)
Courbot, Alexandre (Waseda University)   p. 645 (7D-1)

D

Daniel, Luca (Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology)   p. 49 (1C-1)
de Groot, Harmke (Holst Centre/IMEC)   p. 267 (3B-4)
De Micheli, Giovanni (Swiss Institute of Technology Lausanne (EPFL))   p. 336 (4A-4)
Deng, Wei (Tokyo Institute of Technology)   p. 103 (1D-16)
Devlin, Benjamin (University of Tokyo)   p. 75 (1D-2)
Diaz, Luis (University of Cantabria)   p. 425 (5A-4)
Ding, Duo (University of Texas at Austin)   p. 775 (9A-1)
Dömer, Rainer (University of California, Irvine)   p. 311 (3D-5)
Dong, Chen (University of Illinois at Urbana-Champaign)   p. 388 (4C-4)
Dong, Sheqin (Tsinghua University)   p. 261 (3B-3)
Dong, Sheqin (Tsinghua University)   p. 473 (5C-4)
Dong, Xiangyu (Pennsylvania State University)   p. 31 (1B-2)
Du, Yuelin (University of Illinois at Urbana-Champaign)   p. 787 (9A-3)

E

Elwell, Jesse (SUNY Binghamton Computer Science Department)   p. 653 (7D-2)
Ernst, Thomas (LETI)   p. 336 (4A-4)
Ezawa, Hirokazu (Toshiba)   (9D-1)

F

Fan, Wen (The Chinese University of Hong Kong)   p. 111 (1D-21)
Fang, Hongxia (Duke University)   p. 491 (6A-3)
Fang, Jianxin (Department of ECE, University of Minnesota)   p. 689 (8A-3)
Fang, Zhen (Intel Corporation)   p. 147 (2B-1)
Faynot, Olivier (LETI)   p. 336 (4A-4)
Francisco, Ruben de (IMEC)   p. 561 (6D-3)
Fujita, Masahiro (The University of Tokyo and CREST)   p. 301 (3D-3)
Fujita, Masahiro (The University of Tokyo)   p. 719 (8B-4)
Fujiwara, Hideo (Nara Institute of Science and Technology)   p. 818 (9B-4)
Fujiwara, Katsuya (Akita University)   p. 818 (9B-4)
Fukuba, Yoshinori (Toshiba)   (5D-1)
Furuta, Jun (Kyoto University)   p. 83 (1D-6)

G

Gaba, Siddharth (University of Michigan)   p. 217 (2D-4)
Gan, Junhe (Technical University of Denmark)   p. 731 (8C-2)
Gangadharan, Deepak (School of Computing, National University of Singapore)   p. 237 (3A-3)
Gao, Ming (University of California, Santa Barbara)   p. 273 (3C-1)
Gao, Mingzhi (Institute of Microelectronics, Tsinghua University)   p. 677 (8A-1)
Gao, Ping (Aries Design Automation)   p. 293 (3D-1)
Gao, Ting (Fudan University)   p. 115 (1D-23)
Gao, Xin (Department of Electrical Engineering, University of Hawaii at Manoa)   p. 627 (7C-2)
Gerstlauer, Andreas (University of Texas at Austin)   p. 311 (3D-5)
Gligor, Marius (TIMA Laboratory, CNRS/INP Grenoble/UJF)   p. 407 (5A-1)
Gordon-Ross, Ann (University of Florida)   p. 243 (3A-4)
Gordon-Ross, Ann (University of Florida)   p. 419 (5A-3)
Goswami, Dip (Technical University of Munich)   p. 225 (3A-1)
GOTO, Satoshi (Waseda University)   p. 473 (5C-4)
Groot, Harmke de (IMEC)   p. 561 (6D-3)
Gruian, Flavius (Lund University)   p. 731 (8C-2)
Gu, Chenjie (University of California, Berkeley)   p. 7 (1A-2)
Gu, Xinli (Cisco Systems Inc.)   p. 491 (6A-3)
Guo, Jiun-In (National Chung Cheng University)   p. 73 (1D-1)
Guo, Jiun-In (Dept. of CSIE, National Chung Cheng University)   p. 85 (1D-7)
Guo, Jiun-In (Dept. of CSIE, National Chung Cheng University)   p. 93 (1D-11)
Guthaus, Matthew R. (University of California, Santa Cruz)   p. 184 (2C-3)
Gyselinckx, Bert (IMEC)   p. 561 (6D-3)

H

Ha, Soonhoi (Seoul National University)   p. 165 (2B-4)
Hafiz, Mohiuddin (Hiroshima University)   p. 121 (1D-26)
Hamanaka, Chikara (Kyoto Institute of Technology)   p. 83 (1D-6)
Han, Inhak (Korea Advanced Institute of Science and Technology)   p. 190 (2C-4)
Han, Xu (University of California, Irvine)   p. 311 (3D-5)
Han, Yinhe (Institute of Computing Technology, Chinese Academy of Sciences)   p. 357 (4B-3)
Han, Yinhe (Institute of Computing Technology, Chinese Academy of Sciences)   p. 437 (5B-2)
Hariyama, Masanori (Tohoku University)   p. 89 (1D-9)
Harpe, Pieter (Holst Centre/IMEC)   p. 61 (1C-3)
Hashida, Tatsunori (Shibaura Institute of Technology)   p. 87 (1D-8)
Hashimoto, Masanori (Osaka University)   p. 81 (1D-5)
Hashimoto, Masanori (Osaka University & JST, CREST)   p. 285 (3C-3)
Hashimoto, Masanori (Osaka University)   p. 683 (8A-2)
Hayakawa, Miki (Advanced Research Laboratory, Hitachi, Ltd.)   p. 567 (6D-4)
Higami, Yoshinobu (Ehime University)   p. 799 (9B-1)
Hirose, Tetsuya (Kobe University)   p. 113 (1D-22)
Hiruta, Yoichi (J-Devices)   (9D-1)
Ho, Chih-Hsiang (ECE, Purdue University)   p. 695 (8A-4)
Ho, Tsung-Yi (National Cheng Kung University)   p. 825 (9C-1)
Ho, Ya-Chien (National Chiao Tung University)   p. 585 (7A-3)
Hong, Xianlong (Tsinghua University)   p. 261 (3B-3)
Hong, Zhiliang (Fudan University)   p. 119 (1D-25)
Howard, Joseph (University of Iowa)   p. 812 (9B-3)
Hsieh, Ang-Chih (National Tsing Hua University)   p. 231 (3A-2)
Hsieh, Ching-Chou (National Tsing Hua University)   p. 97 (1D-13)
Hsieh, Jen-Wei (National Taiwan University of Science and Technology)   p. 661 (7D-3)
Hsiung, Pao-Ann (National Chung Cheng University)   p. 160 (2B-3)
Hsu, Chang-Hong (National Taiwan University)   p. 382 (4C-3)
Hsu, Chih-Jen (National Taiwan University)   p. 297 (3D-2)
Hsu, Jen-Tai (Global Unichip Corporation)   (5D-1)
Hsu, Shuo-Hung (National Tsing Hua University)   p. 105 (1D-17)
Hsu, YarSun (National Tsing Hua University)   p. 105 (1D-17)
Hsu, Yu-Hao (National Tsing Hua University)   p. 105 (1D-17)
Hu, Chao (Tsinghua University)   p. 67 (1C-4)
Hu, Miao (Polytechnic Institute of New York University)   p. 25 (1B-1)
Hu, Shih-Hsin (The University of Texas at Austin)   p. 615 (7B-4)
Hu, Wenmin (School of Computer, National University of Defense Technology)   p. 363 (4B-4)
Hu, Xuchu (University of California, Santa Cruz)   p. 184 (2C-3)
Huang, Chih-Tsun (National Tsing Hua University)   p. 97 (1D-13)
Huang, Chung-Yang (National Taiwan University)   p. 297 (3D-2)
Huang, Chung-Yang (Ric) (National Taiwan University)   p. 382 (4C-3)
Huang, Ding-Kai (Dept. of CS, National Tsing Hua University)   p. 609 (7B-3)
Huang, Jiawei (University of Virginia)   p. 579 (7A-2)
Huang, Jiun-Lang (National Taiwan University)   p. 713 (8B-3)
Huang, Juinn-Dar (National Chiao Tung University)   p. 497 (6A-4)
Huang, Juinn-Dar (National Chiao Tung University)   p. 585 (7A-3)
Huang, Pao-Jen (Department of Electrical Engineering, National Central University)   p. 330 (4A-3)
Huang, Shao-Lun (National Taiwan University)   p. 382 (4C-3)
Huang, Thomas B. (InPA Systems, Inc.)   p. 297 (3D-2)
Huang, Xuan-Lun (National Taiwan University)   p. 713 (8B-3)
Huang, Yazhi (City University of Hong Kong)   p. 129 (2A-2)
Huisken, Jos (Holst Centre/IMEC)   p. 267 (3B-4)
Hwang, TingTing (National Tsing Hua University)   p. 231 (3A-2)
Hwang, TingTing (National Tsing Hua University)   p. 701 (8B-1)

I

Iizuka, Tetsuya (University of Tokyo)   p. 79 (1D-4)
Ikebuchi, Daisuke (Keio University)   p. 87 (1D-8)
Ikeda, Makoto (University of Tokyo)   p. 75 (1D-2)
Ikeda, Makoto (University of Tokyo)   p. 79 (1D-4)
Imai, Masaharu (Osaka University)   p. 551 (6D-1)
Inoue, Atsuki (Fujitsu Labs.)   p. 760 (8D-3)
Inoue, Soichi (Toshiba)   p. 395 (4D-1)
Ishida, Koichi (University of Tokyo)   p. 109 (1D-19)
Ishihara, Shota (Tohoku University)   p. 89 (1D-9)
Ismail, Yehea (Nile University)   p. 176 (2C-2)
Iwato, Hirofumi (Osaka University)   p. 551 (6D-1)
Iyer, Ravi (Intel Corporation)   p. 147 (2B-1)

J

Jantsch, Axel (Royal Institute of Technology)   p. 154 (2B-2)
Jantsch, Axel (Royal Institute of Technology)   p. 363 (4B-4)
Jayapal, Senthil (Holst Centre/IMEC)   p. 267 (3B-4)
Jeong, Jaehyun (University of Tokyo)   p. 79 (1D-4)
Jou, Jing-Yang (National Chiao Tung University)   p. 497 (6A-4)

K

Kamata, Masahiro (Keio University)   p. 87 (1D-8)
Kameyama, Michitaka (Tohoku University)   p. 89 (1D-9)
Kang, Ping-Ying (National Taiwan University)   p. 713 (8B-3)
Kao, Min-Sheng (National Tsing Hua University)   p. 105 (1D-17)
Kato, Koji (Sony)   (5D-1)
Kawahara, Ryo (IBM Research - Tokyo)   p. 413 (5A-2)
Kawahara, Takayuki (Hitachi)   (1K-1)
Keng, Brian (University of Toronto)   p. 306 (3D-4)
Keng, Brian (University of Toronto)   p. 479 (6A-1)
Ki, Wing-Hung (Hong Kong University of Science and Technology)   p. 117 (1D-24)
Kikkawa, Takamaro (Hiroshima University)   p. 121 (1D-26)
Kikuchi, Yu (Toshiba Corporation Semiconductor Company)   p. 755 (8D-2)
Kim, Joonsoo (The University of Texas at Austin)   p. 37 (1B-3)
Kim, Kuk-Hwan (University of Michigan)   p. 217 (2D-4)
Kim, Nam Sung (University of Wisconsin-Madison)   p. 725 (8C-1)
Kim, Sangmin (Korea Advanced Institute of Science and Technology)   p. 190 (2C-4)
Kim, Taewhan (Seoul National University)   p. 503 (6B-1)
Kim, Taewhan (Seoul National University)   p. 603 (7B-2)
Kimoto, Kentaro (Hiroshima University)   p. 121 (1D-26)
Kimura, Kazuki (Tokyo University of Agriculture and Technology)   p. 87 (1D-8)
Kinebuchi, Yuki (Waseda University)   p. 645 (7D-1)
Kitasho, Yoshiyuki (Toshiba Corporation Semiconductor Company)   p. 755 (8D-2)
Kobayashi, Kazutoshi (Kyoto Institute of Technology)   p. 83 (1D-6)
Kobayashi, Sachiko (Toshiba)   p. 395 (4D-1)
Kobayashi, Shin-ya (Ehime University)   p. 799 (9B-1)
Koh, Cheng-Kok (Purdue University)   p. 633 (7C-3)
Kojima, Yu (Keio University)   p. 87 (1D-8)
Komatsu, Yoshiya (Tohoku University)   p. 89 (1D-9)
Komuravelli, Anvesh (Carnegie Mellon University)   p. 1 (1A-1)
Kondo, Masaaki (The University of Electro-Communications)   p. 87 (1D-8)
Kondo, Toshio (Mie University)   p. 95 (1D-12)
Kong, Hui (University of Illinois at Urbana-Champaign)   p. 843 (9C-4)
Kooti, Hessam (University of California, Irvine)   p. 141 (2A-4)
Koyama, Satoshi (Shibaura Institute of Technology)   p. 87 (1D-8)
Krecinic, Faruk (Taiwan Semiconductor Manufacturing Company)   p. 403 (4D-3)
Kumar, Pratyush (ETH Zürich)   p. 123 (2A-1)
Kumar, Pratyush (EPFL)   p. 255 (3B-2)
Kuo, Sy-Yen (National Taiwan University)   p. 485 (6A-2)
Kuo, Tei-Wei (National Taiwan University)   p. 668 (7D-4)
Kuroki, Nobutaka (Kobe University)   p. 113 (1D-22)
Kwai, Ding-Ming (Industrial Technology Research Institute)   p. 713 (8B-3)

L

Lach, John (University of Virginia)   p. 579 (7A-2)
Lai, Wei-Chih (National Tsing Hua University)   p. 105 (1D-17)
Lam, Tak-Kei (The Chinese University of Hong Kong)   p. 509 (6B-2)
Lee, Chi-Hui (National Chiao Tung University)   p. 497 (6A-4)
Lee, Imyong (Seoul National University)   p. 573 (7A-1)
Lee, Joonsoo (The University of Texas at Austin)   p. 37 (1B-3)
Lee, Kuang-Yao (Taiwan Semiconductor Manufacturing Company)   p. 633 (7C-3)
Lee, Ming-Chao (Dept. of CS, National Tsing Hua University)   p. 609 (7B-3)
Lee, Ren-Jie (National Chiao Tung University)   p. 837 (9C-3)
Lee, Wei-Li (National Taiwan University of Science and Technology)   p. 661 (7D-3)
Lee, Yeonbok (The University of Tokyo)   p. 719 (8B-4)
Lee, Yongho (Samsung Electronics)   p. 603 (7B-2)
Lee, Yung-Pin (Industrial Technology Research Institute)   p. 713 (8B-3)
Li, Bin (Intel Corporation)   p. 147 (2B-1)
Li, Hai (Polytechnic Institute of New York University)   p. 25 (1B-1)
Li, Hai (Polytechnic Institute of New York University)   p. 204 (2D-2)
Li, Jia (Tsinghua University)   p. 806 (9B-2)
Li, Jiayin (University of Kentucky)   p. 743 (8C-4)
Li, Li (Electrical Engineering and Computer Science Department, Northwestern University)   p. 515 (6B-3)
Li, Ning (Fudan University)   p. 115 (1D-23)
Li, Wei (Fudan University)   p. 115 (1D-23)
Li, Xiaopeng (Shanghai Jiao Tong University)   p. 19 (1A-4)
Li, Xiaowei (Institute of Computing Technology, Chinese Academy of Sciences)   p. 357 (4B-3)
Li, Xiaowei (Institute of Computing Technology, Chinese Academy of Sciences)   p. 437 (5B-2)
Li, Yih-Lang (National Chiao Tung University)   p. 539 (6C-3)
Lim, Kyoung-Hwan (Seoul National University)   p. 503 (6B-1)
Lim, Sung Kyu (Georgia Institute of Technology)   p. 621 (7C-1)
Lin, Burn J. (Taiwan Semiconductor Manufacturing Company)   p. 403 (4D-3)
Lin, Hong-Ting (National Cheng Kung University)   p. 825 (9C-1)
Lin, Hsiao-Mei (National Tsing Hua University)   p. 97 (1D-13)
Lin, Jai-Ming (National Cheng Kung University)   p. 527 (6C-1)
Lin, Kuan-Yu (National Cheng Kung University)   p. 825 (9C-1)
Lin, Shih-Yin (Industrial Technology Research Institute)   p. 431 (5B-1)
Lin, Shing-Tung (National Tsing Hua University)   p. 633 (7C-3)
Lin, Tao (Tsinghua University)   p. 473 (5C-4)
Lin, Tsung-Han (Waseda University)   p. 645 (7D-1)
Lin, Yang-Syu (National Tsing Hua University)   p. 105 (1D-17)
Lin, Yung-Sheng (National Tsing Hua University)   p. 701 (8B-1)
Liou, Jing-Jia (National Tsing Hua University)   p. 97 (1D-13)
Liou, Jing-Jia (National Tsing Hua University)   p. 279 (3C-2)
Lisherness, Peter (University of California, Santa Barbara)   p. 273 (3C-1)
Liu, Cheng (Institute of Computing Technology, Chinese Academy of Sciences)   p. 357 (4B-3)
Liu, Cheng (Institute of Computing Technology, Chinese Academy of Sciences)   p. 437 (5B-2)
Liu, Chien-Nan Jimmy (Department of Electrical Engineering, National Central University)   p. 330 (4A-3)
Liu, Chun-Cheng (National Tsing Hua University)   p. 231 (3A-2)
Liu, Chung-Kai (Industrial Technology Research Institute)   p. 431 (5B-1)
Liu, Dimin (Pennsylvania State University)   p. 211 (2D-3)
Liu, Hengzhu (School of Computer, National University of Defense Technology)   p. 363 (4B-4)
Liu, Tiantian (City University of Hong Kong)   p. 129 (2A-2)
Liu, Wei (Tsinghua University)   p. 43 (1B-4)
Liu, Wen-Hao (National Chiao Tung University)   p. 539 (6C-3)
Liu, Wulong (Tsinghua University)   p. 43 (1B-4)
Liu, Xiangyuan (National University of Defense Technology)   p. 91 (1D-10)
Liu, Xue-Xin (University of California, Riverside)   p. 13 (1A-3)
Loew, Jason (SUNY Binghamton Computer Science Department)   p. 653 (7D-2)
Lu, Chao (ECE, Purdue University)   p. 695 (8A-4)
Lu, Jianzhuang (National University of Defense Technology)   p. 91 (1D-10)
Lu, Wei (University of Michigan)   p. 217 (2D-4)
Lu, Yinghai (EECS Dept., Northwestern University)   p. 467 (5C-3)
Lu, Yinghai (Electrical Engineering and Computer Science Department, Northwestern University)   p. 515 (6B-3)
Lu, Yinghai (EECS Dept., Northwestern University)   p. 793 (9A-4)
Lu, Zhonghai (Royal Institute of Technology)   p. 154 (2B-2)
Lu, Zhonghai (Royal Institute of Technology)   p. 363 (4B-4)
Lucas, Kevin (Synopsys)   p. 405 (4D-4)
Lysecky, Roman (University of Arizona)   p. 737 (8C-3)

M

Ma, Hsi-Pin (National Tsing Hua University)   p. 99 (1D-14)
Ma, Qiang (University of Illinois at Urbana-Champaign)   p. 323 (4A-2)
Ma, Qiang (University of Illinois at Urbana-Champaign)   p. 843 (9C-4)
Ma, Yuchun (Tsinghua University)   p. 43 (1B-4)
Ma, Yuchun (Tsinghua University)   p. 261 (3B-3)
Ma, Yuchun (Tsinghua University)   p. 473 (5C-4)
Macchiarulo, Luca (Department of Electrical Engineering, University of Hawaii at Manoa)   p. 627 (7C-2)
Madden, Patrick H. (SUNY Binghamton Computer Science Department)   p. 653 (7D-2)
Madsen, Jan (Technical University of Denmark)   p. 731 (8C-2)
Mai Khanh, Nguyen Ngoc (The University of Tokyo)   p. 107 (1D-18)
Mak, Wai-Kei (National Tsing Hua University)   p. 533 (6C-2)
Marek-Sadowska, Malgorzata (University of California, Santa Barbara)   p. 781 (9A-2)
Masubuchi, Yoshio (Toshiba)   (9D-1)
Masubuchi, Yoshio (Toshiba Corporation Semiconductor Company)   p. 755 (8D-2)
Masuda, Daiki (Shibaura Institute of Technology)   p. 87 (1D-8)
Matsumoto, Takeshi (The University of Tokyo)   p. 719 (8B-4)
Matsunami, Keisuke (Sony)   (5D-1)
Matsuzawa, Akira (Tokyo Institute of Technology)   p. 101 (1D-15)
Matsuzawa, Akira (Tokyo Institute of Technology)   p. 103 (1D-16)
Mishra, Deepak (University of California, Irvine)   p. 141 (2A-4)
Mitra, Subhasish (Stanford University)   (3K-1)
Moffitt, Michael (IBM Corporation)   p. 545 (6C-4)
Mohamed, Khaled Salah (Mentor Graphics)   p. 176 (2C-2)
Mohapatra, Debabrata (ECE, Purdue University)   p. 695 (8A-4)
Mong, Wai Sum (University of Toronto)   p. 461 (5C-2)
Moriwaki, Norihiko (Advanced Research Laboratory, Hitachi, Ltd.)   p. 567 (6D-4)
Mu, Jingqing (University of Arizona)   p. 737 (8C-3)
Murakami, Rui (Tokyo Institute of Technology)   p. 101 (1D-15)
Musa, Ahmed (Tokyo Institute of Technology)   p. 101 (1D-15)

N

Naeem, Abdul (Royal Institute of Technology)   p. 154 (2B-2)
Nagata, Makoto (Kobe University)   (5D-1)
Nakabayashi, Tomoyuki (Mie University)   p. 95 (1D-12)
Nakada, Takeo (IBM Research - Tokyo)   p. 413 (5A-2)
Nakajima, Tatsuo (Waseda University)   p. 645 (7D-1)
Nakamura, Hiroshi (University of Tokyo)   p. 87 (1D-8)
Nakamura, Kenta (IBM Research - Tokyo)   p. 413 (5A-2)
Nakura, Toru (University of Tokyo)   p. 79 (1D-4)
Namiki, Mitaro (Tokyo University of Agriculture and Technology)   p. 87 (1D-8)
Nishiguchi, Nobuyuki (Semiconductor Technology Academic Research Center)   p. 770 (8D-5)
Niu, Jian-wei (Beihang University)   p. 743 (8C-4)
Numa, Masahiro (Kobe University)   p. 113 (1D-22)

O

Oh, Hyunok (Hanyang University)   p. 165 (2B-4)
Ohara, Yasuo (Toshiba Corporation Semiconductor Company)   p. 755 (8D-2)
Ohkubo, Norio (Advanced Research Laboratory, Hitachi, Ltd.)   p. 567 (6D-4)
Ohno, Kazuhiko (Mie University)   p. 95 (1D-12)
Okada, Kenichi (Tokyo Institute of Technology)   p. 101 (1D-15)
Okada, Kenichi (Tokyo Institute of Technology)   p. 103 (1D-16)
Ono, Kouichi (IBM Research - Tokyo)   p. 413 (5A-2)
Onodera, Hidetoshi (Kyoto University)   p. 83 (1D-6)
Onoye, Takao (Osaka University)   p. 81 (1D-5)
Oowaki, Yukihito (Toshiba Corporation Semiconductor Company)   p. 755 (8D-2)
Orii, Yasumitsu (IBM)   (9D-1)
Osada, Kenichi (Hitachi)   (9D-1)
Osaki, Yuji (Kobe University)   p. 113 (1D-22)
Otsuka, Rieko (Advanced Research Laboratory, Hitachi, Ltd.)   p. 567 (6D-4)
Ouyang, Jin (Pennsylvania State University)   p. 211 (2D-3)
Ouyang, Jin (The Pennsylvania State University)   p. 351 (4B-2)

P

Paik, Seungwhun (Korea Advanced Institute of Science and Technology)   p. 190 (2C-4)
Paik, Seungwhun (Korea Advanced Institute of Science and Technology)   p. 376 (4C-2)
Pak, Jiwoo (University of Texas at Austin)   p. 621 (7C-1)
Pan, David (University of Texas at Austin)   p. 775 (9A-1)
Pan, David Z. (University of Texas at Austin)   p. 336 (4A-4)
Pan, David Z. (University of Texas at Austin)   p. 405 (4D-4)
Pan, David Z. (University of Texas at Austin)   p. 597 (7B-1)
Pan, David Z. (University of Texas at Austin)   p. 621 (7C-1)
Pang, Yu (Chongqing University of Posts and Telecommunications)   p. 455 (5C-1)
Park, Chul-Hong (Samsung Electronics)   p. 405 (4D-4)
Pasricha, Sudeep (Colorado State University)   p. 345 (4B-1)
Pasricha, Sudeep (Colorado State University)   p. 443 (5B-3)
Peng, Chi-Chen (University of Illinois at Urbana-Champaign)   p. 388 (4C-4)
Pétrot, Frédéric (TIMA Laboratory, CNRS/INP Grenoble/UJF)   p. 407 (5A-1)
Pflug, Hans (IMEC)   p. 561 (6D-3)
Pikus, Fedor (Mentor Graphics Corp.)   p. 775 (9A-1)
Pikus, Fedor G. (Mentor Graphics Corporation)   p. 781 (9A-2)
Pino, Robinson (AFRL/RITC)   p. 25 (1B-1)
Pomeranz, Irith (Purdue University)   p. 812 (9B-3)
Ponomarev, Dmitry (SUNY Binghamton Computer Science Department)   p. 653 (7D-2)
Pop, Paul (Technical University of Denmark)   p. 731 (8C-2)
Pop, Valer (IMEC)   p. 561 (6D-3)
Posadas, Héctor (University of Cantabria)   p. 425 (5A-4)

Q

Qian, Zhiliang (The Hong Kong University of Science and Technology)   p. 449 (5B-4)
Qiu, Dong (Fudan University)   p. 119 (1D-25)
Qiu, Meikang (University of Kentucky)   p. 743 (8C-4)
Quan, Gang (Florida International University)   p. 135 (2A-3)

R

Radecka, Katarzyna (McGill University)   p. 455 (5C-1)
Ragai, Hani (Ain-Shams University)   p. 176 (2C-2)
Rakhshanfar, Alireza (University of Toronto)   p. 831 (9C-2)
Rawlins, Marisha (University of Florida)   p. 243 (3A-4)
Reddy, Sudhakar M (University of Iowa)   p. 812 (9B-3)
Relles, Jacob (University of California, Riverside)   p. 13 (1A-3)
Ren, Junyan (Fudan University)   p. 115 (1D-23)
Rouby, Alaa El (Mentor Graphics)   p. 176 (2C-2)
Roy, Kaushik (ECE, Purdue University)   p. 695 (8A-4)
Roychowdhury, Jaijeet (University of California, Berkeley)   p. 7 (1A-2)

S

Safarpour, Sean (Vennsa Technologies, Inc.)   p. 306 (3D-4)
Saito, Yoshiki (Keio University)   p. 87 (1D-8)
Sakamoto, Yoshifumi (Global Business Services, IBM Japan)   p. 413 (5A-2)
Sakanushi, Keishi (Osaka University)   p. 551 (6D-1)
Sakurai, Takayasu (University of Tokyo)   p. 109 (1D-19)
Saluja, Kewal K. (University of Wisconsin-Madison)   p. 799 (9B-1)
Santana, Juan (IMEC)   p. 561 (6D-3)
Sapatnekar, Sachin S. (Department of ECE, University of Minnesota)   p. 689 (8A-3)
Sasaki, Masahiro (VLSI Design and Education Center (VDEC), the University of Tokyo)   p. 107 (1D-18)
Sasaki, Nobuo (Hiroshima University)   p. 121 (1D-26)
Sasaki, Takahiro (Mie University)   p. 95 (1D-12)
Sato, Nobuo (Advanced Research Laboratory, Hitachi, Ltd.)   p. 567 (6D-4)
Sato, Takahiro (Tokyo Institute of Technology)   p. 101 (1D-15)
Schneider, Reinhard (Technical University of Munich)   p. 225 (3A-1)
Seki, Naomi (Keio University)   p. 87 (1D-8)
Shang, Li (ECEE Dept., University of Colorado at Boulder)   p. 467 (5C-3)
Shen, Jih-Sheng (National Chung Cheng University)   p. 160 (2B-3)
Sheu, Shyh-Shyuan (Industrial Technology Research Institute)   p. 197 (2D-1)
Shi, Guoyong (Shanghai Jiao Tong University)   p. 19 (1A-4)
Shih, Che-Hua (National Chiao Tung University)   p. 497 (6A-4)
Shimada, Hiromasa (Waseda University)   p. 645 (7D-1)
Shimazawa, Takayoshi (Toshiba Corporation Semiconductor Company)   p. 755 (8D-2)
Shin, Insup (Korea Advanced Institute of Science and Technology)   p. 376 (4C-2)
Shin, Tae-ho (Seoul National University)   p. 165 (2B-4)
Shin, Youngsoo (Korea Advanced Institute of Science and Technology)   p. 190 (2C-4)
Shin, Youngsoo (Korea Advanced Institute of Science and Technology)   p. 376 (4C-2)
Shinkai, Ken-ichi (Osaka University)   p. 683 (8A-2)
Sinkar, Abhishek (University of Wisconsin-Madison)   p. 725 (8C-1)
Sivakumar, Sam (Intel Corporation)   p. 402 (4D-2)
Sridhara, Srinivasa R. (Texas Instruments, Inc.)   p. 556 (6D-2)
Sriram, Mysore (Intel Corporation)   p. 171 (2C-1)
Stuyt, Jan (Holst Centre/IMEC)   p. 267 (3B-4)
Su, Wan-Ting (National Chung Cheng University)   p. 160 (2B-3)
Sun, Guangyu (Pennsylvania State University)   p. 211 (2D-3)
Sun, Jian (State Key Lab of ASIC & System, Microelectronics Department, Fudan University)   p. 515 (6B-3)
Sun, Jian (State Key Lab. of ASIC & System, Microelectronics Department, Fudan University)   p. 793 (9A-4)
Suzuki, Takao (Panasonic Corp.)   p. 749 (8D-1)
Sze, C. N. (IBM Research)   p. 545 (6C-4)

T

Tahoori, Mehdi B. (Karlsruhe Institute of Technology)   p. 317 (4A-1)
Takahashi, Hiroshi (Ehime University)   p. 799 (9B-1)
Takahashi, Masafumi (Toshiba Corporation Semiconductor Company)   p. 755 (8D-2)
Takahashi, Masaru (SoC Software Platform Division, Renesas Electronics Corporation)   p. 766 (8D-4)
Takamiya, Makoto (University of Tokyo)   p. 109 (1D-19)
Takeda, Seidai (University of Tokyo)   p. 87 (1D-8)
Takeuchi, Yoshinori (Osaka University)   p. 551 (6D-1)
Tamamoto, Hideo (Akita University)   p. 818 (9B-4)
Tan, Sheldon X.-D. (University of California, Riverside)   p. 13 (1A-3)
Tang, Kai-Fu (National Taiwan University)   p. 382 (4C-3)
Tang, Wai-Chung (The Chinese University of Hong Kong)   p. 509 (6B-2)
Thiele, Lothar (ETH Zürich)   p. 123 (2A-1)
Thomas, Olivier (LETI)   p. 336 (4A-4)
Torres, Andres (Mentor Graphics Corp.)   p. 775 (9A-1)
Torres, Andres (Mentor Graphics Corporation)   p. 781 (9A-2)
Tsai, Cheng-Chih (Dept. of Electronic Engineering Feng Chia University)   p. 85 (1D-7)
Tsai, Cheng-Chih (Dept. of Electronic Engineering Feng Chia University)   p. 93 (1D-11)
Tsai, Yu-Tzu (Dept. of Electronic Engineering Feng Chia University)   p. 85 (1D-7)
Tsai, Yu-Tzu (Dept. of Electronic Engineering Feng Chia University)   p. 93 (1D-11)
Tsay, Ren-Song (National Tsing Hua University)   p. 533 (6C-2)
Tsui, Chi-Ying (The Hong Kong University of Science and Technology)   p. 449 (5B-4)
Tsuji, Satomi (Advanced Research Laboratory, Hitachi, Ltd.)   p. 567 (6D-4)

U

Umahashi, Yusuke (Shibaura Institute of Technology)   p. 87 (1D-8)
Usami, Kimiyoshi (Shibaura Institute of Technology)   p. 87 (1D-8)

V

van der Meijs, Nick (Delft University of Technology)   p. 61 (1C-3)
Van der Plas, Geert (IMEC)   (9D-1)
Velev, Miroslav N. (Aries Design Automation)   p. 293 (3D-1)
Veneris, Andreas (University of Toronto)   p. 306 (3D-4)
Veneris, Andreas (University of Toronto)   p. 479 (6A-1)
Villar, Eugenio (University of Cantabria)   p. 425 (5A-4)
Visser, Huib (IMEC)   p. 561 (6D-3)
Vullers, Ruud (IMEC)   p. 561 (6D-3)

W

Wakisaka, Yoshihiro (Advanced Research Laboratory, Hitachi, Ltd.)   p. 567 (6D-4)
Wan, Jianghua (National University of Defense Technology)   p. 91 (1D-10)
Wang, Jinn-Shyan (National Chung Cheng University)   p. 73 (1D-1)
Wang, Kan (Tsinghua University)   p. 261 (3B-3)
Wang, Qiang (Xilinx, Inc.)   p. 369 (4C-1)
Wang, Qing (Department of Electrical and Electronic Engineering, the University of Hong Kong)   p. 49 (1C-1)
Wang, Qing (The University of Hong Kong)   p. 55 (1C-2)
Wang, Ting-Chi (National Tsing Hua University)   p. 633 (7C-3)
Wang, Xiang (The University of Hong Kong)   p. 55 (1C-2)
Wang, Xiaobin (Seagate Technology)   p. 25 (1B-1)
Wang, Yan (Institute of Microelectronics, Tsinghua University)   p. 677 (8A-1)
Wang, Ying-Chih (Carnegie Mellon University)   p. 1 (1A-1)
Wang, Yu (Tsinghua University)   p. 43 (1B-4)
Wang, Yu (Tsinghua University)   p. 261 (3B-3)
Wang, Yu (Tsinghua University)   p. 473 (5C-4)
Wang, Zhiyuan (Cisco Systems Inc.)   p. 491 (6A-3)
Williamson, James (ECEE Dept., University of Colorado at Boulder)   p. 467 (5C-3)
Wong, Martin (University of Illinois at Urbana-Champaign)   p. 323 (4A-2)
Wong, Martin D. F. (University of Illinois at Urbana-Champaign)   p. 787 (9A-3)
Wong, Martin D. F. (University of Illinois at Urbana-Champaign)   p. 843 (9C-4)
Wong, Ngai (Department of Electrical and Electronic Engineering, the University of Hong Kong)   p. 49 (1C-1)
Wong, Ngai (The University of Hong Kong)   p. 55 (1C-2)
Wu, Cheng-Wen (Industrial Technology Research Institute)   p. 713 (8B-3)
Wu, Chi-An (National Taiwan University)   p. 382 (4C-3)
Wu, Chuan (Fudan University)   p. 77 (1D-3)
Wu, Jen-Ming (National Tsing Hua University)   p. 105 (1D-17)
Wu, Kuo-Li (National Tsing Hua University)   p. 279 (3C-2)
Wu, Tung-Yeh (The University of Texas at Austin)   p. 615 (7B-4)
Wu, Yu-Liang (The Chinese University of Hong Kong)   p. 509 (6B-2)
Wuu, Jen-Yi (University of California, Santa Barbara)   p. 781 (9A-2)

X

Xiang, Dong (Tsinghua University)   p. 806 (9B-2)
Xie, Yuan (Pennsylvania State University)   p. 31 (1B-2)
Xie, Yuan (Pennsylvania State University)   p. 43 (1B-4)
Xie, Yuan (Pennsylvania State University)   p. 211 (2D-3)
Xie, Yuan (The Pennsylvania State University)   p. 351 (4B-2)
Xiong, Jinjun (IBM Thomas J. Watson Research Center)   p. 249 (3B-1)
Xu, Hui (Shanghai Jiao Tong University)   p. 19 (1A-4)
Xu, Qiang (The Chinese University of Hong Kong)   p. 806 (9B-2)
Xu, Yi (National University of Defense Technology)   p. 91 (1D-10)
Xue, Jason (City University of Hong Kong)   p. 129 (2A-2)

Y

Yan, Tan (Synopsys Inc. & University of Illinois at Urbana-Champaign)   p. 323 (4A-2)
Yang, Chuan-Yue (National Taiwan University)   p. 668 (7D-4)
Yang, Huazhong (Tsinghua University)   p. 43 (1B-4)
Yang, Jae-Seok (University of Texas at Austin)   p. 621 (7C-1)
Yang, Xiaoqing (The Chinese University of Hong Kong)   p. 509 (6B-2)
Yang, Yao-Chang (National Chung Cheng University)   p. 73 (1D-1)
Yano, Kazuo (Advanced Research Laboratory, Hitachi, Ltd.)   p. 567 (6D-4)
Ye, Zuochang (Institute of Microelectronics, Tsinghua University)   p. 677 (8A-1)
Yi, Ting (Fudan University)   p. 119 (1D-25)
Yin, Yu-Fan (National Taiwan University)   p. 297 (3D-2)
Ying, Yan (Fudan University)   p. 77 (1D-3)
Young, Evangeline F. Y. (The Chinese University of Hong Kong)   p. 843 (9C-4)
Yu, Bei (Tsinghua University)   p. 473 (5C-4)
Yu, Hao (Nanyang Technological University)   p. 13 (1A-3)
Yu, Wenjian (Tsinghua University)   p. 67 (1C-4)
Yu, Zhiping (Institute of Microelectronics, Tsinghua University)   p. 677 (8A-1)
Yuan, Yu-Han (National Tsing Hua University)   p. 99 (1D-14)

Z

Zamani, Masoud (Northeastern University)   p. 317 (4A-1)
Zang, Wei (University of Florida)   p. 419 (5A-3)
Zeng, Dajie (Institute of Microelectronics, Tsinghua University)   p. 677 (8A-1)
Zeng, Xiao Yang (Fudan University)   p. 77 (1D-3)
Zeng, Xuan (State Key Lab of ASIC & System, Microelectronics Dept., Fudan University)   p. 467 (5C-3)
Zeng, Xuan (State Key Lab of ASIC & System, Microelectronics Department, Fudan University)   p. 515 (6B-3)
Zeng, Xuan (State Key Lab. of ASIC & System, Microelectronics Department, Fudan University)   p. 521 (6B-4)
Zeng, Xuan (State Key Lab. of ASIC & System, Microelectronics Department, Fudan University)   p. 793 (9A-4)
Zhan, Chenchang (Hong Kong University of Science and Technology)   p. 117 (1D-24)
Zhang, Hongbo (University of Illinois at Urbana-Champaign)   p. 787 (9A-3)
Zhang, Lei (Institute of Computing Technology, Chinese Academy of Sciences)   p. 357 (4B-3)
Zhang, Lei (Institute of Computing Technology, Chinese Academy of Sciences)   p. 437 (5B-2)
Zhang, Tiefei (Zhejiang University)   p. 668 (7D-4)
Zhang, Wangyang (Carnegie Mellon University)   p. 67 (1C-4)
Zhang, Xin (University of Tokyo)   p. 109 (1D-19)
Zhang, Zheng (Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology)   p. 49 (1C-1)
Zhang, Zheng (The University of Hong Kong)   p. 55 (1C-2)
Zhao, Kang (Tsinghua University)   p. 639 (7C-4)
Zhao, Lei (Keio University)   p. 87 (1D-8)
Zhao, Xin (Georgia Institute of Technology)   p. 621 (7C-1)
Zheng, Ji (Apache Design Solutions)   (5D-1)
Zhi, Yanling (State Key Lab. of ASIC & System, Microelectronics Department, Fudan University)   p. 521 (6B-4)
Zhou, Hai (EECS Dept., Northwestern University)   p. 467 (5C-3)
Zhou, Hai (Electrical Engineering and Computer Science Department, Northwestern University)   p. 515 (6B-3)
Zhou, Hai (Department of Electrical Engineering and Computer Science, Northwestern University)   p. 521 (6B-4)
Zhou, Hai (EECS Dept., Northwestern University)   p. 793 (9A-4)
Zhou, Jun (Holst Centre/IMEC)   p. 267 (3B-4)
Zhu, Jianwen (University of Toronto)   p. 461 (5C-2)
Zilic, Zeljko (McGill University)   p. 455 (5C-1)
Zimmermann, Roger (School of Computing, National University of Singapore)   p. 237 (3A-3)
Zolotov, Vladimir (IBM Thomas J. Watson Research Center)   p. 249 (3B-1)
Zou, Yong (Colorado State University)   p. 443 (5B-3)
Zuliani, Paolo (Carnegie Mellon University)   p. 1 (1A-1)